Patents-Review.com
ClassID:

51131 ⎘

B29C65/523 - CPC Classification

Classification description:

Joining of preformed parts ; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding applying the adhesive by dipping

Recent Application in this class:
#1
20240306938
2024-09-19

NASAL/ORAL CANNULA SYSTEM AND MANUFACTURING

 #2
20210198447
2021-07-01

Method of bonding perfluoroelastomeric materials to a surface

 #3
20200214594
2020-07-09

Nasal/oral cannula system and manufacturing

 #4
20160213281
2016-07-28

Nasal/oral cannula system and manufacturing

 #5
20150316061
2015-11-05

Joining of polymer and surface-modified solid part

 #6
20140305588
2014-10-16

Method of bonding perfluoroelastomeric materials to a surface

 #7
20130078452
2013-03-28

QUICK DRYING SEMI-SOLID GLUES

 #8
20120245602
2012-09-27

Welded Looped Suture

 #9
20100316531
2010-12-16

MICROFLUIDIC DEVICE INCLUDING TWO HYDROPHOBIC LAYERS ASSEMBLED TOGETHER AND ASSEMBLY METHOD

 #10
20100092767
2010-04-15

BONDING METHOD AND BONDED BODY

 #11
20100045741
2010-02-25

Method for assembling a carrier for integrated circuits

 #12
20100043978
2010-02-25

Adhesive application apparatus for use with an assembling machine

 #13
20090214856
2009-08-27

BONDED BODY AND METHOD OF MANUFACTURING BONDED BODY

 #14
20090018275
2009-01-15

Method of Bonding Perfluoroelastomeric Materials to a Surface

 #15
20070084550
2007-04-19

Method to increase the fusion of radio-frequency welds between dissimilar materials

 #16
20060242831
2006-11-02

Method for sealing heat exchanger tubes

 #17
20060147704
2006-07-06

Aircraft structure including composite beam and composite panel with metal foil therebetween

 #18
20050170490
2005-08-04

Processes for manufacturing optical analysis discs with molded microfluidic structures and discs made according thereto

 #19
20050112394
2005-05-26

Method to eliminate undulations in a composite panel

 #20
20050100712
2005-05-12

Polymerization welding and application to microfluidics