Patents-Review.com
ClassID:

42757 ⎘

B23K1/08 - CPC Classification

Classification description:

Soldering, e.g. brazing, or unsoldering Soldering by means of dipping in molten solder

Sub-classes:
Recent Application in this class:
#1
20260001173
2026-01-01

Solder Supply Method

 #2
20240274326
2024-08-15

Lamination structure of second generation high-temperature superconducting (2G-HTS) tape and method for fabricating the same

 #3
20240051051
2024-02-15

ULTRA-THIN SOLDERING GASKET AND PREPARATION METHOD THEREFOR, SOLDERING METHOD, AND SEMICONDUCTOR DEVICE

 #4
20230241700
2023-08-03

Prevention of dripping of material for material injection

 #5
20230095943
2023-03-30

METHOD FOR SELECTIVELY PRETINNING A GUIDEWIRE CORE

 #6
20220226618
2022-07-21

MOLD FOR FORMING SOLDER DISTAL TIP FOR GUIDEWIRE

 #7
20220193805
2022-06-23

Prevention of dripping of material for material injection

 #8
20220142254
2022-05-12

Aerosol provision device

 #9
20210276061
2021-09-09

Method for the manufacture of insoluble lead anodes, used in electrowinning or electro-refining processes of high purity metals

 #10
20210220936
2021-07-22

High-efficiency soldering apparatus for winding head of flat-wire motor and soldering process

 #11
20210128884
2021-05-06

Mold for forming solder distal tip for guidewire

 #12
20200361013
2020-11-19

Prevention of dripping of material for material injection

 #13
20200346293
2020-11-05

PERIPHERAL COATING PROCESS OF THE COPPER CONDUCTIVE BAR FOR THE MANUFACTURE OF ANODES, USED IN THE PROCESSES OF ELECTRO-OBTAINING OR ELECTRO-REFINING OF METALS

 #14
20200254550
2020-08-13

Method and system for tin immersion and soldering of core wire

 #15
20200254549
2020-08-13

Soldering method and soldering apparatus

 #16
20200122258
2020-04-23

Method for selectively pretinning a guidewire core

 #17
20200094339
2020-03-26

Wire automatic soldering system

 #18
20190376161
2019-12-12

Cu Core Ball, Solder Joint, Solder Paste and Formed Solder

 #19
20190176256
2019-06-13

Soldering device

 #20
20190140365
2019-05-09

Electrical connector and manufacturing method thereof

 #21
20180236581
2018-08-23

Method for selectively pretinning a guidewire core

 #22
20180021896
2018-01-25

LEAD-FREE SOLDER COMPOSITION

 #23
20180001408
2018-01-04

Flux applying apparatus

 #24
20170311453
2017-10-26

Soldering device

 #25
20170066072
2017-03-09

Viscous fluid coating device

 #26
20160346878
2016-12-01

Liquid coating device

 #27
20160309600
2016-10-20

In-vehicle electronic module

 #28
20160290952
2016-10-06

Method for manufacturing a biological fluid sensor

 #29
20160184914
2016-06-30

Device for soldering electrical or electronic components

 #30
20160044795
2016-02-11

Soldering device, soldering method, and substrate and electronic component produced by the soldering device or the soldering method

 #31
20160039032
2016-02-11

Solder application method and apparatus

 #32
20150327360
2015-11-12

Mounting carrier and method of mounting a mounting carrier on a connecting carrier

 #33
20150298233
2015-10-22

Method and soldering device for selective soldering with at least one solder nozzle and another functional element which are moved synchronously by a movement device

 #34
20150273634
2015-10-01

Method and apparatus for improving selective soldering

 #35
20150174678
2015-06-25

Device for coating thin molten solder film, thin solder film-covered component and manufacturing method therefor

 #36
20150108205
2015-04-23

Soldering method

 #37
20140212678
2014-07-31

Soldering device, soldering method, and substrate and electronic component produced by the soldering device or the soldering method

 #38
20140126956
2014-05-08

Solder joint structure and solder joining method

 #39
20140034716
2014-02-06

Hot bar soldering

 #40
20120325899
2012-12-27

Dross removal

 #41
20110036899
2011-02-17

MODULAR SOLDERING APPARATUS

 #42
20100273022
2010-10-28

Dual additive soldering

 #43
20100264197
2010-10-21

Soldering apparatus and method

 #44
20100147930
2010-06-17

Dross Removal

 #45
20100001046
2010-01-07

Selective soldering bath

 #46
20090289102
2009-11-26

Replenished lead-free solder and a control method for copper density and nickel density in a solder dipping bath

 #47
20090261147
2009-10-22

Dross Removal

 #48
20090236402
2009-09-24

Soldering machine comprising a soldering module and at least one soldering station that is mobile and exchangeable insertable into the soldering module

 #49
20080190552
2008-08-14

Method For Soldering Composite Material Parts

 #50
20080176096
2008-07-24

Solderable layer and a method for manufacturing the same

 #51
20080090311
2008-04-17

DIPPING DETECTING DEVICE FOR FABRICATING A SEMICONDUCTOR DEVICE

 #52
20070251410
2007-11-01

Method For Reducing Metal Oxide Powder And Attaching It To A Heat Transfer Surface And The Heat Transfer Surface

 #53
20060054668
2006-03-16

Dual additive soldering

 #54
20060011709
2006-01-19

Method of replenishing an oxidation suppressing element in a solder bath

 #55
20060006212
2006-01-12

Method of brazing composite material parts sealed with a silicon-based composition

 #56
20050262687
2005-12-01

Solder extraction tool and method

 #57
20050150935
2005-07-14

Method for manufacturing plate stacks, particularly coolers or cooler elements made up of plate stacks

 #58
13946722
2015-11-10

Hot bar soldering