ClassID:

53959

B29K2995/001 - CPC Classification

Classification description:

Properties of moulding materials, reinforcements, fillers, preformed parts or moulds having particular electrical or magnetic properties, e.g. piezoelectric Electrostatic

Recent Application in this class:
#1
20260131514
2026-05-14

A MULTIPLE LAYER MATERIAL, PACKAGING MATERIAL COMPRISING SUCH MULTIPLE LAYER MATERIAL, AND PROCESS FOR PRODUCING A MULTIPLE LAYER MATERIAL

#2
20230405917
2023-12-21

MOBILE PHONE SCREEN PROTECTIVE FILM HAVING DUST REMOVAL FUNCTION AND FILM PASTING AUXILIARY DEVICE

#3
20230106346
2023-04-06

ADDITIVE MANUFACTURING ELECTROSTATIC POWDER DEPOSITION

#4
20190210279
2019-07-11

Electrostatic 3-D printer using layer and mechanical planer

#5
20170348909
2017-12-07

Electrostatic 3-D printer using layer and mechanical planer

#6
20170348908
2017-12-07

Electrostatic 3-D printer using leveling material and mechanical planer

#7
20170326788
2017-11-16

Electrostatic 3-D printer controlling layer thickness using feedback loop to development device

#8
20170297267
2017-10-19

Electro-photographic 3-D printing using collapsible substrate

#9
20170297266
2017-10-19

Electro-photographic 3-D printing using dissolvable paper

#10
20150174839
2015-06-25

Method for avoiding entrapment of air bubbles in a lens forming material and apparatus for carrying out the method

#11
20150111006
2015-04-23

In-mold label forming surfaces for molded articles

#12
20130259968
2013-10-03

Static-dissipative foam extrusion calibration with minimized expansion loss

#13
20110039091
2011-02-17

Method for producing laminated porous sheet comprising polytetrafluoroethylene and carbon particles

#14
20100162782
2010-07-01

VACUUM FORMING MACHINE AND METHOD OF MAKING VACUUM FORMED PRODUCT

#15
20100098944
2010-04-22

Moulded product and method of producing it

#16
20090199765
2009-08-13

High efficiency electro-static chucks for semiconductor wafer processing

#17
20060157886
2006-07-20

Method and apparatus for continuously producing discrete expanded thermoformable materials