HEATFLOW TECHNOLOGIES INC.

City:

Seattle, Washington

Country:

United States

Published Applications:

Last publication date:

2015-09-10

Patent Grants:

Last grant date:

2015-05-26

Top Inventors for applications by HEATFLOW TECHNOLOGIES INC.

These are the the leading inventors for applications assigned to HEATFLOW TECHNOLOGIES INC.:

Warren L. Dinges 5 Seattle, WA United States

Recent patent applications by HEATFLOW TECHNOLOGIES INC.

HEATFLOW TECHNOLOGIES INC. based in Seattle, US has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:

#1 | 2015-09-10

US20150253201A1

Physics

SAMPLE CONTAINER WITH SENSOR RECEPTABLE AND METHODS OF USE

#2 | 2013-08-01 ✅ Patent 9,040,000 granted on 2015-05-26

US20130195139A1

Physics

Sample container with sensor receptacle and methods of use

#3 | 2012-10-18 ✅ Patent 9,849,458 granted on 2017-12-26

US20120264203A1

Performing operations; transporting

Heat flow polymerase chain reaction systems and methods

#4 | 2012-06-28 ✅ Patent 8,415,104 granted on 2013-04-09

US20120164655A1

Performing operations; transporting

Heat flow polymerase chain reaction systems and methods

#5 | 2009-09-03 ✅ Patent 8,153,374 granted on 2012-04-10

US20090220984A1

Performing operations; transporting

Heat flow polymerase chain reaction methods

AssigneeID:

98371 ⎘