DIELECTRIC STACK FOR MICROELECTROMECHANICAL SYSTEM DEVICES AND METHODS OF FABRICATION THEREOF

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

MEMS MIRROR MODULE WITH STRESS-DECOUPLED VIBRATIONAL MODES

MEMS DEVICE HAVING AN IMPROVED CAP AND MANUFACTURING PROCESS THEREOF

METHODS AND APPARATUS FOR SEMICONDUCTOR PACKAGES WITH WINDOW ASSEMBLIES

CHIP PACKAGE AND MANUFACTURING METHOD THEREOF

INFRARED DETECTOR FORMING METHOD AND ASSOCIATED INFRARED DETECTOR

MEMS Package and Method for Encapsulating an MEMS Structure

Hermetically sealed MEMS mirror and method of manufacture

3D DOME WAFER-LEVEL PACKAGE FOR OPTICAL MEMS MIRROR WITH REDUCED FOOTPRINT

MICRO-MIRROR DIE ATTACHED TO A PACKAGE SUBSTRATE THROUGH DIE ATTACH MATERIALS WITH DIFFERENT YOUNG'S MODULUSES

PHOTOCURRENT NOISE SUPPRESSION FOR MIRROR ASSEMBLY

HERMETICALLY SEALED GLASS PACKAGE

Detachable MEMS package top cover

Packaged device with die wrapped by a substrate

MEMS package with shock and vibration protection

Chip package and manufacturing method thereof

IR emitter with glass lid

Low-height optoelectronic modules and packages

Production method for a micromechanical device having inclined optical windows, and micromechanical device having inclined optical windows

Emitter package for a photoacoustic sensor

Optical electronics device

Hermetically sealed optically transparent wafer-level packages and methods for making the same

Packaged device with die wrapped by a substrate

Method for producing a micromechanical device having inclined optical windows, and corresponding micromechanical device

Chip packages and methods for forming the same

Encapsulant barrier

Chip packages and methods for forming the same

Singulation of wafer level packaging

Manufacturing method for a micromechanical window structure and corresponding micromechanical window structure

Microelectromechanical system cavity packaging

Protective wafer including inclined optical windows and device

MEMS mirror arrangement for detecting a large angular range

SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME

Microelectromechanical (MEMS) fabry-perot interferometer, apparatus and method for manufacturing fabry-perot interferometer

Hermetically sealed MEMS mirror and method of manufacture

COATED OPTICAL ELEMENT COMPONENT WITH A COATED OPTICAL ELEMENT AND METHOD TO PRODUCE THE SAME

PACKAGED SEMICONDUCTOR DEVICES AND METHODS FOR PRODUCING PACKAGED SEMICONDUCTOR DEVICES

Microelectromechanical system cavity packaging

Chip packages and methods for forming the same

Method for manufacturing a thermoelectric-based infrared detector having a MEMS structure above a hybrid component

Encapsulant barrier

Method for producing optical components using functional elements

Method for protecting a MEMS unit against infrared investigations and MEMS unit

Optical electronics device

Method for manufacturing a protective wafer including inclined optical windows and device

Semiconductor device package including cover including tilted inner sidewall

Semiconductor structure with cavity spacing monitoring functions

Hermetically sealed MEMS mirror and method of manufacture

Electro-optical device, manufacturing method of electro-optical device, and electronic apparatus

MEMS electrical contact systems and methods

Electro-optical device, manufacturing method thereof, and electronic apparatus

Wavelength tunable MEMS-Fabry Perot filter

Semiconductor device package for reducing parasitic light and method of manufacturing the same

Electro-optical device, manufacturing method of electro-optical device, and electronic apparatus

Optical electronic device and method of fabrication

Thermally decomposable polymer compositions for forming microelectronic assemblies

Wafer level MEMS package including dual seal ring

Anodic bonding of dielectric substrates

Electro-optical device, manufacturing method thereof, and electronic apparatus

Spatial light modulation element module, photolithographing apparatus, exposure apparatus, method of manufacturing spatial light modulation element module and method of manufacturing device

Thermally decomposable polymer compositions for forming microelectronic assemblies

Method for producing a wafer equipped with transparent plates

Production method

Packaging MEMS in fluidic environments

MEMS electrical contact systems and methods

Manufacturing electrochemical sensor modules

Method for producing structured optical components

Hermetically sealed MEMS device and its fabrication

Fabrication of a floating rocker MEMS device for light modulation

Method for producing an optical window device for a MEMS device

ENCAPSULATED ARRAYS OF ELECTROMECHANICAL SYSTEMS DEVICES

Low-melting lead-free bismuth sealing glasses

Fabrication of a floating rocker MEMS device for light modulation

Optical apparatus, sealing substrate, and method of manufacturing optical apparatus

Semiconductor device and method of manufacturing the same

Housing for micro-mechanical and micro-optical components used in mobile applications

Method of manufacturing semiconductor device in which functional portion of element is exposed

Method for packing a display device and the device obtained thereof

MEMS BASED OPTICAL COHERENCE TOMOGRAPHY PROBE

Method of producing optical MEMS

Lid structure for microdevice and method of manufacture

Method for stripping sacrificial layer in MEMS assembly

Optical semiconductor device

Large cavity wafer-level package for MEMS

Miniaturized vacuum package and methods of making same

Singulation of wafer level packaging

Method and device using silicon substrate to glass substrate anodic bonding