Changwon-si
South Korea
31
2024-02-01
30
2025-03-11
These are the the leading inventors for applications assigned to HAESUNG DS CO., LTD:
HAESUNG DS CO., LTD based in Changwon-si, KR has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:
Pre-mold substrate and method of manufacturing pre-mold substrate
#2 | 2022-03-17 ✅ Patent 12,104,964 granted on 2024-10-01Sensor package and sensor package module including the same
#3 | 2022-01-20 ✅ Patent 12,308,899 granted on 2025-05-20Composite coil pattern for wireless charging and magnetic secure transmission
#4 | 2021-12-09 ✅ Patent 11,674,890 granted on 2023-06-13Saw based optical sensor device and package including the same
#5 | 2021-07-15 ✅ Patent 11,854,830 granted on 2023-12-26Method of manufacturing circuit board
#6 | 2021-02-25 ✅ Patent 11,139,220 granted on 2021-10-05Flexible semiconductor package formed by roll-to-roll process
#7 | 2020-12-31 ✅ Patent 11,876,012 granted on 2024-01-16Method of manufacturing semiconductor package substrate and semiconductor package substrate manufactured using the same
#8 | 2020-07-16 ✅ Patent 10,840,170 granted on 2020-11-17Semiconductor package substrate and method for manufacturing same
#9 | 2020-05-28 ✅ Patent 10,840,161 granted on 2020-11-17Method for manufacturing semiconductor package substrate
#10 | 2020-04-30ELECTRIC WIRE STRUCTURE AND METHOD OF MANUFACTURING THEREOF
#11 | 2020-01-23 ✅ Patent 10,749,066 granted on 2020-08-18Proximity sensor having substrate including light sensing area and temperature sensing area
#12 | 2019-12-19 ✅ Patent 10,714,231 granted on 2020-07-14Graphene wire, cable employing the same, and method of manufacturing the same
#13 | 2019-11-21 ✅ Patent 10,942,070 granted on 2021-03-09Sensor unit, temperature sensor including the same, method of manufacturing the sensor unit, and method of manufacturing the temperature sensor
#14 | 2019-11-07 ✅ Patent 11,209,323 granted on 2021-12-28Sensor package with reduced height cavity walls and sensor package module including the same
#15 | 2019-10-10 ✅ Patent 11,112,352 granted on 2021-09-07Saw based optical sensor device and package including the same
#16 | 2019-08-29 ✅ Patent 10,910,299 granted on 2021-02-02Method of manufacturing semiconductor package substrate and semiconductor package substrate manufactured using the method, and method of manufacturing semiconductor package and semiconductor package manufactured using the method
#17 | 2019-05-02 ✅ Patent 10,641,679 granted on 2020-05-05Leakage detection system and leakage detection method
#18 | 2019-04-25 ✅ Patent 10,643,933 granted on 2020-05-05Semiconductor package substrate and manufacturing method therefor
#19 | 2019-03-07 ✅ Patent 10,882,748 granted on 2021-01-05Graphene synthesis apparatus and graphene synthesis method using the same
#20 | 2019-02-28 ✅ Patent 10,811,302 granted on 2020-10-20Method of manufacturing semiconductor package substrate and semiconductor package substrate manufactured using the same
#21 | 2019-02-21 ✅ Patent 10,643,932 granted on 2020-05-05Semiconductor package substrate and method for manufacturing same
#22 | 2018-06-21 ✅ Patent 10,739,205 granted on 2020-08-11Temperature sensor patch and adhesive type thermometer including the same
#23 | 2015-09-24 ✅ Patent 10,196,367 granted on 2019-02-05Bleed-out preventing agent, composition for preventing bleed-out including the same, and method of preventing bleed-out
#24 | 2015-07-09 ✅ Patent 9,460,986 granted on 2016-10-04Method of manufacturing semiconductor package substrate with limited use of film resist and semiconductor package substrate manufactured using the same
#25 | 2014-11-06 ✅ Patent 9,299,588 granted on 2016-03-29Method of manufacturing lead frame
#26 | 2014-10-30 ✅ Patent 9,142,495 granted on 2015-09-22Lead frame and semiconductor package manufactured by using the same
#27 | 2014-09-11 ✅ Patent 9,171,789 granted on 2015-10-27Lead frame, semiconductor package including the lead frame, and method of manufacturing the lead frame
#28 | 2014-05-29 ✅ Patent 9,671,352 granted on 2017-06-06Reel-to-reel inspection apparatus and inspection method using the same
#29 | 2014-04-24 ✅ Patent 9,257,310 granted on 2016-02-09Method of manufacturing circuit board and chip package and circuit board manufactured by using the method
#30 | 2013-11-28 ✅ Patent 9,173,300 granted on 2015-10-27Method of manufacturing printed circuit board
#31 | 2013-06-27 ✅ Patent 9,532,466 granted on 2016-12-27Method of manufacturing multi-layer circuit board and multi-layer circuit board manufactured by using the method
Also check out HAESUNG DS CO., LTD.'s (Changwon-si, South Korea) applicant profile with 28 patent applications submitted.
95498 ⎘