ClassID:

45000

B24D3/28 - page 2 - CPC Classification

Classification description:

Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic Resins or natural or synthetic macromolecular compounds

Recent Application in this class:
#301
20070032182
2007-02-08

Polishing pad and method of fabricating semiconductor substrate using the pad

#302
20070023026
2007-02-01

Dicing blade

#303
20060288649
2006-12-28

Processes for forming coated abrasive products

#304
20060288648
2006-12-28

Composition, treated backing, and abrasive articles containing the same

#305
20060276113
2006-12-07

Polishing cloth, polishing apparatus and method of manufacturing semiconductor devices

#306
20060264163
2006-11-23

Block tool for surface finishing operations and method of obtaining the same

#307
20060194038
2006-08-31

Abrasive articles and methods for making same

#308
20060183412
2006-08-17

Polishing pad

#309
20060156634
2006-07-20

Method of using abrasive product

#310
20060148393
2006-07-06

Polishing pad and cushion layer for polishing pad

#311
20060148392
2006-07-06

Method of producing polishing pad

#312
20060148391
2006-07-06

Polishing pad and cushion layer for polishing pad

#313
20060143989
2006-07-06

Fine abrasive paper backing material and method of making thereof

#314
20060142435
2006-06-29

Polymer composition and method of making the same

#315
20060122287
2006-06-08

Polyol composition for two-component curable abrasive foam, composition for two-component curable abrasive foam, abrasive foam, and method for producing abrasive foam

#316
20060116059
2006-06-01

Fiber embedded polishing pad

#317
20060116055
2006-06-01

Resin bond grindstone and method of manufacturing a semiconductor chip using the grindstone

#318
20060116054
2006-06-01

Polishing body

#319
20060075686
2006-04-13

Polishing body

#320
20060048704
2006-03-09

Apparatus for making abrasive article

#321
20060048454
2006-03-09

Abrasive product

#322
20060026904
2006-02-09

Composition, coated abrasive article, and methods of making the same

#323
20060010780
2006-01-19

Abrasive tools made with a self-avoiding abrasive grain array

#324
20050263406
2005-12-01

Polishing pad for electrochemical mechanical polishing

#325
20050260937
2005-11-24

Method of probe tip shaping and cleaning

#326
20050245174
2005-11-03

Method of processing a substrate

#327
20050235575
2005-10-27

Abrasive article and manufacturing method thereof

#328
20050225001
2005-10-13

Foamed polishing sheet

#329
20050221741
2005-10-06

Polymeric polishing pad having continuously regenerated work surface

#330
20050210756
2005-09-29

Coated abrasive products and processes for forming same

#331
20050181715
2005-08-18

Segmented superabrasive grinding device

#332
20050152652
2005-07-14

Process for finish-abrading optical-fiber-connector end-surface

#333
20050130569
2005-06-16

Nonwoven abrasive material

#334
20050130568
2005-06-16

Abrasive product, method of making and using the same, and apparatus for making the same

#335
20050107011
2005-05-19

Abrasive product, method of making and using the same, and apparatus for making the same

#336
20050107007
2005-05-19

Polishing pad process for producing the same and method of polishing

#337
20050081455
2005-04-21

Abrasive product, method of making and using the same, and apparatus for making the same

#338
20050079805
2005-04-14

Fiber embedded polishing pad

#339
20050076577
2005-04-14

Abrasive tools made with a self-avoiding abrasive grain array

#340
20050060947
2005-03-24

Compositions for abrasive articles

#341
20050060946
2005-03-24

Structured abrasive with parabolic sides

#342
20050060944
2005-03-24

Method of making a coated abrasive

#343
20050060941
2005-03-24

Abrasive article and methods of making the same

#344
20050054275
2005-03-10

Web-format polishing pads and methods for manufacturing and using web-format polishing pads in mechanical and chemical-mechanical planarization of microelectronic substrates

#345
20050020082
2005-01-27

Polishing pads for chemical mechanical planarization

#346
15883695
2021-12-21

Method for making agglomerate particles

#347
14304684
2015-10-06

Platen for wafer polishing having diamond-ceramic composites