Patents-Review.com
ClassID:

44814 ⎘

B24B41/061 - CPC Classification

Classification description:

Component parts such as frames, beds, carriages, headstocks; Work supports, e.g. adjustable steadies axially supporting turning workpieces, e.g. magnetically, pneumatically

Sub-classes:
Recent Application in this class:
#1
20260070186
2026-03-12

MEMBRANE AND SUBSTRATE POLISHING DEVICE INCLUDING THE SAME

 #2
20260008153
2026-01-08

GRINDING PROCESSING APPARATUS

 #3
20260001186
2026-01-01

CYLINDRICAL GRINDING DEVICE, CYLINDRICAL GRINDING METHOD, AND WAFER MANUFACTURING METHOD

 #4
20250196287
2025-06-19

POLISHING SYSTEMS AND METHODS

 #5
20250144769
2025-05-08

Trocar Needle Grinder

 #6
20250114910
2025-04-10

HIGH SPEED INJECTION NOZZLE FOR PRE-POLISH MODIFICATION OF SUBSTRATE THICKNESS

 #7
20250018527
2025-01-16

WAFER POLISHING SYSTEM AND WAFER TRANSFER METHOD

 #8
20240367284
2024-11-07

GRINDING APPARATUS AND CRYSTAL ORIENTATION ADJUSTMENT FIXTURE THEREOF

 #9
20240300069
2024-09-12

MACHINE TOOL, METHOD FOR MACHINE TOOL TO DETECT CONTACT BETWEEN GRINDSTONE AND WORKPIECE, AND COMPUTER-READABLE STORAGE MEDIUM

 #10
20240139904
2024-05-02

CYLINDRICAL GRINDER

 #11
20240051078
2024-02-15

APPARATUS FOR FILM REMOVAL

 #12
20230264319
2023-08-24

PAD CARRIER ASSEMBLY FOR HORIZONTAL PRE-CLEAN MODULE

 #13
20230256562
2023-08-17

USE OF STEAM FOR PRE-HEATING OF CMP COMPONENTS

 #14
20230201996
2023-06-29

Jig for mounting and dismounting processing tool

 #15
20230128675
2023-04-27

Grinding machine centering gauge

 #16
20230033545
2023-02-02

Method of transferring semiconductor wafer to polishing apparatus and method of producing semiconductor wafer

 #17
20220388107
2022-12-08

Workpiece holding assembly for a grinding machine and grinding methods

 #18
20220266405
2022-08-25

Center shaft machining apparatus

 #19
20210252608
2021-08-19

Mounting system for a grinding machine

 #20
20210245325
2021-08-12

Trocar needle grinder

 #21
20210069858
2021-03-11

Modular clamping device

 #22
20200376626
2020-12-03

Use of steam for pre-heating of CMP components

 #23
20200331110
2020-10-22

Spatula edge trimming apparatus

 #24
20200269379
2020-08-27

Centerless grinding through the application of a helical twist to axial grooves

 #25
20200180100
2020-06-11

Blocking device for a semi-finished optical element

 #26
20200180099
2020-06-11

Automatic box sorting device for large-scale mall game coins

 #27
20190321939
2019-10-24

Wheel fixture

 #28
20190314950
2019-10-17

Polishing apparatus

 #29
20190262969
2019-08-29

TURBOMACHINE COMPONENT WITH SURFACE REPAIR

 #30
20190232454
2019-08-01

Worm polishing method and device thereof

 #31
20180311781
2018-11-01

Polishing technique for flexible tubes

 #32
20180304440
2018-10-25

Machine tool

 #33
20180243839
2018-08-30

Chuck for a high precision machine tool

 #34
20180151343
2018-05-31

Substrate processing apparatus, substrate processing method and storage medium

 #35
20180073365
2018-03-15

Turbomachine component with surface repair

 #36
20180050429
2018-02-22

Magnetic drive transmission method

 #37
20180029187
2018-02-01

Grinding apparatus

 #38
20170291225
2017-10-12

Chuck structure

 #39
20170175528
2017-06-22

Surface treatment of turbomachinery

 #40
20170173759
2017-06-22

Surface treatment of turbomachinery

 #41
20170157739
2017-06-08

Holder for pneumatically blocking an optical lens

 #42
20160368111
2016-12-22

Equipment and grinding machine for the grinding of external rings of roller bearings

 #43
20160250736
2016-09-01

Multi-angle automated polishing system and polishing method

 #44
20160052105
2016-02-25

AUXILIARY EQUIPMENT FOR VALVE GRINDING

 #45
20150328745
2015-11-19

MACHINE TOOL WITH SWIVELING TABLE

 #46
20150328733
2015-11-19

MACHINE TOOL WITH SWIVELING TABLE

 #47
20140273776
2014-09-18

Reinforcement ring for carrier head

 #48
20140199923
2014-07-17

Apparatus for surface finishing workpieces and chucking device of an apparatus of this kind

 #49
20140045411
2014-02-13

METHODS OF AND APPARATUS FOR PRODUCING WAFERS

 #50
20140030850
2014-01-30

Package substrate processing method

 #51
20130011937
2013-01-10

Method for wafer back-grinding control

 #52
20120309275
2012-12-06

Membrane assembly and carrier head having the membrane assembly

 #53
20120295518
2012-11-22

Method for mounting an optical lens to be polished

 #54
20120244789
2012-09-27

VACUUM DEVICE BY USING CENTRIFUGAL RESOURCES

 #55
20120238187
2012-09-20

Method for grinding the main and rod bearing of a crankshaft by external cylindrical grinding

 #56
20120126472
2012-05-24

Sheet for mounting a workpiece

 #57
20120108152
2012-05-03

Electrode securing platens and electrode polishing assemblies incorporating the same

 #58
20120088316
2012-04-12

System and method for wafer back-grinding control

 #59
20120021674
2012-01-26

Grinding or polishing apparatus and method for operating it

 #60
20110281509
2011-11-17

Holding jig, semiconductor wafer grinding method, semiconductor wafer protecting structure and semiconductor wafer grinding method and semiconductor chip fabrication method using the structure

 #61
20110101504
2011-05-05

Methods of grinding semiconductor wafers having improved nanotopology

 #62
20110090456
2011-04-21

Method for manufacturing spectacle lenses according to a prescription

 #63
20100323590
2010-12-23

GRINDING MACHINE FOR BEARING RINGS

 #64
20100282036
2010-11-11

Cylindrical grinding apparatus and method for grinding

 #65
20100248589
2010-09-30

Precision guiding device in a machine for machining cylindrical components

 #66
20100216375
2010-08-26

Cylindrical grinder and cylindrical grinding method of ingot

 #67
20100170627
2010-07-08

Lens pad, lens pad manufacturing method, lens manufacturing method, and adhesive member

 #68
20100170371
2010-07-08

PRECISION GUIDANCE DEVICE IN A MACHINE FOR MACHINING CYLINDRICAL COMPONENTS

 #69
20100167627
2010-07-01

Precision machining apparatus and precision machining method

 #70
20100144248
2010-06-10

Double-side grinding apparatus for wafer and double-side grinding method

 #71
20100112915
2010-05-06

Lens holder

 #72
20100105297
2010-04-29

POLISHING APPARATUS

 #73
20100062691
2010-03-11

Substrate holding mechanism, substrate polishing apparatus and substrate polishing method

 #74
20100056028
2010-03-04

SUBSTRATE HOLDING APPARATUS AND POLISHING APPARATUS

 #75
20100003908
2010-01-07

Inclination angle adjusting device and workpiece attaching device

 #76
20100003907
2010-01-07

Inclination angle adjusting device and workpiece attaching device

 #77
20090239452
2009-09-24

Grinding apparatus

 #78
20090081852
2009-03-26

Holding jig, semiconductor wafer grinding method, semiconductor wafer protecting structure and semiconductor wafer grinding method and semiconductor chip fabrication method using the structure

 #79
20090061748
2009-03-05

Substrate holding apparatus

 #80
20090060688
2009-03-05

Suction apparatus, polishing apparatus, semiconductor device, and method of manufacturing a semiconductor device

 #81
20090023368
2009-01-22

POLISHING HEAD AND EDGE CONTROL RING THEREOF, AND METHOD OF INCREASING POLISHING RATE AT WAFER EDGE

 #82
20080318503
2008-12-25

Substrate holding mechanism, substrate polishing apparatus and substrate polishing method

 #83
20080119121
2008-05-22

Substrate holding apparatus and polishing apparatus

 #84
20080038992
2008-02-14

Apparatus and method for sequentially polishing and loading/unloading semiconductor wafers

 #85
20080020684
2008-01-24

Wafer clamping device for a double side grinder

 #86
20070161334
2007-07-12

Two-sided surface grinding apparatus

 #87
20070155295
2007-07-05

Lens layout block device

 #88
20070135019
2007-06-14

Eyeglass lens processing apparatus

 #89
20070128993
2007-06-07

Apparatus for cylindrically grinding workpieces

 #90
20060264156
2006-11-23

Apparatus and method for sequentially polishing and loading/unloading semiconductor wafers

 #91
20060262661
2006-11-23

Lean presser for holding eyeglass lens and eyeglass lens processing apparatus having the same

 #92
20060234609
2006-10-19

Substrate holding apparatus

 #93
20060205323
2006-09-14

Substrate holding mechanism, substrate polishing apparatus and substrate polishing method

 #94
20060128277
2006-06-15

Apparatus and method for chemical-mechanical polishing (CMP) head having direct pneumatic wafer polishing pressure

 #95
20060105680
2006-05-18

Apparatus and method for sequentially polishing and loading/unloading semiconductor wafers

 #96
20060099892
2006-05-11

Substrate holding apparatus and polishing apparatus

 #97
20060089088
2006-04-27

Holding apparatus for an optical element

 #98
20050227586
2005-10-13

Apparatus and method for sequentially polishing and loading/unloading semiconductor wafers

 #99
20050202757
2005-09-15

Device for the simultaneous double-side grinding of a workpiece in wafer form

 #100
20050153635
2005-07-14

Polishing head of chemical mechanical polishing apparatus and polishing method using the same

 #101
20050142993
2005-06-30

Multi-chamber carrier head with a flexible membrane

 #102
20050136809
2005-06-23

Wafer grinding apparatus

 #103
20050118935
2005-06-02

Substrate holding apparatus

 #104
20050107016
2005-05-19

Polishing equipment, and method of manufacturing semiconductor device using the equipment

 #105
20050107015
2005-05-19

Substrate holding device and polishing device

 #106
20050070210
2005-03-31

Apparatus and method for sequentially polishing and loading/unloading semiconductor wafers

 #107
20050064801
2005-03-24

Vertical type of double disc surface grinding machine

 #108
20050064703
2005-03-24

Substrate processing method

 #109
20050013550
2005-01-20

Clip disk for grinding optical fibers