44496 ⎘
Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor; Single-purpose machines or devices for grinding end-faces, e.g. of gauges, rollers, nuts, piston rings for simultaneously grinding opposite and parallel end faces, e.g. double disc grinders
MACHINE TOOL FOR GRINDING DISCS
#2Double-side or one-side machine tool
#3AN APPARATUS FOR WORKING OPPOSITE ARRANGED SURFACES
#4Assembly and method for loading parts to be treated in a single-side or double-side treatment machine
#5Dual-surface polishing device and dual-surface polishing method
#6Method for producing reinforced glass, reinforced glass and electronic device
#7Flexible sanding device for cylinder rock specimen
#8Carrier ring, grinding device, and grinding method
#9Manufacturing method of carrier for double-side polishing apparatus and method of double-side polishing wafer
#10Double disc surface grinding machine and grinding method
#11DOUBLE-FACE POLISHING DEVICE AND METHOD CAPABLE OF CONTROLLING RIGIDITY OF POLISHING PAD THROUGH CLUSTER DYNAMIC MAGNETIC FIELD
#12Grinding apparatus and grinding method
#13Workpiece double-disc grinding method
#14Method for grinding spring with high quality and high efficiency
#15Manufacturing method of honeycomb structure, and grinding wheel
#16Double disc surface grinding machine and grinding method
#17Wafer polishing apparatus
#18Method of producing carrier for use in double-side polishing apparatus and method of double-side polishing wafers
#19Compression line spring grinding device
#20Method for manufacturing a roller, adapted to equip a mechanical system forming a cam follower or a rocker arm
#21Apparatus and method for grinding compression line spring
#22Double-disc grinding apparatus and workpiece double-disc grinding method
#23Horizontal double disc surface grinding machine
#24Method of grinding spring ends and spring end grinding machine
#25Method for processing wafer
#26Connectors and methods for manufacturing connectors
#27Grinding machine for the grinding of spring ends
#28Computer numerical control machine tool for grinding two sides of a plane by shifting self-rotation and ultrasonic vibration
#29GRINDING APPARATUS AND GRINDING METHOD
#30Grinding wheel dressing system
#31LAPPING CARRIER AND METHOD OF USING THE SAME
#32Device and Method for Determining the Position of a Working Surface of a Working Disc
#33Method for the simultaneous material-removing processing of both sides of at least three semiconductor wafers
#34Fixed abrasive-grain processing device, method of fixed abrasive-grain processing, and method for producing semiconductor wafer
#35Method For the Material-Removing Machining of Very Thin Work Pieces in a Double Sided Grinding Machine
#36Work feeder for roller end face working machine, roller end face working machine and rollers for roller bearing
#37Apparatus for double-sided, grinding machining of flat workpieces
#38Method of making conductive Group lll Nitride single crystal substrate
#39Substrate composed of silicon carbide with thin film, semiconductor device, and method of manufacturing a semiconductor device
#40Method and grinding machine for the complete grinding of short and/or rod-shaped workpieces
#41METHOD FOR MANUFACTURING GLASS SUBSTRATE FOR MAGNETIC RECORDING MEDIUM
#42Methods of grinding semiconductor wafers having improved nanotopology
#43SURFACE GRINDING MACHINE AND METHOD FOR ADJUSTING A SURFACE GRINDING MACHINE
#44Method for manufacturing spacers for spindle device
#45Method of grinding bar-shaped workpieces, grinding machine for carrying out the method, and grinding cell in twin arrangement
#46Double-side grinding apparatus for wafer and double-side grinding method
#47Double side polishing method and apparatus
#48Method for the simultaneous double-sided material removal processing of a plurality of semiconductor wafers
#49METHOD FOR PRODUCING SEMICONDUCTOR WAFER
#50METHOD FOR PRODUCING SEMICONDUCTOR WAFER
#51METHOD FOR PRODUCING SEMICONDUCTOR WAFER
#52Method of grinding semiconductor wafers, grinding surface plate, and grinding device
#53Brake disk braking surface processing device
#54Semiconductor wafer, apparatus and process for producing the semiconductor wafer
#55Method for grinding semiconductor wafers
#56Machining machine with means for acquiring machining parameters
#57BRAKE ROTOR DEGLAZING TOOL
#58Initial position setting method of grinding wheel in vertical double disc surface grinding machine
#59Sintered rare earth magnetic alloy wafer surface grinding machine
#60Two-side working machine
#61Wafer clamping device for a double side grinder
#62Method of processing antifriction bearing unit for wheel
#63Two-sided surface grinding apparatus
#64Method of adhering polishing pads and jig for adhering the same
#65Production method for semiconductor wafer
#66Dressing method in vertical duplex-head surface grinding machine
#67Truing method for grinding wheel
#68Method of processing antifriction bearing unit for wheel
#69Method of machining a brake disc
#70Sintered rare earth magnetic alloy wafer and wafer surface growing machine
#71Both-side grinding method and both-side grinding machine for thin disc work
#72Semiconductor wafer, apparatus and process for producing the semiconductor wafer
#73Method of processing antifriction bearing unit for wheel
#74Device and method for surface working
#75Grinding method for vertical type of double disk surface grinding machine
#76Method and apparatus for removing coatings applied to surfaces of a substrate
#77Vertical type of double disc surface grinding machine