100079 ⎘
Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule characterised by the polymer type Polyhydroxyethers, e.g. phenoxy resins
STRUCTURAL ADHESIVES
#2MODIFIED POLYPHENYLENE ETHER RESIN, PREPARATION METHOD THEREOF, AND RESIN COMPOSITION INCLUDING THEREOF
#3AQUEOUS COATING COMPOSITIONS INCLUDING POLYMERS CONTAINING REACTIVE CARBONYL GROUPS
#4CURABLE COMPOSITION, CURED PRODUCT, ADHESIVE, AND SEALING MATERIAL
#5CURABLE COMPOSITION, CURED PRODUCT, ADHESIVE, AND SEALING MATERIAL
#6RESIN COMPOSITION AND ARTICLE MADE THEREFROM
#7METHODS FOR COATING FOOD AND BEVERAGE CONTAINERS AND OTHER ARTICLES
#8STRUCTURAL ADHESIVES
#9POLY(ARYLENE ETHER) COPOLYMER, METHOD TO PREPARE THE SAME, AND ARTICLE DERIVED THEREFROM
#10THERMOSETTING RESIN COMPOSITION, RESIN SHEET, AND METAL BASE SUBSTRATE
#11Aqueous polyglycidol synthesis with ultra-low branching
#12HIGHLY HEAT-RESISTANT THERMOPLASTIC RESIN COMPOSITION AND MOLDED ARTICLE MANUFACTURED THEREFROM
#13Structural adhesives
#14Methods of preparing compositions for containers and other articles and methods of using same
#15COMPOSITIONS FOR CONTAINERS AND OTHER ARTICLES AND METHODS OF USING SAME
#16POLYETHERS CONTAINING NON-BISPHENOLIC CYCLIC GROUPS
#17UV curable epoxy/acrylate adhesive composition
#18Process for making polyether diols
#19Container coating system
#20HIGH MOLECULAR WEIGHT POLY(PHENYLENE ETHER) AND PROCESS FOR THE PREPARATION THEREOF
#21POLYMERS CONTAINING REACTIVE CARBONYL GROUPS AND COATING COMPOSITIONS CONTAINING SUCH POLYMERS
#22Aqueous polyglycidol synthesis with ultra-low branching
#23Thermoplastic temporary adhesive for silicon handler with infra-red laser wafer de-bonding
#24Food or Beverage Packages and Methods of Coating Such Packages
#25Adhesive composition and film roll
#26Resin composition and electric insulating sheet
#27Poly(2,6-dimethyl-1,4-phenylene-oxide) derivatives with sulfonyl pendant groups and methods therefor
#28Curable composition
#29STABILIZER AND COATING COMPOSITIONS THEREOF
#30Workpiece treating method, semiconductor device, process for manufacturing the same, and temporary fixing composition for shear peeling
#31Composites with interlaminar toughening particles and method of making the same
#32Peg-based ligands with enhanced dispersibility and improved performance
#33Adhesive film and sealing product for organic electronic device using same
#34Poly(2,6-dimethyl-1,4-phenylene-oxide) derivatives with sulfonyl pendant groups and methods therefor
#35Methods of preparing compositions for containers and other articles and methods of using same
#36Anisotropic conductive film
#37Polarizing plate using adhesive composition and optical member comprising the same
#38Resin compositions for underfill film for three dimensional through silica via (TSV) packages and compositions useful for the preparation thereof
#39Structural adhesive with improved corrosion resistance
#40Temporary bonding material, laminate, method for manufacturing laminate, method for manufacturing device substrate, and method for manufacturing semiconductor device
#41Thermoplastic temporary adhesive for silicon handler with infra-red laser wafer de-bonding
#42Aqueous polyglycidol synthesis with ultra-low branching
#43UV curable epoxy/acrylate adhesive composition
#44Carbon fibre-containing prepregs
#45Relating to structural adhesives
#46Polymer comprising repeating units consisting of a substituted pyrrole ring and products obtained by combining said polymers with carbon allotropes
#47Comb-like polyetheralkanolamines in inks and coatings
#48Polyethers containing non-bisphenolic cyclic groups
#49Anti-corrosive coating composition
#50Thermoplastic temporary adhesive for silicon handler with infra-red laser wafer de-bonding
#51Thermoplastic temporary adhesive for silicon handler with infra-red laser wafer de-bonding
#52Adhesive composition and film roll
#53Sealing resin composition and sealing sheet
#54Thermoformable polymer thick film transparent conductor and its use in capacitive switch circuits
#55Bisphenol-A free polyether resins based on phenol stearic acid and coating compositions formed therefrom
#56High K dielectric composition for thermoformable capacitive circuits
#57Comb-like polyetheralkanolamines in inks and coatings
#58Binder resin composition for preform, binder particle, preform, and fiber-reinforced composite material
#59Structural adhesives
#60Copolymer of a bisphenol diglycidyl ether and a phenolphthalene and/or a phenolphthalimidine, method for the preparation thereof, article comprising the copolymer, and compositions comprising the copolymer
#61Aqueous polyglycidol synthesis with ultra-low branching
#62Stabilizer and coating compositions thereof
#63Container coating system
#64Photocurable adhesive composition
#65Adhesive film and sealing product for organic electronic device using same
#66Blends of liquid epoxy and solid phenoxy resins
#67Adhesive material
#68Aqueous polymer composition for paper coating
#69Method of manufacturing non-firing type electrode
#70Structural adhesives
#71Phenoxy resin composition for transparent plastic substrate and transparent plastic substrate using the same
#72Tagged polymers and methods of use
#73Transparent resin composition
#74Film formation composition for preventing blackening of steel sheet, and steel sheet having film formed by composition
#75Thermoplastic melt-mixed composition with polyetherol heat stabilizer
#76Adhesive composition, varnish, adhesive film and wiring film
#77Oriented structural adhesives
#78Anisotropic conductive material and process for production thereof, and mounting body and process for production thereof
#79Powder coatings compositions
#80THERMOFORMABLE POLYMER THICK FILM SILVER CONDUCTOR AND ITS USE IN CAPACITIVE SWITCH CIRCUITS
#81Structural adhesives
#82Poly(arylene ether)-poly(hydroxy ether) block copolymer and method of making
#83Polymer electrolytes based on poly(glycidyl ether)s
#84Bisphenol-A replacement materials
#85PHENOXY RESIN COMPOSITION FOR TRANSPARENT PLASTIC SUBSTRATE AND TRANSPARENT PLASTIC SUBSTRATE USING THE SAME
#86ANISOTROPIC CONDUCTIVE FILM, JOINED STRUCTURE, AND CONNECTING METHOD
#87Production method of connection structure
#88CONDUCTIVE CONNECTING MATERIAL, METHOD FOR CONNECTING TERMINALS AND METHOD FOR PRODUCING CONNECTION TERMINAL
#89ADHESIVE FILM LAYER FOR PRINTED CIRCUIT BOARD APPLICATIONS
#90ZINC PLATING BATH ADDITIVE AND ALKALINE NON-CYANIDE ZINC PLATING BATH
#91Adhesive composition, adhesive film and wiring film using the same
#92ADHESIVE RESIN COMPOSITION, AND LAMINATE AND FLEXIBLE PRINTED WIRING BOARD USING THE SAME
#93ADHESIVE RESIN COMPOSITION, AND LAMINATE AND FLEXIBLE PRINTED WIRING BOARD USING THE SAME
#94EPOXY RESIN COMPOSITION, PREPREG, CARBON FIBER REINFORCED COMPOSITE MATERIAL, AND HOUSING FOR ELECTRONIC OR ELECTRICAL COMPONENT
#95Adhesive tape for manufacturing electronic components
#96Adhesive resin compositions, and laminates and flexible printed wiring boards using same
#97Epoxy resin production
#98Aromatic ether and alkynyl containing phthalonitriles
#99FILM ADHESIVE AND ANISOTROPIC CONDUCTIVE ADHESIVE
#100Adhesive composition and sheet for forming semiconductor wafer-protective film
#101Curing accelerator for epoxy resin composition, and one-pack type thermosetting epoxy resin composition
#102PHOTOCURABLE ADHESIVE COMPOSITION
#103Method for the preparation of a reinforced thermoset polymer composite
#104Acrylic insulating adhesive
#105ANISOTROPIC ELECTRICALLY CONDUCTIVE FILM AND METHOD FOR MANUFACTURING CONNECTION ASSEMBLY USING THE SAME
#106Structural adhesives
#107Resin Composition for Pre-Coated Steel Sheet and Steel Sheet Having Excellent Processibility, Heat Resistance and Corrosion Resistance Properties
#108LAMINATION METHOD OF ADHESIVE TAPE AND LEAD FRAME
#109Epoxy resin composition, resin sheet, prepreg, multilayer printed wiring board and semiconductor device
#110Anisotropic conductive film
#111ANISOTROPIC CONDUCTIVE FILM
#112Windscreen wiper device
#113Cationic electrodeposition coating composition
#114INSULATING SHEET AND MULTILAYER STRUCTURE
#115Multi-layer article for flexible printed circuits
#116Epoxy Resin, Method for Producing Same and Epoxy Resin Composition Thereof
#117Photocurable resin composition for sealing organic EL device
#118Thermoplastic polyhydroxy polyether resin and resin composition comprising the same
#119Water soluble co-polyhydroxyaminoether and solution thereof
#120Shape memory polymers with surface having dangling adhesive polymeric chains and methods of making and using the same
#121ADHESIVE COMPOSITION COMPRISING POLYHYDROXYETHER AND ORGANIC PARTICLES, AND METHOD FOR CONNECTING CIRCUIT BOARD USING THE SAME
#122THERMOSETTING RESIN COMPOSITION
#123Solder resist material, wiring board using the solder resist material, and semiconductor package
#124Composition of (Meth)acrylate resin and hydroxy group-containing aromatic resin
#125Anisotropic electrically conductive film and connection structure
#126Latent curing agent
#127Waterborne corrosion-resistant coating
#128Aromatic ether and alkynyl containing phthalonitriles
#129Ionically conductive polymers for use in fuel cells
#130Aromatic ether polymer, method for producing the same, and polymer composition
#131FLAME-RETARDANT RESIN COMPOSITION, PREPREG, RESIN SHEET, AND MOLDING
#132Process for preparing water-soluble polyhydroxyaminoether
#133Flame-retardant prepreg
#134Crosslinkers containing silane
#135Coating composition
#136PROCESS FOR PREPARING WATER-SOLUBLE POLYHYDROXYAMINOETHER
#137Halogen free ignition resistant thermoplastic resin compositions
#138Water-soluble polyhydroxyaminoether and process for preparing the same
#139Composition for forming anti-reflective coating for use in lithography