45034 ⎘
Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor Zonally-graded wheels; Composite wheels comprising different abrasives
System and Method for a Grinding Wheel
#2GRINDING WHEEL AND GRINDING METHOD
#3Dynamic regulation of contact pressures in a blade sharpening system
#4Reciprocal segment abrasive cutting tool
#5Endpoint detection for chemical mechanical polishing based on spectrometry
#6PRECISION SHAPED GRAIN ABRASIVE RAIL GRINDING TOOL AND MANUFACTURING METHOD THEREFOR
#7Dynamic regulation of contact pressures in a blade sharpening system
#8Abrasive articles having a plurality of portions and methods for forming same
#9BLADE SHARPENING SYSTEM FOR A LOG SAW MACHINE
#10GRINDING AND/OR CUTTING TOOL AND METHOD FOR GRINDING AND/OR CUTTING
#11Abrasive article and method of making the same
#12Abrasive articles having a plurality of portions and methods for forming same
#13RESIN BONDED-ABRASIVE ARTICLE HAVING MULTIPLE COLORS
#14Abrasive disk having excellent workability and stability and process for producing the same
#15Endpointing detection for chemical mechanical polishing based on spectrometry
#16Rough grinding wheel comprising a core
#17Polishing or grinding pad with multilayer reinforcement
#18TOOL FOR SANDING AND BUFFING AND METHOD OF USE
#19DEPRESSED CENTER GRINDING WHEEL
#20Multi-functional debur tool
#21Intelligent polisher/buffer with selective color-matching light
#22And manufacture of an abrasive polishing tool
#23GRINDSTONE AND GRINDING DEVICE
#24Endpointing detection for chemical mechanical polishing based on spectrometry
#25Grinding wheel
#26Grinding wheel
#27Manufacturing method of honeycomb structure, and grinding wheel
#28Blade sharpening system for a log saw machine
#29Customized polishing pads for CMP and methods of fabrication and use thereof
#30Method for wafer grinding
#31Endpointing detection for chemical mechanical polishing based on spectrometry
#32Customized polishing pads for CMP and methods of fabrication and use thereof
#33Abrasive article
#34Abrasive article reinforced by discontinuous fibers
#35Tool head and glass or glass ceramic article producible using the tool head
#36Blade sharpening system for a log saw machine
#37Spectra based endpointing for chemical mechanical polishing
#38Composite abrasive wheel
#39Multi-abrasive tool
#40Endpointing detection for chemical mechanical polishing based on spectrometry
#41Grinding Ring with Dual Function Grinding Segments
#42Apparatus for wafer grinding
#43Method and device for producing a base body with hard material particles
#44Grinding mechanism
#45Spectra based endpointing for chemical mechanical polishing
#46Grinding stone, manufacturing method of grinding stone, and manufacturing apparatus of grinding stone
#47Splicing technique for fixed abrasives used in chemical mechanical planarization
#48METHOD OF MAKING POLISHING PAD ASSEMBLY WITH GLASS OR CRYSTALLINE WINDOW
#49Composite pads for buffing and polishing painted vehicle body surfaces and other applications
#50Spectrum based endpointing for chemical mechanical polishing
#51Non-core drill bit
#52Polishing pad assembly with glass or crystalline window
#53Removable optical monitoring system for chemical mechanical polishing
#54Method of grinding semiconductor wafers, grinding surface plate, and grinding device
#55Semiconductor wafer, apparatus and process for producing the semiconductor wafer
#56Method of and device for abrasive machining and abrasive tool provided therefor
#57Substrate thickness measuring during polishing
#58Spectra based endpointing for chemical mechanical polishing
#59Abrasive Element
#60Customized polishing pads for CMP and methods of fabrication and use thereof
#61Polishing pad assembly with glass or crystalline window
#62Abrasive articles with novel structures and methods for grinding
#63Polishing system with optical head
#64Chemical Mechanical Polishing Pad
#65Substrate thickness measuring during polishing
#66Spectrum based endpointing for chemical mechanical polishing
#67Polishing pad and method of making
#68Polishing pad assembly with glass or crystalline window
#69Spectrum based endpointing for chemical mechanical polishing
#70Spectrum based endpointing for chemical mechanical polishing
#71Spectra based endpointing for chemical mechanical polishing
#72Polishing pad, method of manufacturing the polishing pad, and chemical mechanical polishing apparatus comprising the polishing pad
#73Wafer processing apparatus and wafer processing method using the same
#74Grinder wheel for liquid crystal display device and method of fabricating liquid crystal display device using the same
#75Customized polishing pads for CMP and methods of fabrication and use thereof
#76Pad conditioner for chemical mechanical polishing apparatus
#77Multiple cutting edged sanding wheel
#78CMP conditioner, method for arranging hard abrasive grains for use in CMP conditioner, and process for producing CMP conditioner
#79Grinding wheel
#80Glass drill bit
#81Chemical mechanical polish with multi-zone abrasive-containing matrix
#82Grinding wheel
#83Polishing pad assembly, apparatus for polishing a wafer including the polishing pad assembly and method for polishing a wafer using the polishing pad assembly
#84Abrasive composite tools having compositional gradients and associated methods
#85Polishing pad comprising hydrophobic region and endpoint detection port
#86Multi-phase polishing pad
#87Semiconductor wafer, apparatus and process for producing the semiconductor wafer
#88Chemical mechanical polishing apparatus
#89Device for the precision working of planar surfaces
#90Reciprocal segment abrasive cutting tool