B65H2701/361 - CPC Classification Index

ClassID:

81703 ⎘

B65H2701/361 - CPC Classification

Classification description:

Handled material; Storage means; Handled filamentary material; Wires Semiconductor bonding wires

Recent Application in this class:

20260062249

WIRE FEEDER

20250066154

WIRE SUPPLY MODULE AND WIRE BONDING MACHINE INCLUDING THE SAME

20240194632

WIRE COATING APPARATUS

20220002112

Lead wire pulling out mechanism

20200290833

Wound body of sheet for sintering bonding with base material

20190119064

Wire tensioner tip

20100224715

WIRE SUPPLY DEVICE FOR A WIRE BONDER