84046 ⎘
Subject matter not provided for in other groups of this subclass; Apparatus specially adapted for the manufacture or treatment of microstructural devices or systems, or methods for manufacturing the same Apparatus specially adapted for the manufacture or treatment of microstructural devices or systems not provided for in -
ELECTRONIC DEVICE, ELECTRONIC DEVICE MANUFACTURING APPARATUS, AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE
#2INTEGRATED DICING DIE BONDING SHEET AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE
#3Self-packing three-arm thermal scanning probe for micro-nano manufacturing
#4MICRO-ELECTROMECHANICAL SYSTEM (MEMS) BASED INERTIAL SENSOR AND METHOD OF FABRICATION THEREOF
#5A PROCESS AND APPARATUS FOR THE PREPARATION OF A BONDED SUBSTRATE
#6Semiconductor removing apparatus and operation method thereof
#7Additive manufacturing processes and manufactured article
#8Transparent material processing method, transparent material processing device, and transparent material
#9Deposition Apparatus
#10Method and system for fabricating a microelectromechanical system device with a movable portion using anodic etching of a sacrificial layer
#11METHOD AND APPARATUS FOR ETCHING A SUBSTRATE
#12Transfer head and method for transferring micro devices
#13MEMS manufacturing system and MEMS manufacturing method
#14Micro-electro-mechanical-systems processing method, and micro-electro-mechanical-systems processing apparatus
#15Microelectro-mechanical system device and method for electrostatic bonding the same
#16MEMS manufacturing method and MEMS manufacturing apparatus
#17Additive manufacturing processes and manufactured article
#18Methods and systems for fast imprinting of nanometer scale features in a workpiece
#19Circuit board module comprising a continuous cavity, associated sonic transducer assembly, and production method
#20Adhesive tape separating tool, manufacturing apparatus of semiconductor chip, manufacturing apparatus of MEMS device manufacturing apparatus of liquid ejecting head, and separating method of adhesive tape
#21Device manufacturing method and device manufacturing apparatus
#22Microstructure processing method and microstructure processing apparatus
#23Method of manufacturing micro-array substrate
#24Method for manufacturing microcantilever
#25Method of selectively removing an anti-stiction layer on a eutectic bonding area
#26System for manufacturing microneedle preparation, and air-conditioning method
#27Ultra-high speed anisotropic reactive ion etching
#28Room temperature bonding apparatus and room temperature bonding method
#29ROOM-TEMPERATURE BONDING APPARATUS AND ROOM-TEMPERATURE BONDING METHOD
#30Methods and systems for fast imprinting of nanometer scale features in a workpiece
#31Method for manufacturing a structured surface
#32Substrate etching method and substrate processing device
#33Inertial angular sensor of balanced MEMS type and method for balancing such a sensor
#34ULTRA-HIGH SPEED ANISOTROPIC REACTIVE ION ETCHING
#35Microfluidic surface processing systems with self-regulated distance-to surface control
#36Nanopositioning substrate preparation apparatus and preparation method using dip pen nanolithography with a single tip or multiple tips using atomic force microscope (AFM)
#37Microfluidic surface processing systems with self-regulated distance-to surface control
#38Micropattern generation with pulsed laser diffraction
#39Micropattern generation with pulsed laser diffraction
#40Integrated processing and critical point drying systems for semiconductor and MEMS devices
#41MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE AND APPARATUS FOR MANUFACTURING SEMICONDUCTOR DEVICE
#42NanoNeedles Pulling System
#43Bonding unit control unit and multi-layer bonding method
#44Nano pattern writer
#45Cantilevers for deposition
#46Apparatus and method for forming self-assembly arrays
#47Nano pattern writer
#48Device and method for coating a microstructured and/or nanostructured structural substrate
#49Atmospheric process and system for controlled and rapid removal of polymers from high aspect ratio holes
#50Wafer protection device
#51Methods, apparatus, and systems for fabricating solution-based conductive 2D and 3D electronic circuits