ClassID:

46610

B26F1/28 - CPC Classification

Classification description:

Perforating; Punching; Cutting-out; Stamping-out; Apparatus therefor; Perforating by non-mechanical means, e.g. by fluid jet by electrical discharges

Recent Application in this class:
#1
20200054999
2020-02-20

Method and apparatus for making a nanopore in a membrane using an electric field applied via a conductive tip

#2
20190118281
2019-04-25

THROUGH-HOLE FORMING METHOD, THROUGH-HOLE FORMING APPARATUS, AND METHOD OF MANUFACTURING GLASS SUBSTRATE PROVIDED WITH THROUGH-HOLE

#3
20160168006
2016-06-16

Through-hole forming method, through-hole forming apparatus, and method of manufacturing glass substrate provided with through-hole

#4
20160151849
2016-06-02

Apparatus using electrochemical discharge machining process and method using the same

#5
20160009008
2016-01-14

Systems for and methods of manufacturing micro-structures

#6
20150143863
2015-05-28

Electro-hydraulic trimming of a part perimeter with multiple discrete pulses

#7
20130330506
2013-12-12

Method of generating high quality hole, recess or well in substrate

#8
20130213467
2013-08-22

PRODUCTION OF MICROHOLES

#9
20130206724
2013-08-15

Generation of holes using multiple electrodes

#10
20120231413
2012-09-13

ENDODONTIC INSTRUMENT AND METHOD OF MANUFACTURING

#11
20120138339
2012-06-07

METHOD OF PRODUCING AN ELECTRICALLY CONDUCTING VIA IN A SUBSTRATE

#12
20110304023
2011-12-15

Method of generating a hole or recess or well in a substrate

#13
20110278648
2011-11-17

Method of introducing a structure in a substrate

#14
20110193270
2011-08-11

SYSTEMS FOR AND METHODS OF MANUFACTURING MICRO-STRUCTURES

#15
20110042132
2011-02-24

METHOD OF PRODUCING AN ELECTRICALLY CONDUCTING VIA IN A SUBSTRATE

#16
20100314723
2010-12-16

MANUFACTURING OF OPTICAL STRUCTURES BY ELECTROTHERMAL FOCUSSING

#17
20100276409
2010-11-04

Electrothermal focussing for the production of micro-structured substrates

#18
20080047935
2008-02-28

Manufacturing and use of microperforated substrates

#19
20070138004
2007-06-21

Punch device for a substrate having a large breadth and small thickness

#20
20060096961
2006-05-11

Method for manufacturing a wire and a wire