Patents-Review.com
ClassID:

43131 ⎘

B23K20/007 - CPC Classification

Classification description:

Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work; Wire welding; Capillary welding Ball bonding

Recent Application in this class:
#1
20260131395
2026-05-14

WIRE BONDING TOOLS, AND RELATED METHODS OF PROVIDING THE SAME

 #2
20250233102
2025-07-17

WIRE BONDING MACHINE HAVING A ROTATABLE CAPILLARY TO SECURE A BOND WIRE TO A CONNECTION POINT

 #3
20250118704
2025-04-10

APPARATUS AND METHODS FOR TOOL MARK FREE STITCH BONDING

 #4
20240395765
2024-11-28

WIRE BONDING APPARATUS, WIRE BONDING METHOD AND SEMICONDUCTOR DEVICE

 #5
20240242984
2024-07-18

WIRE BONDING SYSTEM, INSPECTION DEVICE, WIRE BONDING METHOD, AND RECORDING MEDIUM

 #6
20240008189
2024-01-04

Method and apparatus for flexible circuit cable attachment

 #7
20230347442
2023-11-02

WIRE BONDING TOOLS, AND RELATED METHODS OF PROVIDING THE SAME

 #8
20230311239
2023-10-05

Wire bonding capillary

 #9
20230278132
2023-09-07

Arrangement and method for mechanically and electrically contacting a glow wire of a thermal radiation source made of refractory metal for semiconductor and microsystem technology

 #10
20230166348
2023-06-01

Methods of operating a wire bonding machine, including methods of monitoring an accuracy of bond force on a wire bonding machine, and related methods

 #11
20230081711
2023-03-16

WIRE BONDING TOOL

 #12
20220199571
2022-06-23

Apparatus and methods for tool mark free stitch bonding

 #13
20220152749
2022-05-19

Al bonding wire

 #14
20220134469
2022-05-05

Methods of operating a wire bonding machine, including methods of monitoring an accuracy of bond force on a wire bonding machine, and related methods

 #15
20220095463
2022-03-24

Method and apparatus for flexible circuit cable attachment

 #16
20220037284
2022-02-03

Process for electrically connecting contact surfaces of electronic components

 #17
20210159205
2021-05-27

Wire bonding apparatus threading system

 #18
20210014977
2021-01-14

Method and apparatus for flexible circuit cable attachment

 #19
20200388590
2020-12-10

Method of vertically vibrating a bonding arm

 #20
20200075416
2020-03-05

Protected chip-scale package (CSP) pad structure

 #21
20190394885
2019-12-26

Method and apparatus for flexible circuit cable attachment

 #22
20190304947
2019-10-03

Multiple actuator wire bonding apparatus

 #23
20190287941
2019-09-19

Wire bonding method and wire bonding apparatus

 #24
20190252257
2019-08-15

Protected chip-scale package (CSP) pad structure

 #25
20190006237
2019-01-03

Protected chip-scale package (CSP) pad structure

 #26
20180345421
2018-12-06

Coated wire

 #27
20180240935
2018-08-23

METHOD FOR MANUFACTURING LIGHT EMITTING DEVICE

 #28
20180132360
2018-05-10

Method and apparatus for flexible circuit cable attachment

 #29
20180096965
2018-04-05

Method for forming ball in bonding wire

 #30
20170190002
2017-07-06

Bonding method and bonding device

 #31
20170005064
2017-01-05

Bonding device

 #32
20160247777
2016-08-25

Wire bonding method

 #33
20160225739
2016-08-04

Off substrate kinking of bond wire

 #34
20160049382
2016-02-18

Method of manufacturing a semiconductor package and wire bonding apparatus for performing the same

 #35
20150360316
2015-12-17

COATED WIRE FOR BONDING APPLICATIONS

 #36
20150246411
2015-09-03

Wire-bonding apparatus and method of wire bonding

 #37
20150214180
2015-07-30

Antioxidant gas blow-off unit

 #38
20150209886
2015-07-30

Antioxidant gas blow-off unit

 #39
20150200143
2015-07-16

Short tail recovery techniques in wire bonding operations

 #40
20150194396
2015-07-09

Bond pad having a trench and method for forming

 #41
20150129647
2015-05-14

Severing bond wire by kinking and twisting

 #42
20150129646
2015-05-14

Off substrate kinking of bond wire

 #43
20150102091
2015-04-16

Methods for forming apparatus for stud bump formation

 #44
20150028081
2015-01-29

Method for fabricating wire bonding structure

 #45
20150021376
2015-01-22

Wire bonding capillary with working tip protrusion

 #46
20150017765
2015-01-15

Method for package-on-package assembly with wire bonds to encapsulation surface

 #47
20150008251
2015-01-08

Method and apparatus for measuring a free air ball size during wire bonding

 #48
20140311590
2014-10-23

Antioxidant gas supply unit

 #49
20140061153
2014-03-06

Methods for forming apparatus for stud bump formation

 #50
20130341378
2013-12-26

SYSTEM AND METHOD FOR INSPECTING FREE AIR BALL

 #51
20130327812
2013-12-12

Bond pad assessment for wire bonding

 #52
20130307148
2013-11-21

Low loop wire bonding

 #53
20130292856
2013-11-07

Method for the wafer-level integration of shape memory alloy wires

 #54
20130240605
2013-09-19

Wire bonder including a transducer, a bond head, and a mounting apparatus

 #55
20130196452
2013-08-01

Wire bonding method in circuit device

 #56
20130180957
2013-07-18

Method of recovering a bonding apparatus from a bonding failure

 #57
20130180757
2013-07-18

Bonding structure of multilayer copper bonding wire

 #58
20130125390
2013-05-23

Wire loops, methods of forming wire loops, and related processes

 #59
20130119114
2013-05-16

Method and apparatus for monitoring free air ball (FAB) formation in wire bonding

 #60
20130098877
2013-04-25

Automatic wire tail adjustment system for wire bonders

 #61
20130062765
2013-03-14

Low loop wire bonding

 #62
20120302009
2012-11-29

Method of manufacturing semiconductor device

 #63
20120286023
2012-11-15

Ultrasonic transducers for wire bonding and methods of forming wire bonds using ultrasonic transducers

 #64
20120125977
2012-05-24

Ultrasonic transducers for wire bonding and methods of forming wire bonds using ultrasonic transducers

 #65
20120104075
2012-05-03

Method of operating a clamping system of a wire bonding machine

 #66
20120055976
2012-03-08

Method of manufacturing semiconductor device and wire bonding apparatus

 #67
20120032354
2012-02-09

WIREBONDING METHOD AND DEVICE ENABLING HIGH-SPEED REVERSE WEDGE BONDING OF WIRE BONDS

 #68
20120031877
2012-02-09

Gas delivery system for reducing oxidation in wire bonding operations

 #69
20110315743
2011-12-29

Method of manufacturing semiconductor device, and bonding apparatus

 #70
20110290859
2011-12-01

RIBBON BONDING TOOLS AND METHODS OF USING THE SAME

 #71
20110278349
2011-11-17

Wire bonding apparatus and wire bonding method

 #72
20110272449
2011-11-10

Dual capillary IC wirebonding

 #73
20110180590
2011-07-28

Method of manufacturing semiconductor device and wire bonding apparatus

 #74
20110155789
2011-06-30

Bonding apparatus

 #75
20110146408
2011-06-23

Method and apparatus for pass/fail determination of bonding and bonding apparatus

 #76
20110128369
2011-06-02

Pressure-bonded ball diameter detecting apparatus and pressure-bonded ball diameter detecting method

 #77
20110114704
2011-05-19

Bonding apparatus and bonding method

 #78
20110114609
2011-05-19

METHOD AND DEVICE FOR FORMING THE WELDING WIRE END

 #79
20110079904
2011-04-07

Semiconductor device

 #80
20110073635
2011-03-31

Gas delivery system for reducing oxidation in wire bonding operations

 #81
20110068469
2011-03-24

SEMICONDUCTOR PACKAGE WITH PRE-FORMED BALL BONDS

 #82
20110062216
2011-03-17

Method for manufacturing semiconductor device and bonding apparatus

 #83
20110057299
2011-03-10

Method of manufacturing semiconductor device and semiconductor device

 #84
20110049219
2011-03-03

Wire-bonding machine with cover-gas supply device

 #85
20110017806
2011-01-27

FORMING GAS KIT DESIGN FOR COPPER BONDING

 #86
20110000951
2011-01-06

Wire payout measurement and calibration techniques for a wire bonding machine

 #87
20100311234
2010-12-09

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

 #88
20100294435
2010-11-25

Bonding apparatus and wire bonding method

 #89
20100230476
2010-09-16

REDUCED OXIDATION SYSTEM FOR WIRE BONDING

 #90
20100230471
2010-09-16

BONDING METHOD AND BONDING DEVICE

 #91
20100206940
2010-08-19

Wire bonding method, wire bonding apparatus, and wire bonding control program

 #92
20100155455
2010-06-24

Wire bonding method

 #93
20100148369
2010-06-17

Wire bonding method and semiconductor device

 #94
20100140327
2010-06-10

Spot heat wirebonding

 #95
20100127599
2010-05-27

Ultrasonic transducer

 #96
20100126763
2010-05-27

WIRE BONDING METHOD, ELECTRONIC APPARATUS, AND METHOD OF MANUFACTURING SAME

 #97
20100096437
2010-04-22

Wire bonding method

 #98
20100092795
2010-04-15

Systems and methods for platinum ball bonding

 #99
20100078464
2010-04-01

Wire bonding apparatus and ball forming method

 #100
20100059883
2010-03-11

METHOD OF FORMING BALL BOND

 #101
20100059574
2010-03-11

Wire bonding method, wire bonding apparatus, and wire bonding control program

 #102
20090223937
2009-09-10

Apparatus and methods for forming wire bonds

 #103
20090200357
2009-08-13

Wire clamp and wire bonding apparatus having the same

 #104
20090194577
2009-08-06

Wire bonding method

 #105
20090189288
2009-07-30

ANGLED FLYING LEAD WIRE BONDING PROCESS

 #106
20090091006
2009-04-09

Dual capillary IC wirebonding

 #107
20090029542
2009-01-29

METHODS AND SYSTEMS FOR LASER ASSISTED WIREBONDING

 #108
20090025205
2009-01-29

Approaches for manufacturing a head gimbal assembly

 #109
20090001064
2009-01-01

Apparatus and method for conductive metal ball bonding with electrostatic discharge detection

 #110
20080308609
2008-12-18

BOND HEAD FOR A WIRE BONDER

 #111
20080259352
2008-10-23

Apparatus for detecting press-bonded ball at bonding portion in bonding apparatus and method for detecting press-bonded ball at bonding portion

 #112
20080210740
2008-09-04

Low-profile capillary for wire bonding

 #113
20080111252
2008-05-15

Low loop height ball bonding method and apparatus

 #114
20080083815
2008-04-10

Moveable arm assembly for a wire bonder

 #115
20080073406
2008-03-27

Multi-part capillary

 #116
20080035709
2008-02-14

Bonding apparatus, ball forming device in said bonding apparatus, and ball forming method using said bonding apparatus

 #117
20080009129
2008-01-10

Methods and systems for laser assisted wirebonding

 #118
20080000950
2008-01-03

Ball forming device in a bonding apparatus and ball forming method

 #119
20070284416
2007-12-13

Wire bonding method for forming low-loop profiles

 #120
20070251980
2007-11-01

REDUCED OXIDATION SYSTEM FOR WIRE BONDING

 #121
20070235887
2007-10-11

Bonding Wire and Integrated Circuit Device Using the Same

 #122
20070181645
2007-08-09

WIRE BONDING METHOD AND APPARATUS

 #123
20070125831
2007-06-07

CAPILLARY FOR A BONDING TOOL

 #124
20070023487
2007-02-01

Wire bonding method and device of performing the same

 #125
20070001320
2007-01-04

Bonding apparatus and method

 #126
20060249561
2006-11-09

Spot heat wirebonding

 #127
20060216863
2006-09-28

Method of manufacturing semiconductor device

 #128
20060213956
2006-09-28

Method for producing a wire connection

 #129
20060186179
2006-08-24

Apparatus and method for bonding wires

 #130
20060175383
2006-08-10

Wire bonding method

 #131
20060169739
2006-08-03

Transducer assembly, capillary and wire bonding method using the same

 #132
20060163331
2006-07-27

Method and apparatus for forming a low profile wire loop

 #133
20060125112
2006-06-15

Apparatus and method for manufacturing semiconductor device

 #134
20060102701
2006-05-18

Bump formation method and bump forming apparatus for semiconductor wafer

 #135
20060079008
2006-04-13

Inspection method of bonded status of ball in wire bonding

 #136
20060054665
2006-03-16

Methods for forming conductive bumps and wire loops

 #137
20060054662
2006-03-16

Method of measuring thickness of bonded ball in wire bonding

 #138
20060032894
2006-02-16

Wire bond with improved shear strength

 #139
20050286060
2005-12-29

Method and apparatus for mapping a position of a capillary tool tip using a prism

 #140
20050284916
2005-12-29

Ball bonding method and ball bonding apparatus

 #141
20050284914
2005-12-29

Method and apparatus for measuring the size of free air balls on a wire bonder

 #142
20050252950
2005-11-17

Low-profile capillary for wire bonding

 #143
20050219777
2005-10-06

Wire bonding apparatus

 #144
20050218188
2005-10-06

Wire bond capillary tip

 #145
20050205995
2005-09-22

Wire bonding method and semiconductor device

 #146
20050189567
2005-09-01

Wire loop, semiconductor device having same, wire bonding method and wire bonding apparatus

 #147
20050173491
2005-08-11

System and method for automated wire bonding

 #148
20050167473
2005-08-04

METHOD FOR PRODUCING WEDGE-WEDGE WIRE CONNECTION

 #149
20050161488
2005-07-28

System for reducing oxidation of electronic devices

 #150
20050139637
2005-06-30

Wire bonder for ball bonding insulated wire and method of using same

 #151
20050133571
2005-06-23

Flip-chip solder bump formation using a wirebonder apparatus

 #152
20050133566
2005-06-23

Wire bonding simulation

 #153
20050121494
2005-06-09

Capillary with contained inner chamfer

 #154
20050121493
2005-06-09

Multi-part capillary

 #155
20050109819
2005-05-26

Low loop height ball bonding method and apparatus

 #156
20050098605
2005-05-12

Apparatus and method for low pressure wirebond

 #157
20050051600
2005-03-10

Method and system for stud bumping

 #158
15668870
2019-08-13

Guide posts for wire bonding