53602 ⎘
Use of epoxy resins as filler
Tablet-type epoxy resin composition for sealing semiconductor device, and semiconductor device sealed using the same
#2Composites with interlaminar toughening particles and method of making the same
#3Composition for 3D printing
#4Biaxially stretched porous film
#5Membrane for liquid-resistant devices and methods of making a membrane
#6Method of making an engineered composite material and products produced therefrom