ClassID:

83948

B81C1/00253 - CPC Classification

Classification description:

Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems; Integrating an electronic processing unit with a micromechanical structure Processes for integrating an electronic processing unit with a micromechanical structure not provided for in  - 

Recent Application in this class:
#1
20220381583
2022-12-01

Sensor and method for reducing an interference signal component in a measuring signal from a sensor

#2
20200299127
2020-09-24

Composite structures

#3
20180359551
2018-12-13

Microphone device

#4
20180061487
2018-03-01

Two-port SRAM connection structure

#5
20160372182
2016-12-22

Two-port SRAM connection structure

#6
20160341689
2016-11-24

Component part having a MECS component on a mounting carrier

#7
20160340177
2016-11-24

Physical quantity sensor, electronic apparatus, and moving object

#8
20160122182
2016-05-05

MEMS device with a capping substrate

#9
20150375995
2015-12-31

MEMS fabrication process with two cavities operating at different pressures

#10
20150028436
2015-01-29

Apparatus comprising and a method for manufacturing an embedded MEMS device

#11
20140312438
2014-10-23

Physical quantity sensor, electronic apparatus, and moving object

#12
20140312437
2014-10-23

Electronic device, integrated circuit, electronic apparatus, and moving object

#13
20140103464
2014-04-17

Microphone system with integrated passive device die

#14
20140042565
2014-02-13

Apparatus comprising and a method for manufacturing an embedded MEMS device

#15
20130234140
2013-09-12

Micromechanical component having a diaphragm

#16
20120224726
2012-09-06

MEMS-microphone

#17
20110059566
2011-03-10

Forming a micro electro mechanical system

#18
20100289099
2010-11-18

INTEGRATION OF VACUUM MICROELECTRONIC DEVICE WITH INTEGRATED CIRCUIT

#19
20100032816
2010-02-11

Electronic device and method of manufacturing same

#20
20090314367
2009-12-24

Bonded Microfluidics System Comprising CMOS-Controllable Microfluidic Devices

#21
20090179317
2009-07-16

Semiconductor device having an adhesive portion with a stacked structure and method for manufacturing the same

#22
20090140356
2009-06-04

Integrated sensor and circuitry

#23
20080283180
2008-11-20

Methods of manufacturing microdevices in laminates, lead frames, packages, and printed circuit boards

#24
20080258829
2008-10-23

Integrated quartz oscillator on an active electronic substrate

#25
20080191293
2008-08-14

Integrated passive device and method of fabrication

#26
20080188059
2008-08-07

Integrated sensor and circuitry and process therefor

#27
20080096301
2008-04-24

Micro electro mechanical system

#28
20070259465
2007-11-08

Integration of vacuum microelectronic device with integrated circuit

#29
20070224832
2007-09-27

Method for forming and sealing a cavity for an integrated MEMS device

#30
20070029629
2007-02-08

Integrated sensor and circuitry and process therefor

#31
20060252229
2006-11-09

Integrated circuit on high performance chip

#32
20060110842
2006-05-25

Method and apparatus for preventing metal/silicon spiking in MEMS devices

#33
20050040988
2005-02-24

LTCC-based modular MEMS phased array