SYSTEM AND METHOD OF THINNING WAFER SUBSTRATE

HYBRID ELECTROCHEMICAL AND ABRASIVE FLUID POLISHING

AN ELECTRICAL MACHINING DEVICE

Downhole tool

ANODIC OXIDATION-ASSISTED GRINDING APPARATUS AND ANODIC OXIDATION-ASSISTED GRINDING METHOD

ELECTROLYSIS AND GRINDING COMBINED MACHINING DEVICE AND METHOD

Downhole tool

Probe forming device

Precision electrochemical machine for gear manufacture

Advanced herringbone gear design

Grind machining apparatus

Machine for machining gear teeth and gear teeth machining method

Method and apparatus for polishing metal parts with complex geometries

Method and apparatus for pulsed electrochemical grinding

High-frequency-vibration-assisted electrolytic grinding method and device therefor

Machine for machining gear teeth and gear teeth machining method

Observation and photography apparatus

Method and apparatus for simultaneously removing multiple conductive materials from microelectronic substrates

Electrochemical grinding tool and method

Electrically assisted chemical-mechanical planarization (EACMP) system and method thereof

Grinding/electrolysis combined multi-wire-slicing processing method for silicon wafers

Device, apparatus, and method for abrasive electrochemical finishing

Electrochemical planarization system comprising enhanced electrolyte flow

ELECTROCHEMICAL GRINDING ELECTRODE, AND APPARATUS AND METHOD USING THE SAME

Conductive polishing pad and method for making the same

METHOD AND COMPOSITION FOR ELECTRO-CHEMICAL-MECHANICAL POLISHING

Method for selectively removing conductive material from a microelectronic substrate

Methods and apparatus for electromechanically and/or electrochemically-mechanically removing conductive material from a microelectronic substrate

Method for electrochemical mechanical polishing

Topography reduction and control by selective accelerator removal

Topography reduction and control by selective accelerator removal

METHODS AND SYSTEMS FOR REMOVING MATERIALS FROM MICROFEATURE WORKPIECES WITH ORGANIC AND/OR NON-AQUEOUS ELECTROLYTIC MEDIA

Methods of planarization and electro-chemical mechanical polishing processes

Electrolytic Processing Method and Electrolytic Processing Apparatus

Pad for electrochemical processing

Electrolytic polishing method of substrate

Electrochemical polishing method and polishing method

CONDUCTIVE POLISHING ARTICLE FOR ELECTROCHEMICAL MECHANICAL POLISHING

Electrochemical mechanical polishing method and electrochemical mechanical polishing apparatus

Apparatus and method of electrolytic removal of metals from a wafer surface

TEMPERATURE CONTROL FOR ECMP PROCESS

Electrolyte retaining on a rotating platen by directional air flow

METHOD AND COMPOSITION FOR POLISHING A SUBSTRATE

System and method for removing particles from a polishing pad

METHOD AND PAD DESIGN FOR THE REMOVAL OF BARRIER MATERIAL BY ELECTROCHEMICAL MECHANICAL PROCESSING

Apparatus and method for hybrid machining a workpiece

Method and apparatus for improved chemical mechanical planarization pad with pressure control and process monitor

PAD ASSEMBLIES FOR ELECTROCHEMICALLY ASSISTED PLANARIZATION

Extended pad life for ECMP and barrier removal

Electrolytic processing unit device, and method for electrolytic processing, washing, and drying

Electropolishing metal features on a semiconductor wafer

Electrolytic Processing Apparatus

Electrochemical mechanical polishing apparatus conditioning method, and conditioning solution

Method and system for pad conditioning in an ECMP process

Method and system for point of use recycling of ECMP fluids

Electro-method and apparatus for improved chemical mechanical planarization pad with uniform polish performance

CONDUCTIVE POLISHING ARTICLE FOR ELECTROCHEMICAL MECHANICAL POLISHING

PLATEN ASSEMBLY FOR ELECTROCHEMICAL MECHANICAL PROCESSING

Conductive Polishing Article for Electrochemical Mechanical Polishing

Electropolishing system and process

Electrolytic liquid for electrolytic polishing and electrolytic polishing method

Endpoint for electroprocessing

ELECTROPROCESSING PROFILE CONTROL

Electroprocessing profile control

METHOD AND APPARATUS FOR SIMULTANEOUSLY REMOVING MULTIPLE CONDUCTIVE MATERIALS FROM MICROELECTRONIC SUBSTRATES

RETAINING RING WITH CONDUCTIVE PORTION

APPARATUS FOR ELECTROPROCESSING A SUBSTRATE WITH EDGE PROFILE CONTROL

Conductive polishing article for electrochemical mechanical polishing

PROCESS CONTROL IN ELECTRO-CHEMICAL MECHANICAL POLISHING

Method and apparatus for electroprocessing a substrate with edge profile control

EDM wire

Electrolyte retaining on a rotating platen by directional air flow

ABRASIVE COMPOSITION FOR ELECTROCHEMICAL MECHANICAL POLISHING

Method and apparatus for electrochemical mechanical polishing of cu with higher liner velocity for better surface finish and higher removal rate during clearance

Planarization of substrates at a high polishing rate using electrochemical mechanical polishing

Polishing method that suppresses hillock formation

Process for high copper removal rate with good planarization and surface finish

Removal profile tuning by adjusting conditioning sweep profile on a conductive pad

Temperature control for ECMP process

ELECTROPOLISH ASSISTED ELECTROCHEMICAL MECHANICAL POLISHING APPARATUS

SOFT CONDUCTIVE POLYMER PROCESSING PAD AND METHOD FOR FABRICATING THE SAME

Methods and apparatus for electroprocessing with recessed bias contact

Method and apparatus for evaluating polishing pad conditioning

Polishing apparatus and polishing method

Method for electrochemically polishing a conductive material on a substrate

Electrolytic processing apparatus and electrolytic processing method

Electrode and pad assembly for processing conductive layers

Method and apparatus for foam removal in an electrochemical mechanical substrate polishing process

Electrolytic processing apparatus and substrate processing apparatus and method

Planarization with reduced dishing

Method for electrochemically mechanically polishing a conductive material on a substrate

Methods for electrochemical processing with pre-biased cells

Electrochemical processing with dynamic process control

Fully conductive pad for electrochemical mechanical processing

Apparatus and a method for electrochemical mechanical processing with fluid flow assist elements

Substrate polishing with surface pretreatment

PROCESS AND COMPOSITION FOR PASSIVATING A SUBSTRATE DURING ELECTROCHEMICAL MECHANICAL POLISHING

MEANS TO IMPROVE CENTER TO EDGE UNIFORMITY OF ELECTROCHEMICAL MECHANICAL PROCESSING OF WORKPIECE SURFACE

Method and apparatus for planarizing a substrate with low fluid consumption

Controlling removal rate uniformity of an electropolishing process in integrated circuit fabrication

Controlling removal rate uniformity of an electropolishing process in integrated circuit fabrication

Methods and apparatus for electromechanically and/or electrochemically-mechanically removing conductive material from a microelectronic substrate

Pad assembly for electrochemical mechanical polishing

VOLTAGE MODE CURRENT CONTROL

Method and composition for electrochemically polishing a conductive material on a substrate

BALL CONTACT COVER FOR COPPER LOSS REDUCTION AND SPIKE REDUCTION

Electrochemical method for Ecmp polishing pad conditioning

Contact assembly cleaning in an electrochemical mechanical processing apparatus

Perforation and grooving for polishing articles

Control system for multi-layer chemical mechanical polishing process and control method for the same

METHOD FOR STABILIZED POLISHING PROCESS

Membrane-mediated electropolishing

Apparatus adapted for membrane-mediated electropolishing

Methods and apparatus for selectively removing conductive material from a microelectronic substrate

Surface treating method and surface-treating apparatus

Electrolytic processing apparatus and method

Electrolytic processing method

Pad assembly for electrochemical mechanical processing

Substrate processing method and substrate processing apparatus

Solution for electrochemical mechanical polishing

Controlled electrochemical polishing method

Membrane-mediated electropolishing with topographically patterned membranes

Full sequence metal and barrier layer electrochemical mechanical processing

Image sensor system for monitoring condition of electrode for electrochemical process tools

Electrolytic microfinishing of metallic workpieces

Methods and apparatus for electrically detecting characteristics of a microelectronic substrate and/or polishing medium

Process and composition for electrochemical mechanical polishing

Process and composition for electrochemical mechanical polishing

Algorithm for real-time process control of electro-polishing

Methods and apparatus for electrical, mechanical and/or chemical removal of conductive material from a microelectronic substrate

Substrate processing apparatus and substrate processing method

Contacts for electrochemical processing

Process control in electrochemically assisted planarization

Semiconductor processing methods of removing conductive material

Abrasive Electrolyte

Perforation and grooving for polishing articles

Methods and apparatus for removing conductive material from a microelectronic substrate

Tribo-chronoamperometry as a tool for CMP application

Tungsten electroprocessing

Methods and apparatus for removing conductive material from a microelectronic substrate

Sliding flexible electrical contact for electrochemical processing

Method and composition for polishing a substrate

Electroprocessing profile control

Method and composition for electro-chemical-mechanical polishing

Algorithm for real-time process control of electro-polishing

Pad for electrochemical processing

Pad assembly for electrochemical mechanical processing

Electrochemical machining device and electrochemical machining method

Means to eliminate bubble entrapment during electrochemical processing of workpiece surface

Method and apparatus for nozzle type ELID grinding

Planarization with reduced dishing

Method and composition for electrochemical mechanical polishing processing

Method and apparatus for electrochemical planarization of a workpiece

Conductive pad design modification for better wafer-pad contact

Electropolishing electrolyte and method for planarizing a metal layer using the same

Pad design for electrochemical mechanical polishing

Method and apparatus for polishing an internal surface of an aluminum extrusion hollow shape

Full sequence metal and barrier layer electrochemical mechanical processing

Method and apparatus for reduced wear polishing pad conditioning

Methods and systems for removing materials from microfeature workpieces with organic and/or non-aqueous electrolytic media

Contact assembly and method for electrochemical mechanical processing

Abrasive conductive polishing article for electrochemical mechanical polishing

Method and composition for polishing a substrate

System and method for electrochemical mechanical polishing

Methods and apparatuses for semiconductor fabrication utilizing through-wafer interconnects

Conductive polishing article for electrochemical mechanical polishing

Retaining ring with conductive portion

Polishing pad and polishing method

Method of making rolling electrical contact to wafer front surface

Polishing pad for electrochemical mechanical polishing

Adaptive electropolishing using thickness measurement and removal of barrier and sacrificial layers

Method and composition for polishing a substrate

Method for electrochemically processing a workpiece

Method for manufacturing semiconductor device and apparatus for manufacturing thereof

Process and composition for conductive material removal by electrochemical mechanical polishing

Electrochemical planarization system and method of electrochemical planarization

Chemical mechanical polishing retaining ring, apparatuses and methods incorporating same

Conductive pad with high abrasion

Process control in electrochemically assisted planarization

Endpoint system for electro-chemical mechanical polishing

Method for working nut screw for ball screw

Edge bead removal by an electro polishing process

Electrolytic processing apparatus and electrolytic processing method

Electrolyte with good planarization capability, high removal rate and smooth surface finish for electrochemically controlled copper CMP

Electroetching process and system

Electroetching methods and systems using chemical and mechanical influence

Conductive polishing article for electrochemical mechanical polishing

Electrolytic processing apparatus and method

System and method for applying constant pressure during electroplating and electropolishing

Multi-layer polishing pad

Methods and apparatus for polishing a substrate

Abrasive electrolyte

Electropolishing pad

Endpoint for electrochemical processing

Endpoint compensation in electroprocessing

Methods and apparatus for removing conductive material from a microelectronic substrate

Methods and apparatus for removing conductive material from a microelectronic substrate

Planarization of substrates using electrochemical mechanical polishing

Electrolytic processing apparatus and method

Polishing apparatus

Methods and apparatus for electrically and/or chemically-mechanically removing conductive material from a microelectronic substrate

Methods and apparatus for electrically and/or chemically-mechanically removing conductive material from a microelectronic substrate

Apparatus for bonding substrates and method for bonding substrates

Method and apparatus for simultaneously removing multiple conductive materials from microelectronic substrates

Systems and methods for the electrolytic removal of metals from substrates

Electrochemical mechanical processing apparatus

Method and apparatus for the electrochemical deposition and planarization of a material on a workpiece surface

Method and apparatus for electrochemical mechanical processing

Method for processing probe