C08G16/02 - CPC Classification Index

ClassID:

98696 ⎘

C08G16/02 - CPC Classification

Classification description:

Condensation polymers of aldehydes or ketones with monomers not provided for in the groups - of aldehydes

Sub-classes:

C08G16/0206 » {with inorganic compounds} 2
C08G16/0212 » {with acyclic or carbocyclic organic compounds} 3
C08G16/025 » {with heterocyclic organic compounds} 2
C08G16/0287 » {with organometallic or metal-containing organic compounds} 0
C08G16/0293 » {with natural products, oils, bitumens, residues} 8
C08G16/04 » Chemically modified polycondensates 13

Recent Application in this class:

20190330495

2019-10-31

Directly polymerized cashew nut shell liquid (CNSL) and bitumen compositions comprising the same

20180298300

2018-10-18

Intrinsic low friction polyoxymethylene

20180029935

2018-02-01

Dispersant composition for hydraulic composition

20170261534

2017-09-14

Poly(thioaminal) probe based lithography

20170153269

2017-06-01

Poly(thioaminal) probe based lithography

20170152384

2017-06-01

Process for preparing a polymerized cashew nut shell liquid and its use for the preparation of a bitumen composition

20150111796

2015-04-23

Intrinsic low friction polyoxymethylene

20120077345

2012-03-29

Carbazole novolak resin

20110275759

2011-11-10

Preparation and use of branched polymers containing hydroxyl and acrylate groups

#10

20110272621

2011-11-10

PROCESS FOR MANUFACTURING INSULATION PRODUCTS BASED ON MINERAL WOOL, AND PRODUCTS OBTAINED

#11

20110245122

2011-10-06

Lubricating Oil Composition

#12

20100087590

2010-04-08

Epdxy resin composition and cured article thereof, semiconductor encapsulation material, novel phenol resin, and novel epdoxy resin

#13

20090054585

2009-02-26

Epoxy resin composition and cured article thereof, semiconductor encapsulation material, novel phenol resin, and novel epoxy resin

#14

20060183879

2006-08-17

Process for producing a naphthalenesulfonate formaldehyde condensate