87126 ⎘
Severing cooled glass; Cutting or splitting sheet glass or ribbons ; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
Sub-classes:METHOD OF MANUFACTURING WINDOW GLASS
#2METHOD OF MANUFACTURING WINDOW AND WINDOW MANUFACTURED BY THE SAME
#3Method of manufacturing window and window manufactured by the same
#4Structured plate-like glass element and process for the production thereof
#5Structured plate-like glass element and process for the production thereof
#6ARTICLES CAPABLE OF INDIVIDUAL SINGULATION
#7Device for press-cutting glass, method for press-cutting glass, and glass-cutting system
#8ARTICLES HAVING EDGES WITH COMPRESSIVE RESIDUAL STRESS AND METHODS OF FORMING THE SAME
#9Articles capable of individual singulation
#10Cutting system for slabs
#11Display panel motherboard, and method for manufacturing display panel
#12Structured plate-like glass element and process for the production thereof
#13Laser processing method and laser processing apparatus
#14Processing 3D shaped transparent brittle substrate
#15Method for dividing brittle substrate
#16METHOD AND SYSTEM FOR SCORING GLASS SHEET
#17Apparatus and method for forming holes in glass substrate
#18CUTTING MACHINE FOR CUTTING A GLASS SHEET
#19Substrate cutting system
#20METHOD FOR MANUFACTURING LAMINATED GLASS, AND METHOD FOR CALIBRATING STEREO CAMERA
#21Method for cutting single sheet of glass substrate
#22MANUFACTURING OF WAFER-LIKE THIN GLASS PLATES HAVING STRUCTURES THEREON AND SEPARATION THEREOF INTO INDIVIDUAL SMALLER THIN GLASS PLATES
#23METHOD FOR SEPARATING THIN GLASS
#24Method for cutting plate-like glass, and cutting device therefor
#25Multi-laser system and method for cutting and post-cut processing hard dielectric materials
#26Laminated glass structure and method of manufacture
#27Sheet glass, method for manufacturing sheet glass, and device for manufacturing sheet glass
#28Processing 3D shaped transparent brittle substrate
#29Tempered glass cutting method and cutting apparatus
#30Laser processing method and laser processing apparatus
#31METHOD OF SEPARATING A GLASS SHEET FROM A CARRIER
#32Methods for scribing and separating strengthened glass substrates
#33Methods of manufacturing a thin glass pane
#34Glass plate scribing apparatus
#35METHOD AND DEVICE FOR PRODUCING EDGE CUTOUTS IN SHEET GLASS
#36METHOD FOR CUTTING PLATE-LIKE GLASS, AND CUTTING DEVICE THEREFOR
#37Preventing gas from occupying a spray nozzle used in a process of scoring a hot glass sheet
#38Methods of separating strengthened glass sheets by mechanical scribing
#39Methods for scribing and separating strengthened glass substrates
#40Mechanical scoring and separation of strengthened glass
#41Reinforced plate glass and method for manufacturing the same
#42STRENGTHENED GLASS, TOUCH PANEL AND METHOD OF MANUFACTURING STRENGTHENED GLASS
#43CUTTING DEVICE AND METHOD FOR PRODUCING FOAM GLASS BOARDS
#44Laser processing method and laser processing apparatus
#45LASER PROCESSING METHOD AND LASER PROCESSING APPARATUS
#46Method of manufacturing a semiconductor device formed using a substrate cutting method
#47Laser processing method and laser processing apparatus
#48Laser processing method and laser processing apparatus
#49Methods for separating glass articles from strengthened glass substrate sheets
#50Preventing gas from occupying a spray nozzle used in a process of scoring a hot glass sheet
#51Methods for scribing and separating strengthened glass substrates
#52Glass plate scribing method
#53Mechanical scoring and separation of strengthened glass
#54Method for cutting tempered glass and preparatory tempered glass structure
#55Brittle Material Substrate Chamfering Method
#56Method of cutting a wafer-like object and semiconductor chip
#57Method of cutting a substrate and method of manufacturing a semiconductor device
#58Method of cutting a substrate, method of processing a wafer-like object, and method of manufacturing a semiconductor device
#59Method of cutting a substrate, method of cutting a wafer-like object, and method of manufacturing a semiconductor device
#60Glass substrate processing device using laser beam
#61Preventing gas from occupying a spray nozzle used in a process of scoring a hot glass sheet
#62Laser processing method and laser processing apparatus
#63Device and method for severing a continuous glass strip
#64REINFORCED PLATE GLASS AND METHOD FOR MANUFACTURING THE SAME
#65Glass sheet separating device
#66Laser processing method and laser processing apparatus
#67Scoring of non-flat materials
#68Display device having pair of glass substrates and method for cutting it
#69Methods for separating electronic components utilizing a manipulator to transport the electronic components between first and second cutting tools
#70Motherboard Cutting Method, Motherboard Scribing Apparatus, Program and Recording Medium
#71Workpiece dividing method utilizing laser beam
#72Substrate dividing system, substrate manufacturing equipment, substrate scribing method and substrate dividing method
#73Laser beam machining method
#74Glass cutting method and apparatus therefor
#75Laser processing method for cutting a wafer-like object by using a laser to form modified regions within the object
#76Substrate-cutting system, substrate-producing apparatus, substrate-scribing method, and substrate-cutting method
#77Method for dividing substrate and method for manufacturing substrate using such method
#78Method and device for scribing fragile material substrate
#79Laser processing method and laser processing apparatus
#80Method of cutting glass substrate material
#81Glass cutting method which does not involve breaking
#82Laser processing method and laser processing apparatus
#83Laser cutting by forming a modified region within an object and generating fractures
#84Laser processing method and laser processing apparatus
#85Glass processing equipment with dynamic continuous production control system
#86Laser processing method and laser processing apparatus
#87Method for producing color-wheel segments
#88Laser processing method and laser processing apparatus
#89Filamentary cutting of brittle materials using a picosecond pulsed laser