49338 ⎘
Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame the mould cavity walls being lined with a film, e.g. release film
Method for manufacturing resin molded product
#2Method for manufacturing resin molded product
#3INJECTION-MOLDING METHOD AND LIQUID CONTAINER FOR A MOTOR VEHICLE
#4Method for manufacturing an electronic assembly and an electronic assembly
#5Electronic assembly
#6Method for manufacturing an electronic assembly and an electronic assembly
#7Mould, moulding apparatus and method for controlled overmoulding of a carrier with electronic components and moulded product
#8Semiconductor encapsulation system comprising a vacuum pump and a reservoir pump
#9MOLD RELEASE FILM, PROCESS FOR ITS PRODUCTION AND PROCESS FOR PRODUCING SEMICONDUCTOR PACKAGE
#10Process for producing package for mounting a semiconductor element and mold release film
#11MOLD RELEASE FILM AND PROCESS FOR PRODUCING SEALED BODY
#12Method for moulding and surface processing electronic components and electronic component produced with this method
#13Heat conductive insulating sheet, power module, and manufacturing method thereof
#14Wafer-level molding chase design
#15Mold release film and method of process for producing a semiconductor device using the same
#16Semiconductor device including an insulating layer and heat sink plates formed in the insulating layer
#17Method for the manufacture of an optoelectronic component and an optoelectronic component
#18METHOD OF RESIN ENCAPSULATION MOLDING FOR ELECTRONIC PART
#19Optical device for reducing disturbance light and manufacturing method thereof
#20Resin sealing and molding method of electronic component