Carrier head with composite plastic portions

Polishing pad, polishing method and polishing system

Method of assembly of retaining ring for CMP

Membrane assembly and carrier head having the membrane assembly

Method for producing semiconductor wafer

CMP APPARATUS AND METHOD

Polishing head and polishing apparatus

Apparatus for grinding heated plane of cooler

Wafer pads for fixed-spindle floating-platen lapping

MEMBRANE

Distance monitoring device

Polishing method, polishing apparatus and polishing tool

Smart automation of robotic surface finishing

Systems providing an air zone for a chucking stage

Flexure assembly

Polishing apparatus and polishing method

Carrier head and carrier head unit

COOLER HAVING GROUND HEATED PLANE FOR COOLING HEATING ELECTRONIC COMPONENT

Wafer polishing apparatus and method

Sheet for mounting a workpiece

Electrode securing platens and electrode polishing assemblies incorporating the same

Sheet for mounting a workpiece and method for making the same

Processing apparatus having four processing units

Dynamic action abrasive lapping workholder

Polishing apparatus

Feedback control of polishing using optical detection of clearance

Polishing apparatus having thermal energy measuring means

Polishing head capable of continuously varying pressure distribution between pressure regions for uniform polishing

Method, apparatus and system for use in processing wafers

Silicon carbide, sapphire, germanium, silicon and pattern wafer polishing templates holder

Apparatus and method for temperature control during polishing

Replaceable cover for membrane carrier

Pivot-balanced floating platen lapping machine

Multilayer retaining ring for chemical mechanical polishing

Grinding method for workpiece having a plurality of bumps

Chemical mechanical polishing system

Differential pressure application apparatus for use in polishing layers of semiconductor device structures and methods

Flexible membrane for carrier head

Method and apparatus for polishing a substrate

Device for treating wafers on assembly carriers

Polishing head and polishing apparatus

Method and apparatus for conformable polishing

WAFER POLISHING APPARATUS FOR ADJUSTING HEIGHT OF WHEEL TIP

Electrical contact method

Wafer back side grinding process

Multiple zone carrier head with flexible membrane

POLISHING APPARATUS

Carrier film for mounting polishing workpiece and method for making the same

Method for the local polishing of a semiconductor wafer

Cooler with ground heated plane and grinding method and apparatus thereof

Carrier head membrane

Polishing head zone boundary smoothing

Polishing head and polishing apparatus having the same

Polishing apparatus

Substrate holder and substrate holding method

Flexible membrane for carrier head

POLISHING APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE USING THE SAME

Polishing head, polishing apparatus and method for demounting workpiece

Polishing equipment having discontinuous adhesion points and method for making the sheet

POLISHING HEAD AND POLISHING APPARATUS

Carrier head membrane roughness to control polishing rate

Retaining ring and articles for carrier head

Carrier head with retaining ring and carrier ring

Automated chemical polishing system adapted for soft semiconductor materials

SUBSTRATE HOLDING APPARATUS AND POLISHING APPARATUS

Polishing with enhanced uniformity

Chemical mechanical polishing system having multiple polishing stations and providing relative linear polishing motion

Method for selectively removing conductive material from a microelectronic substrate

Substrate supporting unit and single type substrate polishing apparatus using the same

Single type substrate treating apparatus and method

Semiconductor wafer polishing apparatus and method of polishing

METHOD AND APPARATUS FOR CHEMICAL MECHANICAL POLISHING OF LARGE SIZE WAFER WITH CAPABILITY OF POLISHING INDIVIDUAL DIE

Polishing head and polishing apparatus

Apparatus for polishing semi-conductor dice

Substrate holder with liquid supporting surface

POLISHING MACHINE, WORKPIECE SUPPORTING TABLE PAD, POLISHING METHOD AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

Composite sheet for mounting a workpiece and the method for making the same

SHEET FOR MOUNTING POLISHING WORKPIECE AND METHOD FOR MAKING THE SAME

Carrier Head Membrane

Substrate holding apparatus and polishing apparatus

Multilayer retaining ring for chemical mechanical polishing

Polishing apparatus

WAFER DE-CHUCKING

DETECTING THE PRESENCE OF A WORKPIECE RELATIVE TO A CARRIER HEAD

Flexible membrane assembly for a CMP system and method of using

Polishing apparatus, polishing head and polishing method

Silicon Wafer Grinding Apparatus, Retaining Assembly Used for the Same and Silicon Wafer Flatness Correcting Method

Polishing apparatus and method

Electrical contact structures and methods for use

Polishing apparatus and polishing method

Silicon Wafer Grinding Apparatus, Retaining Assembly Used for the Same and Silicon Wafer Flatness Correcting Method

Adhesive composition and adhesive film

Substrate holding apparatus

Suction apparatus, polishing apparatus, semiconductor device, and method of manufacturing a semiconductor device

POLISHING HEAD AND CHEMICAL MECHANICAL POLISHING PROCESS USING THE SAME

Polishing apparatus and polishing method

Method for the single-sided polishing of bare semiconductor wafers

Substrate holding apparatus and substrate polishing apparatus

CMP head

Low-stress polishing device

NON-CONTACT WET WAFER HOLDER

Composite sheet for mounting a workpiece and the method for making the same

Polishing head, polishing apparatus and polishing method for semiconductor wafer

METHOD AND SYSTEM FOR CONTROLLING CHEMICAL MECHANICAL POLISHING BY TAKING ZONE SPECIFIC SUBSTRATE DATA INTO ACCOUNT

Carrier film for mounting polishing workpiece and method for making the same

LAPPING APPARATUS AND LAPPING METHOD

Polishing apparatus including separate retainer rings

Substrate holding apparatus and polishing apparatus

Clamping Mechanism

Substrate Polishing Method and Apparatus

DISK HOLDER AND DISK ROTATING DEVICE HAVING THE SAME

Flexible membrane for carrier head

Substrate holding apparatus and polishing apparatus

Carrier head with retaining ring and carrier ring

Carrier head for workpiece planarization/polishing

Polishing apparatus

Substrate holding apparatus and substrate polishing apparatus

Methods for treating wafers on assembly carriers

Substrate holding apparatus and substrate polishing apparatus

Method of producing polishing pad

REATAINING RING AND ARTICLES FOR CARRIER HEAD

Semiconductor wafer holding method, semiconductor wafer holding apparatus and semiconductor wafer holding structure

POLISHING HEAD FOR POLISHING SEMICONDUCTOR WAFERS

Sheet for mounting polishing workpiece and method for making the same

Sheet for mounting polishing workpiece and method for making the same

Sheet for mounting polishing workpiece and method for making the same

SYSTEM AND METHOD FOR IN-SITU HEAD RINSE

Sheet for mounting polishing workpiece and method for making the same

WAFER POLISHING HEAD

Substrate holding device and polishing apparatus

FIXING BOARD AND POLISHING DEVICE USING THE SAME

Fast substrate loading on polishing head without membrane inflation step

Multiple zone carrier head with flexible membrane

Polishing device

POLISHING DEVICE AND METHOD

Automated chemical polishing system adapted for soft semiconductor materials

NON-CONTACT CHEMICAL MECHANICAL POLISHING WAFER EDGE CONTROL APPARATUS AND METHOD

Method, apparatus and system for use in processing wafers

Chemical mechanical polishing system having multiple polishing stations and providing relative linear polishing motion

METHOD FOR POLISHING A SEMICONDUCTOR WAFER

Method for estimating polishing profile or polishing amount, polishing method and polishing apparatus

Polishing head for polishing semiconductor wafers

Multi-chamber carrier head with a textured membrane

Non-contact support platforms for distance adjustment

Polishing apparatus and polishing method

GRINDING MOUNT HOLDER ASSEMBLY, APPARATUS AND METHOD FOR MANUFACTURING A SAMPLE

Chemical mechanical polishing system and process

MULTI-ZONE CARRIER HEAD FOR CHEMICAL MECHANICAL POLISHING AND CMP METHOD THEREOF

Chemical mechanical polishing pad and chemical mechanical polishing method

Method for polishing workpiece, polishing apparatus and method for manufacturing semiconductor device

Chemical mechanical polishing system and process

Silicon Wafer Grinding Apparatus, Retaining Assembly Used for the Same and Silicon Wafer Flatness Correcting Method

Supporting plate, and method for attaching supporting plate

Polishing machine, workpiece supporting table pad, polishing method and manufacturing method of semiconductor device

Substrate holding apparatus and polishing apparatus

Wafer Carrier Pivot Mechanism

Polishing apparatus

Carrier head with multiple chambers

Vacuum chuck and suction board

Method for estimating polishing profile or polishing amount, polishing method and polishing apparatus

Polishing head elbow fitting

Polishing machine, workpiece supporting table pad, polishing method and manufacturing method of semiconductor device

Pressure-sensitive adhesive sheet and method of processing articles

Wafer carrier with pressurized membrane and retaining ring actuator

Wafer polishing method and polished wafer

Methods and apparatus for selectively removing conductive material from a microelectronic substrate

Polishing pad and method of producing same

Systems and methods for mechanical and/or chemical-mechanical polishing of microfeature workpieces

Method and apparatus for polishing a substrate

Adhesive substrate and method for using

Chemical mechanical polishing tool, apparatus and method

Composition and method for temporarily fixing solids

Dressing apparatus and substrate holding apparatus

Process for producing improved membranes

Wafer carrier and chemical mechanical polishing apparatus including the same

Chemical mechanical polishing system and process

Perforated plate for water chuck

Substrate holding apparatus

Lapping system with mutually stabilized lapping carriers

Substrate holding apparatus and polishing apparatus

Systems including differential pressure application apparatus

Chemical mechanical polishing system having multiple polishing stations and providing relative linear polishing motion

Wafer carrier with pressurized membrane and retaining ring actuator

Precision machining apparatus and precision machining method

Polishing apparatus and related polishing methods

Support system for semiconductor wafers

Back pressure control system for CMP and wafer polishing

Carrier head for thermal drift compensation

Fixture for slider lapping, lapping device and lapping method

Flexible membrane for multi-chamber carrier head

Vibration damping in chemical mechanical polishing system

Polishing apparatus

Method and device for the high-precision machining of the surface of an object, especially for polishing and lapping semiconductor substrates

Apparatus and method for chemical-mechanical polishing (CMP) head having direct pneumatic wafer polishing pressure

Method for polishing a semiconductor wafer

System and method for CMP having multi-pressure zone loading for improved edge and annular zone material removal control

Substrate holding apparatus and polishing apparatus

Retaining ring deflection control

Polishing method

Wafer polishing method and apparatus

Apparatus for chemical mechanical polishing

Polishing apparatus, polishing head and polishing method

Vacuum suction holding apparatus and holding method, polishing apparatus using this holding apparatus, and device manufacturing method using this polishing apparatus

Fine force actuator assembly for chemical mechanical polishing apparatuses

Method, apparatus and system for use in processing wafers

Substrate polishing apparatus

Pad backer and CMP process using the same

Carrier head with gimbal mechanism

Carrier head for chemical mechanical polishing

Substrate removal from polishing tool

Method for estimating polishing profile or polishing amount, polishing method and polishing apparatus

Substrate carrier for surface planarization

Single component pad backer for polishing head of an orbital chemical mechanical polishing machine and method therefor

Carrier head for chemical mechanical polishing apparatus

Carrier head of chemical mechanical polishing apparatus having barriers dividing pressure chamber into a plurality of pressure zones

Method of making carrier head backing plate having low-friction coating

Methods for mechanical or chemical-mechanical planarization of microelectronic-device substrate assemblies

Carrier assemblies, planarizing apparatuses including carrier assemblies, and methods for planarizing micro-device workpieces

Polishing apparatus

Methods of manufacturing carrier heads for polishing micro-device workpieces

Polishing method for semiconductor substrate, and polishing jig used therein

Vibration damping during chemical mechanical polishing

Wafer holding plate for wafer grinding apparatus and method for manufacturing the same

Pressure control system and polishing apparatus

Methods for making wafers with low-defect surfaces, wafers obtained thereby and electronic components made from the wafers

Systems including differential pressure application apparatus

Carrier head with a non-stick membrane

Polishing apparatus

Method of sucking water and water sucking device

Wafer carrier with pressurized membrane and retaining ring actuator

Multiple zone carrier head with flexible membrane

Substrate holding apparatus

Fine force control of actuators for chemical mechanical polishing apparatuses

Processing method and apparatus

Method of determining a flatness of an electronic device substrate, method of producing the substrate, method of producing a mask blank, method of producing a transfer mask, polishing method, electronic device substrate, mask blank, transfer mask, and polishing apparatus

Substrate confinement apparatus and method

Flexible membrane for a polishing head and chemical mechanical polishing (CMP) apparatus having the same

Polishing apparatus

Retaining ring for wafer carriers

Polishing head of chemical mechanical polishing apparatus and polishing method using the same

Method of controlling carrier head with multiple chambers

Multi-chamber carrier head with a flexible membrane

Differential pressure application apparatus for use in polishing layers of semiconductor device structures and methods

Support system for semiconductor wafers and methods thereof

Apparatus for polishing a semiconductor wafer

Method for polishing workpiece, polishing apparatus and method for manufacturing semiconductor device

Method and apparatus for polishing a substrate

Polishing head and polishing apparatus

Substrate holding apparatus

Adjustable gap chemical mechanical polishing method and apparatus

Carrier assemblies, planarizing apparatuses including carrier assemblies, and methods for planarizing micro-device workpieces

Substrate holding device and polishing device

Apparatus process and method for mounting and treating a substrate

Chemical mechanical polishing apparatus and methods using a polishing surface with non-uniform rigidity

Apparatus for lapping thin film magnetic heads

Edge-contact wafer holder for CMP load/unload station

Flat-object holder and method of using the same

Blasting apparatus and process for accelerating blast media

Retaining ring for wafer carriers

Method for grinding lens

Configuration and method for mounting a backing film to a polish head

Substrate holding apparatus and substrate polishing apparatus

INTEGRATED PRESSURE CONTROL SYSTEM FOR WORKPIECE CARRIER

Polishing method

Pressure control system and polishing apparatus

Polishing apparatus and method

Polishing apparatus having a trough

Carrier head having low-friction coating and planarizing machine using same

Carrier head with a flexible membrane

Method and apparatus for polishing metal and dielectric substrates

Substrate holding apparatus and polishing apparatus

Carrier assemblies, planarizing apparatuses including carrier assemblies, and methods for planarizing micro-device workpieces

Carrier assemblies, polishing machines including carrier assemblies, and methods for polishing micro-device workpieces

Method of chemical mechanical polishing with high throughput and low dishing

Laminated substrate, method of manufacturing the substrate, and wafer outer periphery pressing jigs used for the method

CMP polishing heads and methods of using the same

Processing apparatus, method for fabrication of semiconductor device by using the processing apparatus, and semiconductor device fabricated by this method

Method of manufacturing wafer holder

Systems and methods for correcting fabrication error in magnetic recording heads using magnetic write width measurements