CHUNGCHEONGBUK-DO
South Korea
19
2022-05-26
17
2024-10-22
These are the the leading inventors for applications assigned to NEPES CO., LTD.:
NEPES CO., LTD. based in CHUNGCHEONGBUK-DO, KR has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:
Semiconductor package and method for manufacturing the same
#2 | 2022-05-12 ✅ Patent 12,183,704 granted on 2024-12-31Semiconductor package and method for manufacturing the same
#3 | 2021-12-23 ✅ Patent 12,198,997 granted on 2025-01-14Semiconductor package comprising first molding layer and second molding layer with different thermal expansion coefficients
#4 | 2021-11-04 ✅ Patent 12,205,904 granted on 2025-01-21Wafer-level design and wiring pattern for a semiconductor package
#5 | 2021-03-04 ✅ Patent 11,404,347 granted on 2022-08-02Semiconductor package
#6 | 2020-08-27SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
#7 | 2020-06-25 ✅ Patent 11,276,632 granted on 2022-03-15Semiconductor package
#8 | 2019-12-12 ✅ Patent 10,964,656 granted on 2021-03-30Semiconductor package and method of manufacturing same
#9 | 2019-10-31 ✅ Patent 10,804,146 granted on 2020-10-13Method for producing semiconductor package
#10 | 2019-07-25 ✅ Patent 11,011,502 granted on 2021-05-18Semiconductor package
#11 | 2019-04-25 ✅ Patent 11,450,535 granted on 2022-09-20Manufacturing method for semiconductor package including filling member and membrane member
#12 | 2017-11-16 ✅ Patent 10,381,312 granted on 2019-08-13Semiconductor package and method of manufacturing the same
#13 | 2016-10-06SYSTEM IN PACKAGE AND METHOD FOR MANUFACTURING THE SAME
#14 | 2016-06-30 ✅ Patent 9,793,251 granted on 2017-10-17Semiconductor package and manufacturing method thereof
#15 | 2016-04-07 ✅ Patent 9,653,397 granted on 2017-05-16Semiconductor package and method of manufacturing the same
#16 | 2015-07-02 ✅ Patent 9,502,391 granted on 2016-11-22Semiconductor package, fabrication method therefor, and package-on package
#17 | 2011-11-17 ✅ Patent 8,759,436 granted on 2014-06-24Transparent color coating composition containing nanosize dispersed pigments, coated substrate and method for preparing same
#18 | 2007-04-19 ✅ Patent 7,491,572 granted on 2009-02-17Method for fabricating an image sensor mounted by mass reflow
#19 | 2005-10-13 ✅ Patent 7,170,170 granted on 2007-01-30Bump for semiconductor package, semiconductor package applying the bump, and method for fabricating the semiconductor package
Also check out NEPES CO., LTD.'s (Chungcheongbuk-do, South Korea) applicant profile with 15 patent applications submitted.
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