51108 ⎘
Joining of preformed parts ; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding containing additives characterised by their shape, e.g. being fibres or being spherical
Sub-classes:Cold lamination with radiation
#2Polylactic acid adhesive compositions and methods for their preparation and use
#3Conductive particle and display device including the same
#4Conductive particle and display device including the same
#5Curable compositions containing isocyanate functional components having improved durability
#6Method of sticking together and un-sticking two parts by means of a filled adhesive
#7Method for mitigating cure shrinkage in high temperature-processed thermosetting adhesives and SMC
#8Curable compositions containing isocyanate functional components having improved durability
#9COLD LAMINATION WITH RADIATION