ClassID:

81214

B65H2511/162 - CPC Classification

Classification description:

Recent Application in this class:
#1
20210035832
2021-02-04

Method and apparatus for measuring process kit centering

#2
20200075368
2020-03-05

Method and apparatus for measuring process kit centering

#3
20200072594
2020-03-05

Long range capacitive gap measurement in a wafer form sensor system

#4
20180137709
2018-05-17

Device for detecting foreign object attached on surface of sheet-like medium

#5
20180104926
2018-04-19

Sheet binding processing apparatus, sheet post-processing apparatus having the sheet binding processing apparatus, and image forming system having the sheet post-processing apparatus

#6
20180057302
2018-03-01

Paper sheet handling machine and paper sheet handling method

#7
20150158688
2015-06-11

Image recording apparatus

#8
20120137533
2012-06-07

Thickness detector of paper

#9
20110309572
2011-12-22

PAPER THICKNESS DETECTING APPARATUS

#10
20100301551
2010-12-02

Thickness detector of paper

#11
20100230793
2010-09-16

Semiconductor apparatus packaging structure having embossed tape over tab tape, the embossed tape and method of forming the semiconductor apparatus packaging structure

#12
20100117295
2010-05-13

Paper thickness detecting apparatus with applying electrodes

#13
20090166948
2009-07-02

Paper sheet processing apparatus

#14
20090166947
2009-07-02

Paper sheet processing apparatus

#15
20080224389
2008-09-18

Sheet abnormality detection apparatus and method

#16
20070000820
2007-01-04

Paper sheet processing apparatus

#17
20050260341
2005-11-24

Adhesive sheet stamping device, adhesive sheet stamping method