ClassID:

56231

B32B2311/12 - page 2 - CPC Classification

Classification description:

Metals, their alloys or their compounds Copper

Recent Application in this class:
#301
20120075822
2012-03-29

ORGANIC PRINTED CIRCUIT BOARD HAVING REINFORCED EDGE FOR USE WITH WIRE BONDING TECHNOLOGY

#302
20120011850
2012-01-19

Broadband reflectors, concentrated solar power systems, and methods of using the same

#303
20120006481
2012-01-12

METHOD FOR PRODUCING METAL FOIL LAMINATE

#304
20110262722
2011-10-27

Method of Producing Laminated Body, and Laminated Body

#305
20110253439
2011-10-20

CIRCUIT SUBSTRATE AND MANUFACTURING METHOD THEREOF

#306
20110171466
2011-07-14

Precast thermal interface adhesive for easy and repeated, separation and remating

#307
20110126970
2011-06-02

METALLIC LAMINATE AND MANUFACTURING METHOD OF CORE SUBSTRATE USING THE SAME

#308
20110073246
2011-03-31

Method for manufacturing electrosurgical seal plates

#309
20110033659
2011-02-10

Glass fabric base material/thermosetting resin copper-clad laminate having a high-elasticity

#310
20100300351
2010-12-02

APPARATUS FOR PRODUCTION OF COMPOSITE MATERIAL SHEET

#311
20100170638
2010-07-08

Process for improving the adhesion of polymeric materials to metal surfaces

#312
20100151262
2010-06-17

METALLIC COATING OF COMPOSITE MATERIALS

#313
20100149823
2010-06-17

LAMP UNIT, CIRCUIT BOARD, AND METHOD OF MANUFATURING CIRCUIT BOARD

#314
20100147926
2010-06-17

METHOD FOR OXIDE BONDING USING SOLDER ALLOY

#315
20100032699
2010-02-11

System for high efficiency solid-state light emissions and method of manufacture

#316
20090232972
2009-09-17

Method for the production of a metal-ceramic substrate

#317
20090229762
2009-09-17

Manufacturing method of boards, mold-releasing sheet, manufacturing apparatus for board

#318
20090227163
2009-09-10

Protective Apparel with Porous Material Layer

#319
20090226656
2009-09-10

Layered structure for use with high power light emitting diode systems

#320
20090208363
2009-08-20

SOLDER ALLOY FOR OXIDE BONDING

#321
20090193636
2009-08-06

Method for producing a multilayer ceramic component

#322
20090183825
2009-07-23

Method of forming bonded body and bonded body

#323
20090169877
2009-07-02

Laminated Glazing

#324
20090142722
2009-06-04

Ceramic multilayer component, method for the production thereof, and retaining device

#325
20090142607
2009-06-04

COPPER CLAD LAMINATE

#326
20090142545
2009-06-04

Method for treating nanofiber material and composition of nanofiber material

#327
20090141460
2009-06-04

CERAMIC MULTILAYER COMPONENT, METHOD FOR THE PRODUCTION THEREOF AND RETAINING DEVICE

#328
20090110916
2009-04-30

Multi-Layered Product for Printed Circuit Boards, and a Process for Continuous Manufacture of Same

#329
20090071603
2009-03-19

Method of manufacturing printed circuit board and electromagnetic bandgap structure

#330
20090061242
2009-03-05

Carbon fiber composite transfer member with reflective surfaces

#331
20090032287
2009-02-05

Resin coated metal foil, metal clad laminate, printed wiring board using them, and manufacturing method thereof

#332
20090020321
2009-01-22

Method for manufacturing a metal-ceramic substrate

#333
20090014122
2009-01-15

Heat resistant laminated conveyor belt and manufacturing method thereof

#334
20080305005
2008-12-11

Composite ceramic body

#335
20080277143
2008-11-13

Resin coated metal foil, metal clad laminate, printed wiring board using them, and manufacturing method thereof

#336
20080272180
2008-11-06

METHOD OF MANUFACTURING HEAT SPREADER MODULE

#337
20080245467
2008-10-09

LOW LOSS GLASS-CERAMIC MATERIALS, METHOD OF MAKING SAME AND ELECTRONIC PACKAGES INCLUDING SAME

#338
20080193776
2008-08-14

Nonreducing dielectric ceramic, and manufacturing method and monolithic ceramic capacitor of the same

#339
20080190542
2008-08-14

Method of manufacturing ceramic/metal composite structure

#340
20080073025
2008-03-27

Method of manufacturing copper-clad laminate for VOP application

#341
20080011612
2008-01-17

Resin coated metal foil, metal clad laminate, printed wiring board using them, and manufacturing method thereof

#342
20070268652
2007-11-22

Ceramic material and laminated ceramic condenser comprised thereof

#343
20070261778
2007-11-15

Method for the production of a metal-ceramic substrate or copper-ceramic substrate, and support to be used in said method

#344
20070231590
2007-10-04

Method of Bonding Metals to Ceramics

#345
20070207326
2007-09-06

Resin composition excellent in dielectric properties, process for producing the same, varnish produced using the same, process for producing the varnish, and prepreg and metal-clad laminate using the resin composition and varnish

#346
20070206341
2007-09-06

Ceramic multi-layer component and method for the production thereof

#347
20070178300
2007-08-02

Laminates for high speed and high frequency printed circuit boards

#348
20070172652
2007-07-26

Dielectric particle aggregate comprising a surface layer of zinc titanate, low temperature sinterable dielectric ceramic composition using same

#349
20070158608
2007-07-12

Ceramic material

#350
20070142210
2007-06-21

Dielectric ceramic and monolithic ceramic capacitor

#351
20070123413
2007-05-31

Dielectric ceramic composition and monolithic ceramic capacitor

#352
20070122637
2007-05-31

Aromatic liquid-crystalline polyester film and metal laminated article

#353
20070113961
2007-05-24

Conductor-clad laminate, wiring circuit board, and processes for producing the same

#354
20070092709
2007-04-26

Resin-impregnated base substrate and method for producing the same

#355
20070034319
2007-02-15

System and Process for Making and Applying a Flashing Seal

#356
20070017652
2007-01-25

Apparatus, mold, and method for manufacturing metal-ceramic composite member

#357
20060264317
2006-11-23

Dielectric ceramic composition and multilayer ceramic capacitor

#358
20060257622
2006-11-16

Laminate for printed circuit board and method of manufacturing the same

#359
20060246322
2006-11-02

Oxide porcelain composition, ceramic multilayer substrate, and ceramic electronic component

#360
20060242826
2006-11-02

Method of manufacturing a metal-ceramic circuit board

#361
20060234851
2006-10-19

Dielectric ceramic composition, method of manufacturing the same, and dielectric ceramics and laminated ceramic part using the same

#362
20060234020
2006-10-19

Ceramic multilayer component, method for the production thereof and retaining device

#363
20060226115
2006-10-12

Composition and method for preparing chemically-resistant roughened copper surfaces for bonding to substrates

#364
20060175855
2006-08-10

Color matched automtive trim and body part

#365
20060159887
2006-07-20

Laminate with local reinforcement

#366
20060153669
2006-07-13

Carbon fiber composite transfer member with reflective surfaces

#367
20060126266
2006-06-15

Ceramic powder composition, ceramic material, and laminated ceramic condenser comprised thereof

#368
20060124228
2006-06-15

Apparatus and method for manufacturing copper clad laminate with improved peel strength

#369
20060119228
2006-06-08

Piezoelectric component

#370
20060091019
2006-05-04

Method of adhesion of conductive materials, laminate, and adhesive composition

#371
20060089070
2006-04-27

Glass fabric base material/thermosetting resin copper-clad laminate having a high-elasticity

#372
20060088724
2006-04-27

Anodization to enhance adhesion for metal composite

#373
20060079391
2006-04-13

Dielectric material and the method of preparing the same

#374
20060061019
2006-03-23

Method of producing ceramic multilayer substrates, and green composite laminate

#375
20060054262
2006-03-16

Process for producing heat-resistant flexible laminate and heat-resistant flexible laminate produced thereby

#376
20060042750
2006-03-02

Preparation of flexible copper foil/polyimide laminate

#377
20060040819
2006-02-23

Ceramic composition and ceramic wiring board

#378
20060035093
2006-02-16

Heat resistant film and metal laminate thereof

#379
20060027550
2006-02-09

Interlayer composite for a laminated transparency

#380
20060023399
2006-02-02

Multilayer ceramic capacitor and manufacturing method thereof

#381
20060022020
2006-02-02

Method for the production of a metal-ceramic substrate, preferably a copper ceramic substrate

#382
20060008600
2006-01-12

Microwavable packaging material

#383
20050287328
2005-12-29

Method of producing laminates, and laminates

#384
20050277743
2005-12-15

Curable resin composition and its use

#385
20050266756
2005-12-01

Laminate composition for producing reduced curl flat thin core laminate

#386
20050266252
2005-12-01

Low loss glass-ceramic materials, method of making same and electronic packages including same

#387
20050266251
2005-12-01

Glass-ceramic materials and electronic packages including same

#388
20050238811
2005-10-27

Composition and method for preparing chemically-resistant roughened copper surfaces for bonding to substrates

#389
20050227084
2005-10-13

Resin-impregnated flexible graphite articles

#390
20050218542
2005-10-06

Resin-impregnated flexible graphite articles

#391
20050215707
2005-09-29

Thermosetting resin composition for high performance laminates

#392
20050186407
2005-08-25

Method of manufacturing ceramic paste and ceramic multi-layer wiring substrate utilizing the same

#393
20050144780
2005-07-07

Method for manufacturing substrate, release sheet, substrate manufacturing apparatus and method for manufacturing substrate using same

#394
20050138799
2005-06-30

Method of manufacturing a metal-ceramic circuit board

#395
20050126682
2005-06-16

Monolithic ceramic substrate and method for making the same

#396
20050121229
2005-06-09

Metal foil with resin and metal-clad laminate, and printed wiring board using the same and method for production thereof

#397
20050118910
2005-06-02

Base material for laminate and process for producing the same

#398
20050112330
2005-05-26

Decorative sheet, molded article, motor vehicle, and production method of molded article

#399
20050101151
2005-05-12

Laminate for IR ablation

#400
20050098609
2005-05-12

Transient eutectic phase process for ceramic-metal bonding metallization and compositing

#401
20050098262
2005-05-12

Method of laminating copper foil onto a printed circuit board

#402
20050080183
2005-04-14

Thermosetting resin composition for high speed transmission circuit board

#403
20050037182
2005-02-17

Separating plate-composite component for producing printed circuit board components and method for producing a composite component of this type

#404
20050031894
2005-02-10

Multilayer coated corrosion resistant article and method of production thereof

#405
20050031879
2005-02-10

Laminate for electronic circuit

#406
20050023264
2005-02-03

Edge sealing of a laminated transparency

#407
20050003200
2005-01-06

Resin-impregnated flexible graphite articles

#408
18409600
2026-03-17

Delamination of used solar module

#409
17089610
2022-06-14

Flexible micrometeoroid shield

#410
14599135
2016-01-26

Thermosetting resin composition containing a polyphenylene ether and a brominated fire retardant compound

#411
14275144
2020-09-01

Composite damage tolerance and through thickness conductivity by interleaving carbon fiber veil nanocomposites