44527 ⎘
Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of thin, brittle parts, e.g. semiconductors, wafers
EDGE POLISHING DRUM OF WAFER, EDGE POLISHING EQUIPMENT INCLUDING THE SAME, AND METHOD FOR POLISHING EDGE OF WAFER
#2METHOD OF PROCESSING WAFER AND METHOD OF MANUFACTURING PROCESSED WAFER
#3METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MANUFACTURING APPARATUS
#4SYSTEMS AND METHODS FOR PROCESSING SEMICONDUCTOR WAFERS USING FRONT-END PROCESSED WAFER GLOBAL GEOMETRY METRICS
#5EDGE POLISHING DRUM FOR WAFERS AND EDGE POLISHING EQUIPMENT FOR WAFERS INCLUDING THE SAME
#6WAFER EDGE POLISHING DRUM AND WAFER EDGE POLISHING EQUIPMENT INCLUDING THE SAME
#7POLISHING APPARATUS, POLISHING METHOD, AND POLISHING HEAD
#8GRINDING APPARATUS
#9WORKPIECE PROCESSING METHOD AND PROCESSING APPARATUS
#10WORKPIECE PROCESSING METHOD
#11GRINDING METHOD
#12WORKPIECE EDGE GRINDING MACHINE AND METHOD
#13CHAMFER FORMATION ON DATA STORAGE DISC SUBSTRATES
#14CHUCK TABLE AND EDGE TRIMMING APPARATUS
#15POLISHING APPARATUS AND POLISHING METHOD
#16CHEMICAL MECHANICAL POLISHING APPARATUS
#17METHOD FOR MANUFACTURING SEMICONDUCTOR WAFER
#18METHOD OF PROCESSING WAFER AND WAFER PROCESSING APPARATUS
#19APPARATUS FOR FILM REMOVAL
#20METHOD OF FORMING TRUER
#21System and method for processing silicon wafers
#22DEVICE FOR POLISHING OUTER PERIPHERY OF WAFER
#23SYSTEMS AND METHODS FOR PROCESSING SEMICONDUCTOR WAFERS USING FRONT-END PROCESSED WAFER GLOBAL GEOMETRY METRICS
#24SYSTEMS AND METHODS FOR PROCESSING SEMICONDUCTOR WAFERS USING FRONT-END PROCESSED WAFER EDGE GEOMETRY METRICS
#25POLISHING METHOD
#26Method for manufacturing semiconductor device and apparatus for manufacturing semiconductor device
#27SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
#28EDGE TRIMMING METHOD
#29Cleaning module, substrate processing apparatus including cleaning module, and cleaning method
#30Substrate processing apparatus and substrate processing method
#31Substrate processing apparatus, polishing head, and substrate processing method
#32Method of helical chamfer machining silicon wafer
#33Substrate processing apparatus and substrate processing method
#34Method for preparing silicon carbide wafer and silicon carbide wafer
#35Polishing device
#36Method for evaluating edge shape of silicon wafer, apparatus for evaluating thereof, silicon wafer, method for selecting and method for manufacturing thereof
#37Wafer grinding wheel
#38Grinding method and OGS substrate
#39Method and apparatus for manufacturing semiconductor device
#40Chemical mechanical polishing apparatus
#41POLISHING APPARATUS AND POLISHING METHOD FOR POLISHING A PERIPHERY OF A SUBSTRATE
#42Polishing apparatus and polishing method
#43LED wafer processing method
#44Display device and method for manufacturing the same
#45Substrate processing apparatus and substrate processing method
#46SUBSTRATE PROCESSING METHOD
#47Method of polishing silicon wafer including notch polishing process and method of producing silicon wafer
#48Chamfered silicon carbide substrate and method of chamfering
#49Wafer edge polishing apparatus and method
#50Substrate processing apparatus and control method
#51Method for wafer trimming
#52Apparatus and method for processing a surface of a substrate
#53Polishing method and polishing apparatus
#54Wafer processing method
#55Substrate processing method and apparatus
#56Abrasive rotary tool with abrasive agglomerates
#57Flexible abrasive rotary tool
#58Polishing apparatus and polishing method
#59Polishing apparatus and pressing pad for pressing polishing tool
#60Stepped wafer and method for manufacturing stepped wafer
#61Polishing apparatus and polishing method
#62Rubbing alignment method and apparatus
#63Rectangular substrate for imprint lithography and making method
#64Grinding method, OGS substrate and manufacturing method of OGS mother substrate
#65Substrate processing method and substrate processing apparatus
#66Vacuum chuck, beveling/polishing device, and silicon wafer beveling/polishing method
#67Polishing apparatus for detecting abnormality in polishing of a substrate
#68Method for processing semiconductor wafer, method for manufacturing bonded wafer, and method for manufacturing epitaxial wafer
#69Polishing apparatus and polishing method
#70Silicon carbide single crystal substrate and method for manufacturing the same
#71Method for growing monocrystalline silicon and monocrystalline silicon ingot prepared thereof
#72Method for manufacturing SiC epitaxial wafer and SiC epitaxial wafer
#73Polishing apparatus
#74Polishing apparatus and polishing method
#75Calibration apparatus and calibration method
#76SiC substrate separating method
#77Wafer back-side polishing system and method for integrated circuit device manufacturing processes
#78METHOD FOR FORMING WAFER
#79Polishing method of polishing a substrate
#80Method for cutting display panel
#81Polishing apparatus and polishing method
#82Method for manufacturing semiconductor wafer
#83Substrate processing apparatus and substrate processing method
#84Chamfering apparatus and method for manufacturing notchless wafer
#85Wafer polishing apparatus
#86Wafer back-side polishing system and method for integrated circuit device manufacturing processes
#87Apparatus for detecting abnormality in polishing of a substrate
#88Adjusting a substrate polishing condition
#89Electronic grade glass substrate and making method
#90Rectangular substrate for imprint lithography and making method
#91Polishing method
#92Attachment method
#93Method for polishing photonic chips
#94Polishing apparatus
#95Modifying substrate thickness profiles
#96Edge finishing apparatus
#97Polishing apparatus and polishing method
#98Outer periphery polishing apparatus for disc-shaped workpiece
#99METHOD FOR PRODUCING POLISHED-ARTICLE
#100Electric sharpener for ceramic and metal blades
#101Wafer back-side polishing system and method for integrated circuit device manufacturing processes
#102Silicon carbide single-crystal substrate
#103Silicon carbide single-crystal substrate
#104Semiconductor wafer manufacturing method
#105Polishing apparatus and polishing method
#106Polishing apparatus and polishing method
#107Substrate peripheral portion measuring device, and substrate peripheral portion polishing apparatus
#108Dicing Device and Dicing Method
#109Method for grinding workpieces, in particular for centering grinding of workpieces such as optical lenses
#110Polishing apparatus
#111Rubbing device and rubbing method
#112Polishing apparatus and polishing method
#113Wafer polishing method
#114Polishing apparatus
#115Wafer polishing tool using abrasive tape
#116Wafer edge trimming tool using abrasive tape
#117POLISHING APPARATUS AND METHOD OF POLISHING SEMICONDUCTOR WAFER
#118Method and apparatus for cleaning grinding work chuck using a vacuum
#119Polishing apparatus and polishing method
#120Adjusting a substrate polishing condition
#121Flat SiC semiconductor substrate
#122Polishing method involving a polishing member polishing at angle tangent to the substrate rotational direction
#123Method of detecting abnormality in polishing of a substrate and polishing apparatus
#124Beveling grindstone
#125Grinding apparatus and method for fabrication of liquid crystal display device
#126SILICON CARBIDE SINGLE-CRYSTAL SUBSTRATE AND METHOD FOR MANUFACTURING SAME
#127Method and apparatus for wafer backgrinding and edge trimming on one machine
#128Grinding wheel for wafer edge trimming
#129WAFER PROCESSING METHOD
#130Method and system for finishing glass sheets
#131Silicon carbide single-crystal substrate and method for manufacturing same
#132SAPPHIRE MATERIAL AND PRODUCTION METHOD THEREOF
#133Electronic grade glass substrate and making method
#134Method and apparatus for performing a polishing process in semiconductor fabrication
#135Glass edge finishing method
#136MANUFACTURING METHOD FOR SEMICONDUCTOR WAFER
#137Polishing apparatus and polishing method
#138Polishing apparatus and polishing method
#139Grinding wheel truing tool and manufacturing method thereof, and truing apparatus, method for manufacturing grinding wheel and wafer edge grinding apparatus using the same
#140METHOD OF MANUFACTURING MAGNETIC RECORDING MEDIUM GLASS SUBSTRATE
#141Polishing apparatus and polishing method
#142Apparatus and method for surface grinding and edge trimming workpieces
#143Method of polishing a substrate using a polishing tape having fixed abrasive
#144SUBSTRATE STRUCTURE AND PANEL STRUCTURE
#145METHOD OF MANUFACTURING GLASS SUBSTRATE FOR MAGNETIC STORAGE MEDIUM
#146METHOD FOR CHAMFERING WAFER
#147Substrate polishing method and device
#148Grinding Tool For Trapezoid Grinding Of A Wafer
#149Semiconductor and solar wafers
#150Edge finishing apparatus
#151Method of preparing an edge-strengthened article
#152Chamfered freestanding nitride semiconductor wafer and method of chamfering nitride semiconductor wafer
#153WAFER POLISHING APPARATUS
#154Method for polishing silicon wafer, method for producing silicon wafer, apparatus for polishing disk-shaped workpiece, and silicon wafer
#155POLISHING METHOD
#156Polishing apparatus, polishing method and pressing member for pressing a polishing tool
#157Grinder, grinding method using the grinder, manufacturing method of display device using the grinding method, and display device manufactured by the manufacturing method
#158Method for manufacturing semiconductor device
#159Polishing apparatus
#160Wafer edge cleaning
#161Method and apparatus for polishing a substrate having a grinded back surface
#162Composition and method for polishing bulk silicon
#163Polishing apparatus
#164POLISHING APPARATUS
#165Polishing apparatus and polishing method
#166Method for polishing the edge of a semiconductor wafer
#167Chamfering apparatus for chamfering glass substrates
#168Grinding apparatus and method for fabrication of liquid crystal display device
#169Method for manufacturing a glass substrate for a magnetic disc
#170Method of surface-finishing glass substrate for magnetic disks and glass substrate for magnetic disks
#171SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS
#172Device for polishing the edge of a semiconductor substrate
#173POLISHING APPARATUS AND POLISHING METHOD
#174Polishing apparatus and substrate processing apparatus
#175METHOD OF AND APPARATUS FOR ABRADING OUTER PERIPHERAL PARTS OF A SEMICONDUCTOR WAFER
#176METHODS AND APPARATUS FOR POLISHING AN EDGE AND/OR NOTCH OF A SUBSTRATE
#177METHODS AND APPARATUS TO MINIMIZE THE EFFECT OF TAPE TENSION IN ELECTRONIC DEVICE POLISHING
#178METHODS AND APPARATUS FOR POLISHING A NOTCH OF A SUBSTRATE
#179Nitride semiconductor substrate and method of fabricating the same
#180Substrate processing apparatus
#181METHOD OF PRODUCING SEMICONDUCTOR WAFER
#182Chamfering apparatus for silicon wafer, method for producing silicon wafer, and etched silicon wafer
#183Wafer polishing method and wafer produced thereby
#184Wafer polishing device and method
#185APPARATUS AND METHODS FOR USING A POLISHING TAPE CASSETTE
#186Polishing apparatus
#187Apparatus for polishing edge surface of glass substrate for magnetic recording media, and process for producing glass substrate
#188Chamfered freestanding nitride semiconductor wafer and method of chamfering nitride semiconductor wafer
#189Wafer polishing method and apparatus
#190Wafer production method
#191Method for machining chamfer portion of semiconductor wafer and method for correcting groove shape of grinding stone
#192Grinding wheel truing tool and manufacturing method thereof, and truing apparatus, method for manufacturing grinding wheel and wafer edge grinding apparatus using the same
#193Polishing apparatus and polishing method
#194APPARATUS AND METHOD OF MANUFACTURING AN INTEGRATED CIRCUIT
#195Method For Producing A Semiconductor Wafer With A Polished Edge
#196Substrate treating method and substrate treating apparatus
#197Polishing apparatus and substrate processing apparatus
#198Method of manufacturing disk substrate
#199Apparatus for polishing a wafer and method for detecting a polishing end point by the same
#200Device for polishing peripheral edge of semiconductor wafer
#201WAFER EDGE CLEANING
#202Chamfering apparatus for chamfering glass substrates
#203Method of manufacturing glass substrate
#204METHODS AND APPARATUS FOR POLISHING AN EDGE OF A SUBSTRATE
#205METHODS AND APPARATUS FOR POLISHING AN EDGE OF A SUBSTRATE
#206METHODS AND APPARATUS FOR PROCESSING A SUBSTRATE
#207Wafer edge cleaning
#208METHODS AND APPARATUS FOR POLISHING AN EDGE OF A SUBSTRATE
#209POLISHING APPARATUS AND POLISHING METHOD
#210SUBSTRATE PROCESSING APPARATUS
#211METHODS AND APPARATUS FOR PROCESSING A SUBSTRATE
#212Polishing apparatus and polishing method
#213Polishing apparatus and polishing method
#214Chamfering apparatus, a grinding wheel, and a chamfering method
#215METHODS AND APPARATUS FOR POLISHING A NOTCH OF A SUBSTRATE USING A POLISHING PAD
#216METHODS AND APPARATUS FOR USING A ROLLING BACKING PAD FOR SUBSTRATE POLISHING
#217Methods and apparatus for removal of films and flakes from the edge of both sides of a substrate using backing pads
#218METHODS AND APPARATUS FOR POLISHING A NOTCH OF A SUBSTRATE BY SUBSTRATE VIBRATION
#219METHODS AND APPARATUS TO CONTROL SUBSTRATE BEVEL AND EDGE POLISHING PROFILES OF FILMS
#220METHODS AND APPARATUS FOR SUBSTRATE EDGE POLISHING USING A POLISHING ARM
#221METHODS AND APPARATUS FOR USING A BEVEL POLISHING HEAD WITH AN EFFICIENT TAPE ROUTING ARRANGEMENT
#222METHODS AND APPARATUS FOR LOW COST AND HIGH PERFORMANCE POLISHING TAPE FOR SUBSTRATE BEVEL AND EDGE POLISHING IN SEMINCONDUCTOR MANUFACTURING
#223METHODS AND APPARATUS FOR IDENTIFYING A SUBSTRATE EDGE PROFILE AND ADJUSTING THE PROCESSING OF THE SUBSTRATE ACCORDING TO THE IDENTIFIED EDGE PROFILE
#224Substrate Peripheral Portion Measuring Device, and Substrate Peripheral Portion Polishing Apparatus
#225SUBSTRATE PROCESSING METHOD
#226METHODS AND APPARATUS FOR CLEANING A SUBSTRATE EDGE USING CHEMICAL AND MECHANICAL POLISHING
#227Substrate processing apparatus
#228Polishing method and polishing apparatus
#229Substrate processing apparatus
#230GRINDING DEVICE AND METHOD OF GRINDING
#231Grinding method of a disk-shaped substrate and grinding apparatus
#232Chemical mechanical polishing apparatus
#233Method of polishing a semiconductor wafer
#234Polishing apparatus, polishing brush and manufacturing method of disk-shaped substrate
#235Polishing method for semiconductor wafer and polishing apparatus for semiconductor wafer
#236Semiconductor Wafer Fabricating Method and Semiconductor Wafer Mirror Edge Polishing Method
#237Polishing method and polishing device
#238Method for producing semiconductor wafer and semiconductor wafer
#239Semiconductor wafers with highly precise edge profile and method for producing them
#240Method for Polishing Silicon Wafer, Method for Producing Silicon Wafer, Apparatus for Polishing Disk-Shaped Workpiece, and Silicon Wafer
#241APPARATUS AND METHOD FOR MODIFYING AN EDGE
#242COMPRESSIBLE ABRASIVE ARTICLE
#243Substrate processing method and substrate processing apparatus
#244Method of Manufacturing Silicon Substrates for Magnetic Recording Medium, Silicon Substrate for Magnetic Recording Medium, Magnetic Recording Medium, and Magnetic Recording Apparatus
#245Method of Polishing the Inner Peripheral End Surfaces of Substrates for a Recording Medium Using a Brush
#246Method of polishing end surfaces of a substrate for a recording medium by a grain flow processing method
#247Method of polishing the inner peripheral end surfaces of substrates for a recording medium using a brush
#248METHODS AND APPARATUS FOR POLISHING AN EDGE OF A SUBSTRATE
#249Wafer polishing apparatus
#250Silicon substrate for magnetic recording medium, manufacturing method thereof, and magnetic recording medium
#251Method of processing a substrate
#252Methods and apparatus for processing a substrate
#253Methods and apparatus for processing a substrate
#254Semiconductor wafer polishing apparatus, and method of polishing semiconductor wafer
#255WAFER PROCESSING METHOD AND WAFER PROCESSING APPARATUS
#256Wafer-edge polishing system
#257Production method for semiconductor wafer
#258Semiconductor wafer and process for producing a semiconductor wafer
#259Substrate processing method and semiconductor device manufacturing method
#260Polishing tape and method
#261Apparatus for polishing edge surface of glass substrate for magnetic recording media, and process for producing glass substrate
#262Chamfered freestanding nitride semiconductor wafer and method of chamfering nitride semiconductor wafer
#263Shaped polishing pads for beveling microfeature workpiece edges, and associated systems and methods
#264Shaped polishing pads for beveling microfeature workpiece edges, and associated systems and methods
#265Polishing machine
#266Wafer chuck
#267Shaped polishing pads for beveling microfeature workpiece edges, and associate system and methods
#268Substrate processing method and substrate processing apparatus
#269Fixed-abrasive chemical-mechanical planarization of titanium nitride
#270Grinding wheel, grinding apparatus and grinding method
#271Semiconductor structure and fabrication therefor
#272Fixed-abrasive chemical-mechanical planarization of titanium nitride
#273Polishing apparatus and method
#274Method for manufacturing semiconductor device and polishing apparatus
#275Method of processing a substrate
#276Processing tool, method of producing processing tool, processing method and processing apparatus
#277Method of processing a substrate
#278Fixed-abrasive chemical-mechanical planarization of titanium nitride
#279Wafer edge cleaning
#280Semiconductor wafer manufacturing method and wafer
#281Edge finishing process for glass or ceramic disks used in disk drive data storage devices
#282Glass or ceramic disk which is not chemically strengthened for use in disk drive data storage devices
#283Method of truing chamfering grindstone and chamfering device
#284Clamping jig for glass substrate, buffer sheet, method for processing glass substrate, and glass substrate
#285Chamfer formation on data storage disc substrates