83955 ⎘
Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems; Processes for packaging MEMS devices suitable for fluid transfer from the MEMS out of the package or , e.g. transfer of liquid, gas, sound
INERTIA MEASUREMENT UNIT AND METHOD FOR FORMING THE SAME
#2ACOUSTIC LIMITER FOR MICRO-ELECTRICAL-MECHANICAL SYSTEMS (MEMS) MICROPHONES AND OTHER DEVICES
#3SEMICONDUCTOR PACKAGE MOLD COMPOUND DAMS
#4MULTI-CHIP SENSOR
#5PACKAGING FOR A SENSOR AND METHODS OF MANUFACTURING THEREOF
#6GAS SENSOR AND METHOD FOR MANUFACTURING THEREOF
#7PRESSURE TRANSDUCER PACKAGE HAVING A RIGID TRANSFER BLOCK FOR ASSEMBLY TOLERANCE
#8INTEGRATED MEMS MICROPHONE PERFORMANCE ENHANCEMENT WITH A MEMBRANE
#9PACKAGE FOR MULTIPLE LOUDSPEAKERS
#10SEMICONDUCTOR PACKAGE WITH METAL COLUMN MOLD BARRIER
#11MICROELECTROMECHANICAL SENSOR WITH IMPROVED EXTERNAL FLUIDIC COUPLING AND MANUFACTURING PROCESS THEREOF
#12System And Method For Generating Fluid Flow
#13LIQUID EJECTION CHIP AND METHOD FOR MANUFACTURING LIQUID EJECTION CHIP
#14ACOUSTIC DEVICE AND MODULE INCLUDING THE SAME
#15CAPLESS SEMICONDUCTOR PACKAGE WITH A MICRO-ELECTROMECHANICAL SYSTEM (MEMS)
#16PACKAGED CAVITY STRUCTURE AND MANUFACTURING METHOD THEREOF
#17Ingress protection mechanism
#18METHODS OF MANUFACTURING PLASMA GENERATING CELLS FOR A PLASMA SOURCE
#19PACKAGING FOR A SENSOR AND METHODS OF MANUFACTURING THEREOF
#20PACKAGING FOR A SENSOR AND METHODS OF MANUFACTURING THEREOF
#21PACKAGING FOR A SENSOR AND METHODS OF MANUFACTURING THEREOF
#22COMPACT, EASY-TO-PRODUCE MEMS PACKAGE WITH IMPROVED PROTECTIVE PROPERTIES
#23Semiconductor Device and Method of Making a MEMS Semiconductor Package
#24MEMS environmental sensor and preparation method therefor
#25Fluidic cavities for on-chip layering and sealing of separation arrays
#26SENSOR PACKAGE WITH EMBEDDED INTEGRATED CIRCUIT
#27Semiconductor package with metal column mold barrier
#28Semiconductor package device and method for manufacturing the same
#29Sensor package substrate, sensor module having the same, and sensor package substrate manufacturing method
#30Method for producing a plurality of sensor devices, and sensor device
#31Three-dimensional features formed in molded panel
#32WAFER LEVEL CHIP SCALE PACKAGING WITH SENSOR
#33Capless semiconductor package with a micro-electromechanical system (MEMS)
#34Semiconductor package structure and method for manufacturing the same
#35Fluidic cavities for on-chip layering and sealing of separation arrays
#36Semiconductor device packages and methods of manufacturing the same
#37MEMS device with particle filter and method of manufacture
#38Packaged pressure sensor device
#39MEMS microphone and method of manufacturing the same
#40Packaging for a MEMS transducer
#41Packaging for a MEMS transducer
#42Semiconductor device with discharge path, and method for producing the same
#43Fluidic cavities for on-chip layering and sealing of separation arrays
#44MEMS package, MEMS microphone and method of manufacturing the MEMS package
#45Micro-electro-mechanical system structure and method for fabricating the same
#46Encapsulation of sensing device
#47Molded lead frame sensor package
#48MEMS microphone and a manufacturing method thereof
#49Shielded semiconductor device and lead frame therefor
#50Sensor device with flip-chip die and interposer
#51MEMS cryocooler systems and methods
#52Method for manufacturing a thin filtering membrane and an acoustic transducer device including the filtering membrane
#53Method to create multilayer microfluidic chips using spin-on carbon as gap filling materials
#54SENSOR DEVICES AND METHODS FOR MANUFACTURING THE SAME
#55MEMS assembly and method for producing a MEMS assembly
#56MEMS sensor, MEMS sensor system and method for producing a MEMS sensor system
#57Microfluidic component package
#58Method for manufacturing a semiconductor die provided with a filtering module, semiconductor die including the filtering module, package housing the semiconductor die, and electronic system
#59Microphone and pressure sensor package and method of producing the microphone and pressure sensor package
#60Method for manufacturing a micromechanical sensor
#61Fluidic microelectromechanical sensors/devices and fabrication methods thereof
#62Pressure sensor assembly mounted to a ceramic substrate
#63Packaged pressure sensor device
#64Analyte sensor package with dispense chemistry and microfluidic cap
#65Method for manufacturing a thin filtering membrane and an acoustic transducer device including the filtering membrane
#66Sensor system, sensor arrangement, and assembly method using solder for sealing
#67Method of manufacturing an electronic device
#68Protective environmental barrier for a die
#69Method for packaging at least one semiconductor component and semiconductor device
#70MEMS acoustic pressure sensor device and method for making same
#71MEMS integrated pressure sensor devices and methods of forming same
#72MEMS sound transducer element and method for producing a MEMS sound transducer element
#73Electronic device including directional MEMS microphone assembly
#74Exposed-die mold package for a sensor and method for encapsulating a sensor that interacts with the environment
#75Three-dimensional features formed in molded panel
#76Microelectromechanical systems package structure
#77TRANSDUCER PACKAGING
#78Semiconductor device package structure
#79Integrated circuit (IC) chip with a self-contained fluid sensor and method of making the chip
#80Method of manufacturing a sensor
#81MULTIPLE DEGREE OF FREEDOM MEMS SENSOR CHIP AND METHOD FOR FABRICATING THE SAME
#82Direct bond transfer layers for manufacturable sealing of microfluidic chips
#83Side ported MEMS sensor device package and method of manufacturing thereof
#84MEMS transducer package
#85MEMS transducer package
#86Reconstructed wafer based devices with embedded environmental sensors and process for making same
#87Optimized epoxy die attach geometry for MEMS die
#88Capacitance type transducer and acoustic sensor
#89MEMS integrated pressure sensor and microphone devices and methods of forming same
#90MEMS acoustic pressure sensor device and method for making same
#91Integrated MEMS transducers
#92Micromechanical pressure sensor
#93MEMS sensor with side port and method of fabricating same
#94Direct bond transfer layers for manufacturable sealing of microfluidic chips
#95Microphone having increased rear volume, and method for production thereof
#96MEMS SENSOR WITH SIDE PORT AND METHOD OF FABRICATING SAME
#97MEMS microphone package
#98System and method for a packaged MEMS device
#99Electronic component and method of manufacturing the same
#100Semiconductor integrated device for acoustic applications with contamination protection element, and manufacturing method thereof
#101Stress isolated differential pressure sensor
#102Integrated CMOS back cavity acoustic transducer and the method of producing the same
#103MEMS integrated pressure sensor devices and methods of forming same
#104Environmental sensor structure
#105Package with chambers for dies and manufacturing process thereof
#106MEMS device with acoustic leak control features
#107INTERNAL BARRIER FOR ENCLOSED MEMS DEVICES
#108MEMS integrated pressure sensor and microphone devices and methods of forming same
#109Top port MEMS cavity package and method of manufacture thereof
#110MEMS devices and methods for forming same
#111Method of packaging a semiconductor chip using a 3D printing process and semiconductor package having angled surfaces
#112MEMS integrated pressure sensor devices and methods of forming same
#113Flow sensor and method for manufacturing the same
#114Integrated CMOS back cavity acoustic transducer and the method of producing the same
#115Multi-port device package
#116Device comprising a fluid channel fitted with at least one microelectronic or nanoelectronic system, and method for manufacturing such a device
#117MEMS pressure transducer assembly
#118Methods and devices for packaging integrated circuits
#119MEMS integrated pressure sensor and microphone devices and methods of forming same
#120Microphone package with integrated substrate
#121Modular printhead for OLED printing
#122Low-profile MEMS thermal printhead die having backside electrical connections
#123MANUFACTURING METHOD OF ELECTRONIC PACKAGING
#124Cavity package design
#125MEMS pressure transducer assembly and method of packaging same
#126MEMS microphone and method for producing the MEMS microphone
#127Miniaturized electrical component comprising an MEMS and an ASIC and production method
#128Package for a MEMS sensor and manufacturing process thereof
#129Low-profile MEMS thermal printhead die having backside electrical connections
#130MEMS device assembly and method of packaging same
#131MICROPHONE PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME
#132Microphone package with embedded ASIC
#133Modular printhead for OLED printing
#134MEMS device assembly and method of packaging same
#135MEMS pressure sensor device and method of fabricating same
#136SEMICONDUCTOR DEVICE
#137Method for encapsulating an MEMS component
#138Double-side mountable MEMS package
#139Manufacturing method of an electronic device including overmolded MEMS devices
#140Double-side mountable MEMS package
#141MANUFACTURING METHOD OF AN ELECTRONIC DEVICE INCLUDING OVERMOLDED MEMS DEVICES
#142METHOD OF FORMING PASSAGE IN SUBSTRATE FOR MEMS MODULE
#143METHOD OF FORMING PASSAGE THROUGH SUBSTRATE FOR MEMS MODULE
#144MEMS packaging method for enhanced EMI immunity using flexible substrates
#145MEMS package using flexible substrates, and method thereof
#146Methods and apparatus having wafer level chip scale package for sensing elements
#147MEMS package, MEMS microphone, method of manufacturing the MEMS package and method of manufacturing the MEMS microphone
#148Sensor device and method for making thereof
#149Methods of manufacture of bottom port multi-part surface mount MEMS microphones
#150Methods of manufacture of top port surface mount MEMS microphones
#151MEMS package