Patents-Review.com
ClassID:

42083 ⎘

B23D57/0023 - CPC Classification

Classification description:

Sawing machines or sawing devices not covered by one of the preceding groups  -  using saw wires with a plurality of saw wires or saw wires having plural cutting zones

Recent Application in this class:
#1
20250025951
2025-01-23

SYSTEMS AND METHODS FOR CONTROLLING WAFER BREAKAGE DURING INGOT SLICING OPERATIONS

 #2
20230278118
2023-09-07

Method for separating a plurality of slices from workpieces by means of a wire saw during a sequence of separation processes

 #3
20230234149
2023-07-27

Method for separating a plurality of slices from workpieces by means of a wire saw during a sequence of separation processes

 #4
20230226629
2023-07-20

METHOD FOR SEPARATING A PLURALITY OF SLICES FROM WORKPIECES BY MEANS OF A WIRE SAW DURING A SEQUENCE OF SEPARATION PROCESSES

 #5
20230078101
2023-03-16

A METHOD FOR CUTTING A SHELL-TYPE OBJECT, A CUTTER SYSTEM AND A VESSEL EQUIPPED WITH THE CUTTER SYSTEM

 #6
20210348510
2021-11-11

Wire saw excavation apparatus capable of changing cutting line in accordance with cutting section and tunnel excavation method using same

 #7
20200316817
2020-10-08

METHOD AND APPARATUS FOR RESUMING THE WIRE SAWING PROCESS OF A WORKPIECE AFTER AN UNPLANNED INTERRUPTION

 #8
20190270222
2019-09-05

Methods and system for controlling a surface profile of a wafer

 #9
20190232404
2019-08-01

Metal wire, saw wire, cutting apparatus, and method of manufacturing metal wire

 #10
20180056545
2018-03-01

Methods and system for controlling a surface profile of a wafer

 #11
20150314484
2015-11-05

Method for simultaneously cutting a multiplicity of slices of particularly uniform thickness from a workpiece

 #12
20150314468
2015-11-05

Articulating band saw and method

 #13
20150283727
2015-10-08

Method for slicing wafers from a workpiece using a sawing wire

 #14
20150083104
2015-03-26

Method for simultaneously cutting a multiplicity of wafers from a workpiece

 #15
20140295126
2014-10-02

Method for slicing semiconductor single crystal ingot

 #16
20140144420
2014-05-29

Method for resuming a wire sawing process of a workpiece after an unplanned interruption

 #17
20130175242
2013-07-11

Magnetic shape optimization

 #18
20130043218
2013-02-21

MULTI-WIRE CUTTING FOR EFFICIENT MAGNET MACHINING

 #19
20120298091
2012-11-29

Wire saw with tension detecting means and guide roller speed control

 #20
20120272943
2012-11-01

DIAMOND WIRE SAW DEVICE

 #21
20120048255
2012-03-01

WIRE SAW

 #22
20110316038
2011-12-29

Substrate comprising aluminum/graphite composite, heat dissipation part comprising same, and LED luminescent member

 #23
20110138983
2011-06-16

Articulating band saw and method

 #24
20110132345
2011-06-09

WIRE SAW DEVICE AND METHOD FOR OPERATING SAME

 #25
20110120441
2011-05-26

WIRE SAWING DEVICE

 #26
20100212650
2010-08-26

Cutting machine for blocks of natural stone and similar into slabs with diamond wires

 #27
20100163009
2010-07-01

Multi-wire saw and method for cutting ingot

 #28
20100043769
2010-02-25

Wire saw and method for producing a wire saw

 #29
20090288651
2009-11-26

Multiwire sawing machine for the cutting of material in block form

 #30
20080257329
2008-10-23

Multiware sawing machine for the cutting of material in block form

 #31
20070283944
2007-12-13

Abrasive wire sawing

 #32
20070251516
2007-11-01

Precision slicing of large work pieces