Patents-Review.com
ClassID:

44758 ⎘

B24B37/0053 - CPC Classification

Classification description:

Lapping machines or devices; Accessories; Control means for lapping machines or devices detecting loss or breakage of a workpiece during lapping

Recent Application in this class:
#1
20260115855
2026-04-30

SYSTEM AND METHOD FOR MONITORING CHEMICAL MECHANICAL POLISHING

 #2
20260061551
2026-03-05

WAFER GRINDING AUTOMATION SYSTEM AND AUTOMATED WAFER GRINDING METHOD

 #3
20250153302
2025-05-15

INFORMATION PROCESSING APPARATUS, INFERENCE APPARATUS, MACHINE-LEARNING APPARATUS, INFORMATION PROCESSING METHOD, INFERENCE METHOD, AND MACHINE-LEARNING METHOD

 #4
20240371708
2024-11-07

SYSTEMS AND METHODS FOR SUCTION PAD ASSEMBLIES

 #5
20240308019
2024-09-19

METHOD FOR DETECTION OF WAFER SLIPPAGE

 #6
20230182257
2023-06-15

SYSTEM AND METHOD FOR MONITORING CHEMICAL MECHANICAL POLISHING

 #7
20230166299
2023-06-01

WAFER POLISHING APPARATUS AND METHOD OF DETECTING DEFECT OF RETAINER RING INCLUDED IN THE WAFER POLISHING APPARATUS

 #8
20220246483
2022-08-04

Systems and methods for suction pad assemblies

 #9
20210187692
2021-06-24

Polishing unit, substrate processing apparatus, and polishing method

 #10
20210039224
2021-02-11

POLISHING APPARATUS AND RETAINER RING

 #11
20200043814
2020-02-06

Systems and methods for suction pad assemblies

 #12
20190143474
2019-05-16

System and method for monitoring chemical mechanical polishing

 #13
20190067059
2019-02-28

Semiconductor manufacturing apparatus and method of manufacturing semiconductor device using the same

 #14
20190030676
2019-01-31

Silicon wafer single-side polishing method

 #15
20170304986
2017-10-26

Polishing apparatus

 #16
20170266778
2017-09-21

Polishing apparatus and polishing method

 #17
20160315002
2016-10-27

Substrate processing apparatus and method for detecting abnormality of substrate

 #18
20160207163
2016-07-21

Manufacturing method of semiconductor device and semiconductor manufacturing apparatus

 #19
20160199960
2016-07-14

Abrasive tool indicator system, method and apparatus

 #20
20160082566
2016-03-24

WAFER SLIP DETECTION DURING CMP PROCESSING

 #21
20160013085
2016-01-14

In-Situ Acoustic Monitoring of Chemical Mechanical Polishing

 #22
20150273649
2015-10-01

Polishing apparatus

 #23
20150117755
2015-04-30

Wafer slip detection during CMP processing

 #24
20140329439
2014-11-06

APPARATUS AND METHODS FOR ACOUSTICAL MONITORING AND CONTROL OF THROUGH-SILICON-VIA REVEAL PROCESSING

 #25
20120244649
2012-09-27

Polishing method, polishing apparatus and polishing tool

 #26
20100327900
2010-12-30

Polishing head testing with movable pedestal

 #27
20090209175
2009-08-20

Polishing apparatus and substrate processing method

 #28
20090181475
2009-07-16

DETECTING THE PRESENCE OF A WORKPIECE RELATIVE TO A CARRIER HEAD

 #29
20080227374
2008-09-18

Polishing head testing with movable pedestal

 #30
20050272355
2005-12-08

Carrier head for chemical mechanical polishing apparatus