ClassID:

89216

C04B41/4541 - CPC Classification

Classification description:

After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone; Coating or impregnating e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements, characterised by the method of application applied as a solution, emulsion, dispersion or suspension Electroless plating

Recent Application in this class:
#1
20190177231
2019-06-13

Ceramic device and manufacturing method thereof

#2
20130164554
2013-06-27

Method for manufacturing a porous device with restrictive layer and structure thereof

#3
20130101832
2013-04-25

NOBLE METAL COATING AND MANUFACTURING METHOD THEREOF

#4
20120064243
2012-03-15

PREPARATION OF NANOSTRUCTURED MICROPOROUS COMPOSITE FOAMS

#5
20110316040
2011-12-29

Composite substrate for LED light emitting element, method of production of same, and LED light emitting element

#6
20110259753
2011-10-27

Ceramic element inlaid with at least one metallic decoration

#7
20110177232
2011-07-21

Method for the fabrication of composite palladium and palladium-alloy membranes

#8
20110086218
2011-04-14

Composite material, having high thermal conductivity and low thermal expansion coefficient, and heat-dissipating substrate, and their production methods

#9
20110003145
2011-01-06

METALLIZED COIL BODIES (INDUCTOR) HAVING HIGH Q-VALUE

#10
20100015468
2010-01-21

METHOD FOR MANUFACTURING METALLIZED ALUMINUM NITRIDE SUBSTRATE

#11
20090092793
2009-04-09

Aluminum/silicon carbide composite and radiating part comprising the same

#12
20080038535
2008-02-14

COMPOSITE MATERIAL, HAVING HIGH THERMAL CONDUCTIVITY AND LOW THERMAL EXPANSION COEFFICIENT, AND HEAT-DISSIPATING SUBSTRATE, AND THEIR PRODUCTION METHODS

#13
20070132127
2007-06-14

Composite material, having high thermal conductivity and low thermal expansion coefficient, and heat-dissipating substrate, and their production methods

#14
20070042215
2007-02-22

Aluminum/ceramic bonding substrate and method for producing same

#15
20060121200
2006-06-08

Electroless plating of piezoelectric ceramic

#16
20050241953
2005-11-03

Electroless nickel plating method for the preparation of zirconia ceramic

#17
20050224461
2005-10-13

Method for metallizing titanate-based ceramics

#18
20050203231
2005-09-15

Polymer ceramic slip and method of manufacturing ceramic green bodies there therefrom

#19
20050156362
2005-07-21

Piezoelectric device and method of manufacturing same

#20
20050072547
2005-04-07

Aluminum/ceramic bonding substrate and method for producing same