90044 ⎘
Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating; Aspects relating to interlayers, e.g. used to join ceramic articles with other articles by heating; Metallic interlayers based on aluminium
CERAMIC MATERIAL, POWDER, AND LAYER SYSTEM COMPRISING THE CERAMIC MATERIAL
#2MULTI-LAYER CERAMIC PLATE DEVICE
#3Method for producing a metal-ceramic substrate with electrically conductive vias
#4Temperature barrier coating for rim-rotor
#5Ceramic material, powder, and layer system comprising the ceramic material
#6Semiconductor substrate support with multiple electrodes and method for making same
#7Method for fabricating perfectly wetting surfaces
#8Method for producing a metal-ceramic substrate with at least one via
#9Electrostatic chuck for clamping in high temperature semiconductor processing and method of making same
#10Aluminum Encapsulation of Ceramic Spheres for Armor Applications
#11Semiconductor substrate support with multiple electrodes and method for making same
#12Low temperature method for hermetically joining non-diffusing ceramic materials in multi-layer plate devices
#13Bond protection around porous plugs
#14HYDROPHOBIC MATERIALS INCORPORATING RARE EARTH ELEMENTS AND METHODS OF MANUFACTURE
#15METHOD FOR PRODUCING HERMETIC PACKAGE, AND HERMETIC PACKAGE
#16Metal-ceramic base material, metal-ceramic joint structure, method for producing metal-ceramic joint structure, and mixed powder material
#17Ceramic Material Assembly For Use In Highly Corrosive Or Erosive Industrial Applications
#18Method for joining silicon carbide components to one another
#19Method of bonding a metallic component to a non-metallic component using a compliant material
#20Ceramic metal circuit board and semiconductor device using the same
#21Member for semiconductor manufacturing apparatus and method for producing the same
#22Bonded body, substrate for power module with heat sink, heat sink, method for producing bonded body, method for producing substrate for power module with heat sink, and method for producing heat sink
#23Method for manufacturing substrate for power module with heat sink
#24Method for producing a metal-ceramic substrate with at least one via
#25Bonded body, substrate for power module with heat sink, heat sink, method for producing bonded body, method for producing substrate for power module with heat sink, and method for producing heat sink
#26Neutron Absorbing Composite Material and Method of Manufacture
#27Method of Joining Metal-Ceramic Substrates to Metal Bodies
#28Electrostatic chuck for clamping in high temperature semiconductor processing and method of making same
#29Method for manufacture of a multi-layer plate device
#30Low temperature method for hermetically joining non-diffusing ceramic materials in multi-layer plate devices
#31Metal-on-ceramic substrates
#32Hybrid nanocomposite coatings and applications thereof
#33Bonded body, power module substrate, power module and method for producing bonded body
#34Power-module substrate unit and power module
#35Multi-layer plate device
#36Power module substrate, power module substrate with heat sink, power module, method of manufacturing power module substrate, and copper member-bonding paste
#37Method of bonding a metallic component to a non-metallic component using a compliant material
#38Process for producing a target formed of a sintering-resistant material of a high-melting point metal alloy, silicide, carbide, nitride or boride
#39Joined body manufacturing method
#40Joined body manufacturing method and joined body
#41Copper-ceramic bonded body and power module substrate
#42Ceramic wavelength converter having a high reflectivity reflector
#43Method for producing a metal-ceramic substrate
#443D infiltration method
#45Method for fabricating silicon carbide assemblies
#46Gas turbine engine CMC airfoil assembly
#47Braze materials and method for joining of ceramic matrix composites
#48Apparatus and method for producing (metal plate)-(ceramic board) laminated assembly, and apparatus and method for producing power-module substrate
#49Method for manufacturing bonded body and method for manufacturing power-module substrate
#50Manufacturing method of power-module substrate
#51HIGH CAPACITY ELECTRODE FOR ELECTRIC DUAL LAYER CAPACITOR AND METHOD OF MANUFACTURING THE SAME
#52Power-module substrate and manufacturing method thereof
#53Manufacturing method of power-module substrate
#54Ceramic to ceramic joining method
#55Power module substrate, power module substrate with heat sink, power module, method of manufacturing power module substrate, and copper member-bonding paste
#56Low temperature method for hermetically joining non-diffusing ceramic materials
#57Power module substrate with heat sink, and method for producing power module substrate with heat sink
#58Soldering method and method of manufacturing semiconductor device
#59Sealing assembly, method for preparing sealing assembly, and battery comprising the sealing assembly
#60Metal-ceramic substrate
#61Layered deposition for reactive joining of composites
#62Method for manufacture of a multi-layer plate device
#63Power module substrate, power module substrate with heat sink, power module, and method of manufacturing power module substrate
#64Shock absorbing member
#65Infiltration compositions for PCD by using coated carbide substrates
#66Hydrophobic Materials Incorporating Rare Earth Elements and Methods of Manufacture
#67Ceramic substrate, method of manufacturing ceramic substrate, and method of manufacturing power module substrate
#68Multi-layer plate device
#69Boron carbide-containing ceramic bonded body and method for producing the bonded body
#70Composite Material
#71BRAZED COATED DIAMOND-CONTAINING MATERIALS
#72Method of joining metal-ceramic substrates to metal bodies
#73Method of manufacturing power module substrate and power module substrate
#74Double-sided substrate, semiconductor device and method for the same
#75Composite articles made by process for joining bronze part and silicon carbide ceramic part
#76Composite articles made by process for joining brass part and silicon carbide ceramic part
#77Method for metallizing ceramic surface and method for connecting ceramic with aluminum
#78Metal-ceramic substrate and method for manufacturing such a substrate
#79PROCESS FOR JOINING STAINLESS STEEL PART AND ALUMINA CERAMIC PART AND COMPOSITE ARTICLES MADE BY SAME
#80On the production of metal-ceramic compounds
#81Ceramic to ceramic joint and associated methods
#82Power module substrate, power module, and method for manufacturing power module substrate
#83Power module substrate, power module, and method for manufacturing power module substrate
#84Double transition joint for the joining of ceramics to metals
#85Diamond bonded construction with improved braze joint
#86CERAMIC SUBSTRATE, METHOD OF MANUFACTURING CERAMIC SUBSTRATE, AND METHOD OF MANUFACTURING POWER MODULE SUBSTRATE
#87Al/AlN joint material, base plate for power module, power module, and manufacturing method of Al/AlN joint material
#88Diffusion barriers in modified air brazes
#89Superconducting connection between MgB2 superconducting wires via a compressed element made from HTS powder
#90COMPONENT HAVING A METALIZED CERAMIC BASE
#91Method for producing a vacuum measuring cell of the membrane type
#92COMPONENT HAVING A CERAMIC BASE THE SURFACE OF WHICH IS METALIZED
#93Functionally graded high temperature bonding of fiberglass fibers to steel
#94Ceramic multilayer substrate and method for manufacturing the same
#95Component having a ceramic base with a metalized surface
#96Sheet body of solid oxide fuel cell, and solid oxide fuel cell
#97Electronic Component Union, Electronic Circuit Module Utilizing the Same, and Process for Manufacturing the Same
#98THERMAL BARRIER SYSTEM AND BONDING METHOD
#99Method of producing a material composite
#100Target formed of sintering-resistant material of high-melting point metal alloy, high-melting point metal silicide, high-melting point metal carbide, high-melting point metal nitride, or high-melting point metal boride, process for producing the target, assembly of the sputtering target-backing plate, and process for producing the same
#101Composite structure for microlithography and optical arrangement
#102LOW TEMPERATURE REACTIVE COMPOSITE JOINING
#103Brazed joint between a metal part and a ceramic part
#104Diffusion barriers in modified air brazes
#105AI/AIN JOINT MATERIAL, BASE PLATE FOR POWER MODULE, POWER MODULE, AND MANUFACTURING METHOD OF AI/AIN JOINT MATERIAL
#106CERAMIC ARMOR, METHODS OF JOINING A CARBIDE WITH A METAL-COMPRISING PIECE, AND METHODS OF METALLIZING CARBIDE-COMPRISING SURFACES
#107Al/AlN joint material, base plate for power module, power module, and manufacturing method of Al/AlN joint material
#108HIGH VELOCITY METALLIC POWDER SPRAY FASTENING
#109Joining of advanced materials by plastic deformation
#110Ceramic multilayer substrate and method for manufacturing the same
#111Ceramic circuit board, method for making the same, and power module
#112Method of manufacturing a metal-ceramic circuit board
#113Joined body and manufacturing method for the same
#114Method of joining ceramics: reaction diffusion-bonding
#115Material composite and method of producing the composite
#116Metal-ceramic joined article and production method
#117Laminated radiation member, power semiconductor apparatus, and method for producing the same
#118Composite body made of ceramic layers and method for its manufacture
#119Method of manufacturing a metal-ceramic circuit board
#120Method of fabricating substrate placing stage
#121Module structure and module comprising it
#122Composite material, wafer holding member and method for manufacturing the same
#123Method of bonding and resulting product
#124Brazing tape and method of forming microchannels in a thermal barrier coating