Grind Wheel Design for Low Edge-Roll Grinding

SUBSTRATE GRINDING TOOL AND METHODS OF OPERATION

Grind Wheel Design for Low Edge-Roll Grinding

SUBSTRATE GRINDING TOOL AND METHODS OF OPERATION

Chemical Mechanical Polishing Process Method and Device

Surface height measurement method using dummy disk

Chemical Mechanical Polishing Apparatus Including a Multi-Zone Platen

METHOD FOR POLISHING SUBSTRATE INCLUDING FUNCTIONAL CHIP

Single bodied platen housing a detection module for CMP systems

PAD CONDITIONER WITH POLYMER BACKING PLATE

Integrated abrasive polishing pads and manufacturing methods

Platen surface modification and high-performance pad conditioning to improve CMP performance

Substrate processing apparatus, polishing head, and substrate processing method

TOOL FOR MODIFYING A SUPPORT SURFACE

Chemical mechanical polishing apparatus including a multi-zone platen

Polishing measurement device and abrasion time controlling method thereof, and polishing control system including same

Method for polishing substrate including functional chip

Abrasive articles with precisely shaped features and method of making thereof

DUMMY DISK, DRESSING DISK, AND SURFACE HEIGHT MEASUREMENT METHOD USING DUMMY DISK

Dressing device, polishing apparatus, holder, housing and dressing method

Single bodied platen housing a detection module for CMP systems

Polishing pad with pad wear indicator

Polishing pad for chemical mechanical planarization

Dual-surface polishing device and dual-surface polishing method

One or more charging members used in the manufacture of a lapping plate, and related apparatuses and methods of making

Planarization apparatus and planarization method thereof

SURFACE PLATE FOR FINISH POLISHING, FINISH POLISHING DEVICE, AND POLISHING METHOD

Integrated abrasive polishing pads and manufacturing methods

Polishing table and polishing apparatus having ihe same

Wafer pin chuck fabrication and repair

Surface plate cleaning apparatus

Wafer chuck featuring reduced friction support surface

Method for removing contamination from a chuck surface

Method for producing substrate

Dressing device, polishing apparatus, holder, housing and dressing method

Lapping plate and method of making

Lapping plate and method of making

Double-disc straight groove cylindrical-component surface grinding disc

Debris-removal groove for CMP polishing pad

Cylindrical-component grinding device, and workpiece advancing apparatus and grinding method thereof

Disc containing copper for sapphire polishing, and method for preparing discs containing copper facing each other

Polishing system with front side pressure control

Wafer pin chuck fabrication and repair

Plate and dual side wafer grinding device including same

Polishing pad with offset concentric grooving pattern and method for polishing a substrate therewith

Polishing pad with foundation layer and polishing surface layer

Polishing pad with grooved foundation layer and polishing surface layer

Grinding wheel design with elongated teeth arrangement

Abrasive articles with precisely shaped features and method of making thereof

Method for the double-side polishing of a semiconductor wafer

Polishing system with front side pressure control

Method of patterning a lapping plate, and patterned lapping plates

Wafer polishing apparatus

Polishing pad with polishing surface layer having an aperture or opening above a transparent foundation layer

Polishing pad with foundation layer and polishing surface layer

Polishing pad with grooved foundation layer and polishing surface layer

METHOD FOR THE DOUBLE-SIDE POLISHING OF A SEMICONDUCTOR WAFER

Device and Method for the Double-Sided Processing of Flat Work Pieces

POLISHING PAD AND METHODS FOR MANUFACTURING AND USING THE SAME

Method of regenerating a polishing pad using a polishing pad sub plate

Polishing pad sub plate

Pad Window Insert

FLUIDIZED WEB POLISHING APPARATUS AND METHOD USING CONTACT PRESSURE FEEDBACK

Applying different pressures through sub-pad to fixed abrasive CMP pad

Textured platen

Apparatus and method for reducing removal forces for CMP pads

Polishing platen and polishing apparatus

RFID-containing carriers used for silicon wafer quality

Platen assembly and work piece carrier head employing flexible circuit sensor

PLATEN ASSEMBLY FOR ELECTROCHEMICAL MECHANICAL PROCESSING

Conductive Polishing Article for Electrochemical Mechanical Polishing

CHEMICAL MECHANICAL POLISHING WITH NAPPED POROMERIC

REDUCING POLISHING PAD DEFORMATION

Polishing device and polishing method

Chemical mechanical polishing system

BALL CONTACT COVER FOR COPPER LOSS REDUCTION AND SPIKE REDUCTION

Contact assembly cleaning in an electrochemical mechanical processing apparatus

Viscoelastic polisher and polishing method using the same

Grooved platen with channels or pathway to ambient air

Polishing apparatus

Chemical mechanical polishing apparatus with rotating belt

Apparatus and method for reducing removal forces for CMP pads

Platen structure of polishing apparatus for processing semiconductor wafer and method for exchanging polishing pad affixed to the same

Table of wafer polishing apparatus, method for polishing semiconductor wafer, and method for manufacturing semiconductor wafer

Apparatus and system for precise lapping of recessed and protruding elements in a workpiece

Profile control platen

Conductive polishing article for electrochemical mechanical polishing

Chemical mechanical polishing apparatus

Chemical mechanical polishing system

Dynamic polishing fluid delivery system for a rotational polishing apparatus

Method and apparatus for polishing workpiece

System and apparatus for predicting plate lapping properties to improve slider fabrication yield

Assembly and method for generating a hydrodynamic air bearing

Method and apparatus for plating and polishing semiconductor substrate

Technique for process-qualifying a semiconductor manufacturing tool using metrology data

Method for reducing removal forces for CMP pads

Method and apparatus for electrochemical mechanical processing