ClassID:

49223

B29C45/021 - CPC Classification

Classification description:

Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor; Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity Plunger drives; Pressure equalizing means for a plurality of transfer plungers

Recent Application in this class:
#1
20240235347
2024-07-11

Rotor core manufacturing method, and rotor core molding system therefore

#2
20240116229
2024-04-11

RESIN MOLDING DEVICE AND METHOD FOR PRODUCING RESIN MOLDED ARTICLE

#3
20220161475
2022-05-26

Method for manufacturing resin molded product

#4
20220161469
2022-05-26

Method for manufacturing resin molded product

#5
20210408880
2021-12-30

Device and method for manufacturing magnet embedded core

#6
20210053260
2021-02-25

Micro moulding machine and process

#7
20190358875
2019-11-28

INJECTION MOLDING APPARATUS AND METHOD TO REDUCE BIREFRINGENCE

#8
20190193312
2019-06-27

Micro moulding machine and process

#9
20180345558
2018-12-06

Shooting pot plunger control

#10
20170368720
2017-12-28

Device and method for feeding molten plastic material into a molding cavity

#11
20150151467
2015-06-04

Thermoplastic composite support structures with integral fittings and method

#12
20140151926
2014-06-05

Method of resin sealing permanent magnets in laminated rotor core

#13
20120305180
2012-12-06

Method of resin sealing permanent magnets in laminated rotor core

#14
20110115126
2011-05-19

Method of resin sealing permanent magnets in laminated rotor core

#15
20100272843
2010-10-28

Ultrasonic device for moulding micro plastic parts

#16
20090189309
2009-07-30

Method of resin sealing permanent magnets in laminated rotor core

#17
20080308969
2008-12-18

Mold apparatus for resin encapsulation and resin encapsulation method

#18
20080041461
2008-02-21

Fluid distributor and translatable drive apparatus for a molding

#19
20060118982
2006-06-08

Apparatus and method for molding simultaneously a plurality of semiconductor devices