B81C3/00 - CPC Classification Index

ClassID:

84034 ⎘

B81C3/00 - CPC Classification

Classification description:

Assembling of devices or systems from individually processed components

Sub-classes:

B81C3/001 » {Bonding of two components} 355
B81C3/002 » {Aligning micro-parts} 61
B81C3/008 » {Aspects related to assembling from individually processed components, not covered by groups to } 66

Recent Application in this class:

20240304577

2024-09-12

FINGERPRINT SENSOR AND MANUFACTURING METHOD THEREOF

20230285959

2023-09-14

METHOD OF MANUFACTURING MICRO FLOW PATH DEVICE, AND MICRO FLOW PATH DEVICE

20230009679

2023-01-12

Fingerprint sensor and manufacturing method thereof

20220363535

2022-11-17

MIRROR DEVICE MANUFACTURING METHOD AND MIRROR UNIT MANUFACTURING METHOD

20220299752

2022-09-22

Optical module and method for manufacturing optical module

20200219780

2020-07-09

Fingerprint sensor and manufacturing method thereof

20200174247

2020-06-04

Optical module and method for manufacturing optical module

20190253791

2019-08-15

Top port multi-part surface mount silicon condenser microphone

20190118156

2019-04-25

Microreactor, chemical product manufacturing system and microreactor manufacturing method

#10

20190025240

2019-01-24

Electrode Integration Into Organs On Chip Devices

#11

20180249242

2018-08-30

Top port multi-part surface mount MEMS microphone

#12

20180238720

2018-08-23

Methods for fabricating an apparatus having a hermetic seal

#13

20180095106

2018-04-05

Physical quantity sensor and manufacturing method therefor

#14

20180044175

2018-02-15

Package production method and package produced by the method

#15

20170264997

2017-09-14

Top port multi-part surface mount silicon condenser microphone

#16

20170243798

2017-08-24

Fingerprint sensor and manufacturing method thereof

#17

20170174506

2017-06-22

Packaged microsystems

#18

20160335470

2016-11-17

Fingerprint sensor and manufacturing method thereof

#19

20160241951

2016-08-18

Top port multi-part surface mount silicon condenser microphone

#20

20160181212

2016-06-23

Chip package and method for forming the same

#21

20150346002

2015-12-03

Apparatus for mounting a sensor having a hermetic seal

#22

20150343575

2015-12-03

Methods for fabricating apparatus having a hermetic seal

#23

20150001651

2015-01-01

MEMS device having a suspended diaphragm and manufacturing process thereof

#24

20140339659

2014-11-20

Method of manufacturing a semiconductor integrated circuit device having a MEMS element

#25

20140126165

2014-05-08

Packaged nano-structured component and method of making a packaged nano-structured component

#26

20130335011

2013-12-19

MICROELECTRONIC DEVICES FOR HARVESTING KINETIC ENERGY AND/OR DETECTING MOTION, AND ASSOCIATED SYSTEMS AND METHODS

#27

20130278108

2013-10-24

MEMS shock cushion spring systems and methods

#28

20130193536

2013-08-01

Method of manufacturing a semiconductor integrated circuit device having a MEMS element

#29

20130121892

2013-05-16

Polymeric substrate having an etched-glass-like surface and a microfluidic chip made of said polymeric substrate

#30

20120043629

2012-02-23

Surface mount silicon condenser microphone package

#31

20110210409

2011-09-01

Surface mount silicon condenser microphone package

#32

20070202627

2007-08-30

Silicon condenser microphone and manufacturing method

#33

20070201715

2007-08-30

Silicon condenser microphone and manufacturing method

#34

20050018864

2005-01-27

Method of manufacturing a microphone

#35

14537920

2020-08-25

3-D printed materials, structures and processes

#36

14159742

2015-08-04

Methods of manufacture of top port multi-part surface mount MEMS microphones