84185 ⎘
Forming microstructural systems; Integrating an electronic processing unit with a micromechanical structure; Transfer and j oin technology, i.e. forming the electronic processing unit and the micromechanical structure on separate substrates and joining the substrates Forming interconnections between the electronic processing unit and the micromechanical structure
GLASS-ENCAPSULATED PRESSURE SENSOR
#302Micro-electro-mechanical system having movable element integrated into leadframe-based package
#303Method for producing a two-chip assembly and corresponding two-chip assembly
#304GLASS AS A SUBSTRATE MATERIAL AND A FINAL PACKAGE FOR MEMS AND IC DEVICES
#305DIE-CUT THROUGH-GLASS VIA AND METHODS FOR FORMING SAME
#306PROCESS FOR A SEALED MEMS DEVICE WITH A PORTION EXPOSED TO THE ENVIRONMENT
#307Chip package and method for forming the same
#308Sensor device and manufacturing method thereof
#309MEMS device including an electrical interconnect through a substrate
#310WAFER LEVEL PACKAGING OF MEMS DEVICES
#311Method for mounting a three-axis MEMS device with precise orientation
#312Sensor device having electrode draw-out portions through side of substrate
#313Chip package and method for forming the same
#314Micro-electromechanical system device having electrical insulating structure and manufacturing methods
#315Microelectromechanical transducer and corresponding assembly process
#316Method for manufacturing a microelectromechanical component; and a microelectromechanical component
#317Method of fabrication of Al/GE bonding in a wafer packaging environment and a product produced therefrom
#318Multiple bonding in wafer level packaging
#319Device structures for in-plane and out-of-plane sensing micro-electro-mechanical systems (MEMS)
#320Apparatus integrating microelectromechanical system device with circuit chip and methods for fabricating the same
#321Method of manufacturing semiconductor device
#322Micro-electro-mechanical system having movable element integrated into leadframe-based package
#323MICROELECTROMECHANICAL SENSOR DEVICE PACKAGE AND METHOD FOR MAKING THE SAME
#324Wiring board, manufacturing method of the wiring board, and semiconductor package
#325Chip package and manufacturing method thereof
#326Integrated (multilayer) circuits and process of producing the same
#327Manufacturing method for a micromechanical component and micromechanical component
#328Integrated structure for MEMS device and semiconductor device and method of fabricating the same
#329MEMS Packaging Including Integrated Circuit Dies
#330Method for manufacturing a microelectromechanical component, and a microelectromechanical component
#331Method of fabrication of AI/GE bonding in a wafer packaging environment and a product produced therefrom
#332Microelectromechanical component
#333Method for manufacturing a microelectromechanical component, and a microelectromechanical component
#334Method of fabrication of a AL/GE bonding in a wafer packaging environment and a product produced therefrom
#335Physical quantity sensor having sensor chip and circuit chip
#336MEMS assembly substrates including a bond layer
#337Systems and methods for mask reduction techniques
#338Microelectromechanical systems (MEMS) devices with control circuits and methods of fabrication