Tokyo
Japan
4
2015-09-17
4
2019-01-29
These are the the leading inventors for applications assigned to Nihon Handa Co., Ltd.:
Nihon Handa Co., Ltd. based in Tokyo, JP has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:
Solder alloy for die bonding
#2 | 2015-07-23 ✅ Patent 9,301,403 granted on 2016-03-29Method of soldering electronic part
#3 | 2012-01-26 ✅ Patent 8,968,488 granted on 2015-03-03Cream solder and method of soldering electronic part
#4 | 2009-09-24 ✅ Patent 7,766,218 granted on 2010-08-03Pasty silver particle composition, process for producing solid silver, solid silver, joining method, and process for producing printed wiring board
Also check out Nihon Handa Co., Ltd.'s (Tokyo, Japan) applicant profile with 2 patent applications submitted.
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