DEVICE AND METHOD FOR CUTTING NONMETALIC SUBSTRATE

Methods and systems for thermal-based laser processing a multi-material device

Method and system for high-speed, precise, laser-based modification of one or more electrical elements

Laser-based method and system for removing one or more target link structures

Method and apparatus for controlling sample position during material removal or addition

Laser irradiation apparatus, laser irradiation method, and method for manufacturing semiconductor device

Simultaneously mode-locked, Q-switched laser

Laser beam machining method

Laser etching method and apparatus therefor

Method and system for forming periodic pulse patterns

Device and method for material processing by means of laser radiation

High-speed, precision, laser-based method and system for processing material of one or more targets within a field

Ultrafast laser direct writing method for modifying existing microstructures on a submicron scale

Methods and systems for thermal-based laser processing a multi-material device

Transparent material processing with an ultrashort pulse laser

Laser induced plasma machining with an optimized process gas

Laser induced plasma machining with a process gas

Via hole machining for microwave monolithic integrated circuits

Pulsed laser source with adjustable grating compressor

Femtosecond laser micromachining of a contact lens and a contact lens manufactured thereby

Display device with polarizer sheet and method for manufacturing polarizer sheet

Method for manufacturing semiconductor device and laser irradiation apparatus

Method and apparatus for repair of reflective photomasks

Method for securing a drilling process

Method for forming nanoscale features

Degradable implantable medical devices

Method and Apparatus for Laser Surgery of the Cornea

Methods and systems for processing a device, methods and systems for modeling same and the device

Laser material micromachining with green femtosecond pulses

High-speed, precision, laser-based method and system for processing material of one or more targets within a field

Laser selective cutting by impulsive heat deposition in the IR wavelength range for direct-drive ablation

Methods and systems for thermal-based laser processing a multi-material device

Method of controlling laser oscillation of pulsed laser and pulsed laser system

Method and system for production of dynamic laser-induced images inside gaseous medium

Processing method of polymer crystal, processing system of polymer crystal, and observation system of polymer crystal

Method and apparatus for via drilling and selective material removal using an ultrafast pulse laser

Laser processing method for cutting a wafer-like object by using a laser to form modified regions within the object

Pulsed laser source with adjustable grating compressor

Laser system for generation of high-power sub-nanosecond pulses with controllable wavelength in 2-15 μm region

Processing a memory link with a set of at least two laser pulses

Processing a memory link with a set of at least two laser pulses

Processing a memory link with a set of at least two laser pulses

Processing a memory link with a set of at least two laser pulses

Processing a memory link with a set of at least two laser pulses

Processing a memory link with a set of at least two laser pulses

Processing a memory link with a set of at least two laser pulses

Processing a memory link with a set of at least two laser pulses

Processing a memory link with a set of at least two laser pulses

Processing a memory link with a set of at least two laser pulses

Processing a memory link with a set of at least two laser pulses

Processing a memory link with a set of at least two laser pulses

Processing a memory link with a set of at least two laser pulses

Processing a memory link with a set of at least two laser pulses

Processing a memory link with a set of at least two laser pulses

Method and device for processing inside of transparent material

Systems and methods for laser material manipulation

Method and apparatus for laser marking by ablation

Laser processing method and laser processing apparatus

Feedback controlled laser machining system

Laser micromachining method

Scribing apparatus, substrate cutting apparatus equipped with the scribing apparatus, and substrate cutting method using the substrate cutting apparatus

Method for cutting substrate using femtosecond laser

Apparatus for cutting substrate and method using the same

Ultrafast laser machining system and method for forming diffractive structures in optical fibers

Laser micromachining method

Method and device for processing inside of transparent material

Laser ablation method

Laser beam processing method and laser beam processing machine

Energy-efficient, laser-based method and system for processing target material

Resolving thermoelectric potentials during laser trimming of resistors

Measurement extrapolation technique to compensate for thermal EMF generated during laser trimming

Method and apparatus for calibration of near-field scanning optical microscope tips for laser machining

Laser processing method and laser processing apparatus

Method of forming vias on a wafer stack using laser ablation

Method and apparatus for laser trimming of resistors using ultrafast laser pulse from ultrafast laser oscillator operating in picosecond and femtosecond pulse widths

Forming features in printhead components

Methods and systems for precisely relatively positioning a waist of a pulsed laser beam and method and system for controlling energy delivered to a target structure

Precision machining method using a near-field scanning optical microscope

Method for cutting non-metallic materials and device for carring out said method

Method of optimizing optical power use in a parallel processing laser system

Laser-based method and system for processing targeted surface material and article produced thereby

Process for cutting an optical fiber

Semiconductor link processing using multiple laterally spaced laser beam spots with on-axis offset

Semiconductor structure processing using multiple laser beam spots

Semiconductor structure processing using multiple laser beam spots spaced on-axis with cross-axis offset

Method and apparatus for dicing of thin and ultra thin semiconductor wafer using ultrafast pulse laser

Semiconductor nano-structure and method of forming the same

Method for processing by laser, apparatus for processing by laser, and three-dimensional structure

Optical element, manufacturing method thereof, and optical device

Ultrashort pulse laser processing method

Accelerating the discovery of effective photonic reagents

Pulsed laser processing with controlled thermal and physical alterations

Methods and systems for processing a device, methods and systems for modeling same and the device

Systems and methods for laser texturing of surfaces of a substrate

Laser processing method and laser processing apparatus

Ultrafast laser direct writing method for modifying existing microstructures on a submicron scale

Laser cutting by forming a modified region within an object and generating fractures

Microchip - Yb fiber hybrid optical amplifier for micro-machining and marking

Laser processing method and laser processing apparatus

Laser processing method and laser processing apparatus

Laser processing method and laser processing apparatus

Methods for creating optical structures in dielectrics using controlled energy deposition

Laser-based method and system for memory link processing with picosecond lasers

Laser-based method and system for memory link processing with picosecond lasers

Method for material processing and/or material analysis using lasers

Laser-based method and system for memory link processing with picosecond lasers

Laser-based method and system for memory link processing with picosecond lasers

Laser scribing and machining of materials

Femtosecond laser system for the exact manipulation of material and tissues

High energy pulse suppression method

Method of defining features on materials with a femtosecond laser

Remote UV laser system and methods of use

Laser-based method and system for memory link processing with picosecond lasers

Method and apparatus for deflashing of integrated circuit packages

Composite cutting with optical ablation technique

Semiconductor manufacturing using optical ablation

Q-switched CO2 laser for material processing

Wafer defect reduction by short pulse laser ablation

Method for forming nanoscale features and structures produced thereby

Method and apparatus for repair of reflective photomasks

High energy optical fiber amplifier for picosecond-nanosecond pulses for advanced material processing applications

Laser etching method and apparatus therefor

Dual light source machining method and system

Ultrashort-pulse laser-working method and apparatus and structural bodies produced by using the same

High-speed, precision, laser-based method and system for processing material of one or more targets within a field

Microstructures and methods of fabricating

Focusless micromachining

Detecting and removing defects in laser powder bed fusion manufacturing

Ultrafast laser inscribed structures for signal concentration in focal plan arrays

Ultrahigh surface area materials and methods of making same

Method for laser-marking of anodized aluminum

Filamentary cutting of brittle materials using a picosecond pulsed laser

Natural gas to liquid fuels, liquid natural gas and compressed natural gas