B41J2/33585 - CPC Classification Index

ClassID:

57483 ⎘

B41J2/33585 - CPC Classification

Classification description:

Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads; Structure of thermal heads Hollow parts under the heater

Recent Application in this class:

20200391517

2020-12-17

Thermal print head and method of manufacturing thermal print head

20180201026

2018-07-19

Thermal head and thermal printer

20150251440

2015-09-10

Thermal print head and thermal printer

20130335500

2013-12-19

Thermal head, printer, and method of manufacturing thermal head

20130169729

2013-07-04

Thermal head, printer, and method of manufacturing thermal head

20120320139

2012-12-20

Thermal printhead with optimally shaped resistor layer

20120320138

2012-12-20

Thermal printer with energy save features

20120212558

2012-08-23

Thermal head, method of manufacturing thermal head, and printer equipped with thermal head

20120212557

2012-08-23

Thermal head, method of manufacturing thermal head, and printer equipped with thermal head

#10

20120144659

2012-06-14

Manufacturing method for a heating resistor element

#11

20120125568

2012-05-24

Recording head and recording device comprising same

#12

20120073123

2012-03-29

Method of manufacturing thermal head

#13

20120073122

2012-03-29

Method of manufacturing thermal head

#14

20120050447

2012-03-01

Thermal head, thermal printer and manufacturing method for the thermal head

#15

20110216147

2011-09-08

Thermal head, printer, and manufacturing method for the thermal head

#16

20110149008

2011-06-23

Thermal head and printer

#17

20110141214

2011-06-16

Thermal head and printer

#18

20110128340

2011-06-02

Thermal head, manufacturing method therefor, and printer

#19

20110074907

2011-03-31

Thermal head, printer, and manufacturing method for thermal head

#20

20110074902

2011-03-31

Thermal head and printer

#21

20110063396

2011-03-17

Thermal head and printer

#22

20110032320

2011-02-10

Thermal head and manufacturing method for the thermal head

#23

20100231680

2010-09-16

THERMAL HEAD

#24

20100140215

2010-06-10

Thermal head manufacturing method

#25

20100134583

2010-06-03

Thermal head, thermal printer, and manufacturing method for thermal head

#26

20100134582

2010-06-03

Thermal head, thermal printer, and manufacturing method for thermal head

#27

20100134581

2010-06-03

Thermal head, thermal printer, and manufacturing method for thermal head

#28

20100118105

2010-05-13

Thermal head manufacturing method, thermal head, and printer

#29

20100071414

2010-03-25

Manufacturing method for a thermal head

#30

20090265919

2009-10-29

Manufacturing method for a heating resistor element component

#31

20090262176

2009-10-22

Heating resistance element component and printer

#32

20090231408

2009-09-17

Heating resistor element component, thermal printer, and manufacturing method for a heating resistor element component

#33

20090201355

2009-08-13

Thermal head, thermal printer and manufacturing method of thermal head

#34

20090102912

2009-04-23

Heating resistor element, manufacturing method for the same, thermal head, and printer

#35

20090102911

2009-04-23

Heating resistor element, manufacturing method for the same, thermal head, and printer

#36

20090102891

2009-04-23

Heating resistor element, manufacturing method for the same, thermal head, and printer

#37

20090090703

2009-04-09

Heating resistance element component and thermal printer

#38

20080143810

2008-06-19

Thermal head and printer

#39

20070257980

2007-11-08

Thermal head and printing device

#40

20070216731

2007-09-20

Thermal head and printing device equipped with the same

#41

20070091161

2007-04-26

Heating resistance element, thermal head, printer, and method of manufacturing heating resistance element

#42

20050219349

2005-10-06

Thermal head having adhesive interposed between adhesion surface of heat-dissipation plate and adhesion surface of head substrate and method for producing the same