Patents-Review.com
ClassID:

44853 ⎘

B24B49/105 - CPC Classification

Classification description:

Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving electrical means using eddy currents

Recent Application in this class:
#1
20260070181
2026-03-12

POLISHING APPARATUS AND POLISHING METHOD

 #2
20260027672
2026-01-29

EDDY CURRENT END-POINT DETECTION DEVICE AND METHOD

 #3
20260014663
2026-01-15

COMPENSATION FOR SUBSTRATE DOPING IN EDGE RECONSTRUCTION FOR IN-SITU ELECTROMAGNETIC INDUCTIVE MONITORING

 #4
20250326084
2025-10-23

EDDY CURRENT MONITORING TO DETECT VIBRATION IN POLISHING

 #5
20250256372
2025-08-14

MULTI-ZONE PROFILE CONTROL FOR INCONSISTENT UNDERLAYER

 #6
20250256371
2025-08-14

ENDPOINT CONTROL FOR INCONSISTENT UNDERLAYER

 #7
20250073847
2025-03-06

FILM THICKNESS SIGNAL PROCESSING APPARATUS, POLISHING APPARATUS, AND FILM THICKNESS SIGNAL PROCESSING METHOD

 #8
20240399536
2024-12-05

EDDY CURRENT SENSOR, EDDY CURRENT SENSOR ASSEMBLY, AND POLISHING APPARATUS

 #9
20240371646
2024-11-07

PROCESS CONTROL METHOD FOR PATTERN WAFER INDEX POLISHING

 #10
20240326196
2024-10-03

METHOD OF DETECTING POLISHING ENDPOINT, AND PROGRAM FOR DETECTING POLISHING ENDPOINT

 #11
20240300068
2024-09-12

POLISHING APPARATUS AND POLISHING METHOD

 #12
20240116152
2024-04-11

SWITCHING CONTROL ALGORITHMS ON DETECTION OF EXPOSURE OF UNDERLYING LAYER DURING POLISHING

 #13
20240014080
2024-01-11

Technique for training neural network for use in in-situ monitoring during polishing and polishing system

 #14
20230290691
2023-09-14

Trained neural network in in-situ monitoring during polishing and polishing system

 #15
20230286107
2023-09-14

EDDY CURRENT MONITORING TO DETECT VIBRATION IN POLISHING

 #16
20230213324
2023-07-06

Core configuration for in-situ electromagnetic induction monitoring system

 #17
20230182264
2023-06-15

PAD CONDITIONER CUT RATE MONITORING

 #18
20230085787
2023-03-23

POLISHING APPARATUS USING MACHINE LEARNING AND COMPENSATION FOR PAD THICKNESS

 #19
20220371153
2022-11-24

POLISHING APPARATUS AND POLISHING METHOD

 #20
20220063056
2022-03-03

Output signal processing apparatus for eddy current sensor

 #21
20210402559
2021-12-30

METHOD AND A SYSTEM FOR EVALUATING THE PHYSICAL CONSUMPTION OF A POLISHING PAD OF A CMP APPARATUS, AND CMP APPARATUS

 #22
20210379724
2021-12-09

Switching control algorithms on detection of exposure of underlying layer during polishing

 #23
20210379723
2021-12-09

COMPENSATION FOR SUBSTRATE DOPING IN EDGE RECONSTRUCTION FOR IN-SITU ELECTROMAGNETIC INDUCTIVE MONITORING

 #24
20210379722
2021-12-09

Profile control with multiple instances of contol algorithm during polishing

 #25
20210379721
2021-12-09

PROFILE CONTROL DURING POLISHING OF A STACK OF ADJACENT CONDUCTIVE LAYERS

 #26
20210358819
2021-11-18

Using a trained neural network for use in in-situ monitoring during polishing and polishing system

 #27
20210354265
2021-11-18

Technique for training neural network for use in in-situ monitoring during polishing and polishing system

 #28
20210101250
2021-04-08

Substrate polishing apparatus, method of creating thickness map, and method of polishing a substrate

 #29
20210001447
2021-01-07

Eddy current sensor

 #30
20200164486
2020-05-28

Substrate processing apparatus

 #31
20200147747
2020-05-14

Eddy current detection device and polishing apparatus

 #32
20200016722
2020-01-16

Polishing apparatus and calibration method

 #33
20190389031
2019-12-26

Method of identifying trajectory of eddy current sensor, method of calculating substrate polishing progress, method of stopping operation of substrate polishing apparatus, method of regularizing substrate polishing progress, program for executing the same, and non-transitory recording medium that records program

 #34
20190389028
2019-12-26

Compensation for substrate doping for in-situ electromagnetic inductive monitoring

 #35
20190358770
2019-11-28

Core configuration for in-situ electromagnetic induction monitoring system

 #36
20190299356
2019-10-03

Polishing apparatus using machine learning and compensation for pad thickness

 #37
20190283208
2019-09-19

Pad conditioner cut rate monitoring

 #38
20190193242
2019-06-27

Magnetic element and eddy current sensor using the same

 #39
20190134775
2019-05-09

Determination of gain for eddy current sensor

 #40
20190134774
2019-05-09

Polishing method and polishing apparatus

 #41
20190118333
2019-04-25

Polishing method and polishing apparatus

 #42
20190084119
2019-03-21

Chattering correction for accurate sensor position determination on wafer

 #43
20190009385
2019-01-10

Substrate polishing apparatus and method

 #44
20180311788
2018-11-01

Calibration method for eddy current sensor

 #45
20180264619
2018-09-20

Polishing method and polishing apparatus

 #46
20180164250
2018-06-14

EDDY CURRENT PROBE AND A METHOD OF USING THE SAME

 #47
20180122667
2018-05-03

Core configuration with alternating posts for in-situ electromagnetic induction monitoring system

 #48
20180111251
2018-04-26

Core configuration for in-situ electromagnetic induction monitoring system

 #49
20180016676
2018-01-18

Film thickness measuring device, polishing apparatus, film thickness measuring method and polishing method

 #50
20180001437
2018-01-04

Film thickness signal processing apparatus, and polishing apparatus

 #51
20170246723
2017-08-31

System and method for polishing substrate

 #52
20170148655
2017-05-25

Polishing method

 #53
20170095901
2017-04-06

Polishing apparatus

 #54
20170066104
2017-03-09

Method for Detecting And/Or Preventing Grind Burn

 #55
20170057051
2017-03-02

EDDY CURRENT SENSOR

 #56
20160346899
2016-12-01

System and method for polishing substrate

 #57
20160284615
2016-09-29

Polishing with measurement prior to deposition of outer layer

 #58
20160158908
2016-06-09

Determination of gain for eddy current sensor

 #59
20160151877
2016-06-02

Belt transmission device and grinding apparatus

 #60
20160074988
2016-03-17

PROCESSING MODULE, PROCESSING APPARATUS, AND PROCESSING METHOD

 #61
20160025647
2016-01-28

Method for detecting and/or preventing grind burn

 #62
20160018362
2016-01-21

Total integrated tube analysis

 #63
20150364389
2015-12-17

Polish apparatus, polish method, and method of manufacturing semiconductor device

 #64
20150352686
2015-12-10

Chemical mechanical polishing (CMP) platform for local profile control

 #65
20150298283
2015-10-22

SUBSTRATE TREATMENT DEVICE

 #66
20150285609
2015-10-08

Machine tool including affected layer detection sensor

 #67
20150273650
2015-10-01

Polishing device and polishing method

 #68
20150262893
2015-09-17

Method of correcting film thickness measurement value, film thickness corrector and eddy current sensor

 #69
20150258654
2015-09-17

Film thickness measuring device and polishing device

 #70
20150255357
2015-09-10

Polishing apparatus and polishing method

 #71
20150224623
2015-08-13

Adjusting eddy current measurements

 #72
20150133033
2015-05-14

Platen assembly, chemical-mechanical polisher, and method for polishing substrate

 #73
20150125971
2015-05-07

Polishing apparatus and polishing method

 #74
20150118766
2015-04-30

Determination of gain for eddy current sensor

 #75
20150118765
2015-04-30

Determination of gain for eddy current sensor

 #76
20150111468
2015-04-23

Lapping head with a sensor device on the rotating lapping head

 #77
20150038058
2015-02-05

Method for Detecting And/Or Preventing Grind Burn

 #78
20140102010
2014-04-17

Polishing pad for eddy current end-point detection

 #79
20140080229
2014-03-20

ADAPTIVE SEMICONDUCTOR PROCESSING USING FEEDBACK FROM MEASUREMENT DEVICES

 #80
20140051337
2014-02-20

Methods of removing electrical runout in a machine shaft surface

 #81
20140033830
2014-02-06

Grinding abnormality monitoring method and grinding abnormality monitoring device

 #82
20140030826
2014-01-30

POLISHING METHOD

 #83
20140027407
2014-01-30

Monitoring retaining ring thickness and pressure control

 #84
20140004628
2014-01-02

Manufacturing method of semiconductor device and polishing apparatus

 #85
20130295826
2013-11-07

Polishing pad for endpoint detection and related methods

 #86
20130260645
2013-10-03

Eddy current sensor and polishing method

 #87
20130231032
2013-09-05

Polishing pad with two-section window having recess

 #88
20130211765
2013-08-15

Method for measuring thickness of film on wafer edge

 #89
20130210173
2013-08-15

Multiple Zone Temperature Control for CMP

 #90
20130065493
2013-03-14

POLISHING MONITORING METHOD, POLISHING END POINT DETECTION METHOD, AND POLISHING APPARATUS

 #91
20130017761
2013-01-17

Method for detecting and/or preventing grind burn

 #92
20130009634
2013-01-10

Apparatus and method for measuring deposits inside a tube

 #93
20120276817
2012-11-01

EDDY CURRENT MONITORING OF METAL RESIDUE OR METAL PILLARS

 #94
20120276662
2012-11-01

EDDY CURRENT MONITORING OF METAL FEATURES

 #95
20120276661
2012-11-01

High sensitivity eddy current monitoring system

 #96
20120270477
2012-10-25

MEASUREMENT OF PAD THICKNESS AND CONTROL OF CONDITIONING

 #97
20120267893
2012-10-25

Electricity generation using electromagnetic radiation

 #98
20120171931
2012-07-05

POLISHING METHOD, POLISHING APPARATUS, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

 #99
20120129277
2012-05-24

Methods for monitoring thickness of a conductive layer

 #100
20120088438
2012-04-12

Eddy current sensor and polishing method and apparatus

 #101
20120083191
2012-04-05

Polishing pad for eddy current end-point detection

 #102
20120037145
2012-02-16

Steam generator

 #103
20110294402
2011-12-01

Eddy current system having an elongated core for in-situ profile measurement

 #104
20110265475
2011-11-03

METHOD AND APPARATUS FOR COLD STARTING A STEAM TURBINE

 #105
20110189925
2011-08-04

High Sensitivity Real Time Profile Control Eddy Current Monitoring System

 #106
20110189856
2011-08-04

High Sensitivity Real Time Profile Control Eddy Current Monitoring System

 #107
20110187124
2011-08-04

POWER GENERATING APPARATUS AND PROCESS

 #108
20110172964
2011-07-14

Method of processing steam generator tubes of nuclear power plant

 #109
20110136408
2011-06-09

Method for detecting and/or preventing grind burn

 #110
20110124269
2011-05-26

EDDY CURRENT SENSOR AND POLISHING METHOD AND APPARATUS

 #111
20110089163
2011-04-21

ACTIVATED-STEAM-GENERATING APPARATUS

 #112
20110022333
2011-01-27

Eddy current for the characterization of broached tube support plate blockage

 #113
20100301851
2010-12-02

Apparatus and method for searching eddy current of electric heat tube using measuring magnetic permeability in steam generator

 #114
20100197197
2010-08-05

Polishing pad thickness measuring method and polishing pad thickness measuring device

 #115
20100124792
2010-05-20

Eddy current sensor with enhanced edge resolution

 #116
20100112901
2010-05-06

Substrate polishing apparatus and substrate polishing method

 #117
20100099334
2010-04-22

Eddy current gain compensation

 #118
20100056028
2010-03-04

SUBSTRATE HOLDING APPARATUS AND POLISHING APPARATUS

 #119
20100035516
2010-02-11

Polishing method and apparatus

 #120
20090291618
2009-11-26

Tire grinding method and grinding device

 #121
20090263918
2009-10-22

Methods and apparatuses for determining thickness of a conductive layer

 #122
20090159591
2009-06-25

Superheated steam generation container, superheated steam generator, and superheated steam generation method

 #123
20090104847
2009-04-23

Polishing monitoring method and polishing apparatus

 #124
20090078583
2009-03-26

Electrochemical mechanical polishing method and electrochemical mechanical polishing apparatus

 #125
20090058409
2009-03-05

Method and device for forecasting polishing end point

 #126
20090036029
2009-02-05

Advanced automatic deposition profile targeting and control by applying advanced polish endpoint system feedback

 #127
20090036024
2009-02-05

CMP apparatus and method of polishing wafer using CMP

 #128
20090023361
2009-01-22

CMP APPARATUS AND METHOD OF POLISHING WAFER USING CMP

 #129
20080290865
2008-11-27

Method of forecasting and detecting polishing endpoint and the device thereof and real time film thickness monitoring method and the device thereof

 #130
20080268760
2008-10-30

Method and apparatus for improved chemical mechanical planarization pad with pressure control and process monitor

 #131
20080242195
2008-10-02

CMP SYSTEM HAVING AN EDDY CURRENT SENSOR OF REDUCED HEIGHT

 #132
20080242081
2008-10-02

Polishing method, polishing apparatus, and method for manufacturing semiconductor device

 #133
20080141953
2008-06-19

Superheated steam generator

 #134
20080139087
2008-06-12

Substrate polishing apparatus and substrate polishing method

 #135
20080119121
2008-05-22

Substrate holding apparatus and polishing apparatus

 #136
20080064301
2008-03-13

Method and Apparatus Of Eddy Current Monitoring For Chemical Mechanical Polishing

 #137
20080003936
2008-01-03

POLISHING PAD FOR EDDY CURRENT MONITORING

 #138
20070239309
2007-10-11

Polishing apparatus and polishing method

 #139
20070212987
2007-09-13

MONITORING A METAL LAYER DURING CHEMICAL MECHANICAL POLISHING

 #140
20070196994
2007-08-23

Method of fabricating semiconductor device including planarizing conductive layer using parameters of pattern density and depth of trenches

 #141
20070139043
2007-06-21

Eddy current apparatus and method for in-situ profile measurement

 #142
20070125133
2007-06-07

Washing machine

 #143
20070077862
2007-04-05

System for endpoint detection with polishing pad

 #144
20060278630
2006-12-14

Steam generation apparatus using induction heating and oven including the same

 #145
20060246822
2006-11-02

System and method for in-line metal profile measurement

 #146
20060236957
2006-10-26

Superheated steam producing device

 #147
20060226123
2006-10-12

Profile control using selective heating

 #148
20060214657
2006-09-28

Method of detecting characteristics of films using eddy current

 #149
20060194512
2006-08-31

Thickness control method and double side polisher

 #150
20060183407
2006-08-17

Platen and head rotation rates for monitoring chemical mechanical polishing

 #151
20060154570
2006-07-13

Monitoring a metal layer during chemical mechanical polishing

 #152
20060099892
2006-05-11

Substrate holding apparatus and polishing apparatus

 #153
20060025052
2006-02-02

Method and apparatus of eddy current monitoring for chemical mechanical polishing

 #154
20060009132
2006-01-12

Chemical mechanical polishing apparatus with non-conductive elements

 #155
20060009128
2006-01-12

Eddy current sensing of metal removal for chemical mechanical polishing

 #156
20050178761
2005-08-18

Superheated vapor generator

 #157
20050173259
2005-08-11

Endpoint system for electro-chemical mechanical polishing

 #158
20050124273
2005-06-09

Method of forming a polishing pad for endpoint detection

 #159
20050121141
2005-06-09

Real time process control for a polishing process

 #160
20050107015
2005-05-19

Substrate holding device and polishing device

 #161
20050095168
2005-05-05

Method for vaporizing a fluid using an electromagnetically responsive heating apparatus

 #162
20050072528
2005-04-07

Integration of sensor based metrology into semiconductor processing tools

 #163
20050048874
2005-03-03

System and method for in-line metal profile measurement

 #164
20050042975
2005-02-24

Platen and head rotation rates for monitoring chemical mechanical polishing

 #165
20050034490
2005-02-17

Washing machine

 #166
20050024047
2005-02-03

Eddy current system for in-situ profile measurement