Osaka
Japan
10
2016-01-28
10
2017-11-07
These are the the leading inventors for applications assigned to LIHIT LAB., INC.:
LIHIT LAB., INC. based in Osaka, JP has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:
Binding device
#2 | 2015-09-10 ✅ Patent 9,776,451 granted on 2017-10-03Binding device
#3 | 2010-11-04 ✅ Patent 8,500,356 granted on 2013-08-06Binding device
#4 | 2010-02-11 ✅ Patent 8,602,672 granted on 2013-12-10Binding device
#5 | 2009-11-12 ✅ Patent 8,545,122 granted on 2013-10-01Binding device
#6 | 2009-03-12 ✅ Patent 7,874,758 granted on 2011-01-25Binding device
#7 | 2009-03-05 ✅ Patent 8,172,269 granted on 2012-05-08File including a curved retaining portion enabling an edge of a binding body to curve
#8 | 2009-02-26 ✅ Patent 7,758,273 granted on 2010-07-20Binding device for files and binders
#9 | 2009-02-26 ✅ Patent 7,758,272 granted on 2010-07-20Binding device for files and binders
#10 | 2006-07-13 ✅ Patent 7,478,963 granted on 2009-01-20Binding device
Also check out LIHIT LAB., INC.'s (Osaka, Japan) applicant profile with 2 patent applications submitted.
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