ClassID:

45033

B24D7/12 - CPC Classification

Classification description:

Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor with apertures for inspecting the surface to be abraded

Recent Application in this class:
#1
20250010428
2025-01-09

POLISHING APPARATUS AND POLISHING METHOD

#2
20150031271
2015-01-29

Double-side polishing apparatus

#3
20140080232
2014-03-20

Peak-based endpointing for chemical mechanical polishing

#4
20140004773
2014-01-02

Processing end point detection method, polishing method, and polishing apparatus

#5
20110287694
2011-11-24

Peak-based endpointing for chemical mechanical polishing

#6
20110130073
2011-06-02

Wafer polishing method and double-side polishing apparatus

#7
20100015889
2010-01-21

Processing end point detection method, polishing method, and polishing apparatus

#8
20090137187
2009-05-28

Diagnostic Methods During CMP Pad Dressing and Associated Systems

#9
20080099443
2008-05-01

Peak-based endpointing for chemical mechanical polishing

#10
20080076330
2008-03-27

CHEMICAL MECHANICAL POLISHING WITH NAPPED POROMERIC

#11
20080020690
2008-01-24

REDUCING POLISHING PAD DEFORMATION

#12
20070021043
2007-01-25

Chemical mechanical polishing apparatus with rotating belt

#13
20060189268
2006-08-24

Grinding disc for grinding machines

#14
20060063471
2006-03-23

CMP pad having a streamlined windowpane

#15
20060040597
2006-02-23

Grinding or polishing arrangement

#16
20050266773
2005-12-01

Apparatuses and methods for in-situ optical endpointing on web-format planarizing machines in mechanical or chemical-mechanical planarization of microelectronic-device substrate assemblies

#17
20050255798
2005-11-17

Grinding or polishing arrangement

#18
20050026542
2005-02-03

Detection system for chemical-mechanical planarization tool