83943 ⎘
Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems Processes for the simultaneaous manufacturing of a network or an array of similar microstructural devices
MULTI-CELL PISTON MOTION MEMBRANE MICROELECTROMECHANICAL SYSTEMS (MEMS) APPARATUS AND PROCESS
#2HIGH SPEED MANUFACTURE OF MICRO-ELECTRICAL MECHANICAL SYSTEMS ARRAYS
#3USE OF MEMS PACKAGES AS ANTENNA SUBSTRATE
#4COMPOUND SENSOR AND MANUFACTURING METHOD
#5Method for producing a plurality of sensor devices, and sensor device
#6Cellular array electrostatic actuator
#7Bionic SERS substrate with metal-based compound eye bowl structure and its construction method and application
#8Surface bio-functionalization method
#9Micro-electrical mechanical system sensor package and method of manufacture thereof
#10Surface topography with ferromagnetic polymer pillars capable of movement in response to magnetic fields
#11Apparatus and method of manufacturing for combo MEMS device accommodating different working pressures
#12Environmental sensor and manufacturing method thereof
#13Spectrally and temporally engineered processing using photoelectrochemistry
#14RELATIVE AND ABSOLUTE PRESSURE SENSOR COMBINED ON CHIP
#15Polymer surface with t-shaped microstructure and fabrication method therefor and applications thereof
#16Panel level packaging for MEMS application
#17Gasses for increasing yield and reliability of MEMS devices
#18Method for producing a structure with spatial encoded functionality
#19Field emission devices and methods of making thereof
#20Dual cavity pressure structures
#21Tiled CMUT dies with pitch uniformity
#22Release hole plus contact via for fine pitch ultrasound transducer integration
#23Method for manufacturing a microphone structure and a pressure sensor structure in the layer structure of a MEMS element
#24Dual cavity pressure structures
#25SENSOR DEVICE WITH MULTI-STIMULUS SENSING AND METHOD OF FABRICATION
#26Method of manufacturing ink jet printheads including electrostatic actuators
#27Relative and absolute pressure sensor combined on chip
#28Spectrally and temporally engineered processing using photoelectrochemistry
#29Ultrasonic transducer, method of producing same, and ultrasonic probe using same
#30MEMS device and formation method thereof
#31Silicon wafer with a plurality of chip patterns
#32Semiconductor device
#33Wafer level method of sealing different pressure levels for MEMS sensors
#34Method of forming a semiconductor device
#35Method of manufacturing a MEMS micro-mirror assembly
#36MEMS micro-mirror assembly
#37Methods of forming nanoparticles using semiconductor manufacturing infrastructure
#38Field emission devices and methods of making thereof
#39MEMS nanostructures and methods of forming the same
#40High fidelity nano-structures and arrays for photovoltaics and methods of making the same
#41Method of fabricating sensors having functionalized resonating beams
#42ULTRASONIC TRANSDUCER, METHOD OF PRODUCING SAME, AND ULTRASONIC PROBE USING SAME
#43Semiconductor device using a silicon wafer with a pattern arrangement
#44Method of manufacturing an ultrasonic transducer semiconductor device
#45HIGH FIDELITY NANO-STRUCTURES AND ARRAYS FOR PHOTOVOLTAICS AND METHODS OF MAKING THE SAME
#46Bottom-up assembly of structures on a substrate
#47Method of manufacturing mechanical and micromechanical parts
#48Method for self-assembling microstructures
#49Method for self-assembling microstructures
#50Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates
#51Re-assembly process for MEMS structures
#52Re-assembly process for MEMS structures
#53Micromechanical device with thinned cantilever structure and related methods
#54Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates
#55Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates
#56Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates
#57Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates
#58Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates
#59Large cavity wafer-level package for MEMS
#60Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates
#61Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates
#62Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates
#63Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates
#64Micromechanical device with thinned cantilever structure and related methods
#65Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates
#66Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates
#67Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates
#68Method for making a micromechanical device by using a sacrificial substrate
#69Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates
#70Method for supplying multiple voltages to a movable part of a MEMS device
#71Methods for depositing, releasing and packaging microelectromechanical devices on wafer substrates
#72Hybrid CMOS-MEMS devices adapted for high-temperature operation and method for their manufacture
#73Trimming method for microresonators and microresonators made thereby