Patents-Review.com
ClassID:

42672 ⎘

B23H5/10 - CPC Classification

Classification description:

Combined machining Electrodes specially adapted therefor or their manufacture

Recent Application in this class:
#1
20250018486
2025-01-16

SYSTEM AND METHOD OF THINNING WAFER SUBSTRATE

 #2
20230321740
2023-10-12

Electrochemical discharge-assisted micro-grinding device for micro-components of brittle and hard materials

 #3
20210387274
2021-12-16

ELECTROLYSIS AND GRINDING COMBINED MACHINING DEVICE AND METHOD

 #4
20130075274
2013-03-28

Grinding/electrolysis combined multi-wire-slicing processing method for silicon wafers

 #5
20100270168
2010-10-28

Method for removing material from a component, and electrode

 #6
20100126877
2010-05-27

ELECTROCHEMICAL GRINDING ELECTRODE, AND APPARATUS AND METHOD USING THE SAME

 #7
20090020509
2009-01-22

Apparatus and method for hybrid machining a contoured, thin-walled workpiece

 #8
20080156657
2008-07-03

CONDUCTIVE POLISHING ARTICLE FOR ELECTROCHEMICAL MECHANICAL POLISHING

 #9
20080108288
2008-05-08

Conductive Polishing Article for Electrochemical Mechanical Polishing

 #10
20080026681
2008-01-31

Conductive polishing article for electrochemical mechanical polishing

 #11
20070111638
2007-05-17

Pad assembly for electrochemical mechanical polishing

 #12
20070034506
2007-02-15

Pad assembly for electrochemical mechanical processing

 #13
20060148381
2006-07-06

Pad assembly for electrochemical mechanical processing

 #14
20050284770
2005-12-29

Conductive polishing article for electrochemical mechanical polishing

 #15
20050133363
2005-06-23

Conductive polishing article for electrochemical mechanical polishing

 #16
20050000801
2005-01-06

Method and apparatus for electrochemical mechanical processing