MATERIALS ENGINEERING AND PACKAGING, LLC

City:

St. Louis, Missouri

Country:

United States

Published Applications:

Last publication date:

2015-09-10

Patent Grants:

Last grant date:

2016-10-18

Top Inventors for applications by MATERIALS ENGINEERING AND PACKAGING, LLC

These are the the leading inventors for applications assigned to MATERIALS ENGINEERING AND PACKAGING, LLC:

Hanlin Wan 1 St. Louis, MO United States
Parag J. Parikh 1 St. Louis, MO United States

Recent patent applications by MATERIALS ENGINEERING AND PACKAGING, LLC

MATERIALS ENGINEERING AND PACKAGING, LLC based in St. Louis, US has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:

#1 | 2015-09-10 ✅ Patent 9,471,985 granted on 2016-10-18

US20150254859A1

Physics

Template-less method for arbitrary radiopaque object tracking in dynamic imaging

Also check out MATERIALS ENGINEERING AND PACKAGING, LLC's (St. Louis, United States) applicant profile with 1 patent applications submitted.

AssigneeID:

98431 ⎘