ClassID:

99139

C08G59/1433 - CPC Classification

Classification description:

Polycondensates containing more than one epoxy group per molecule ; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups; Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds

Sub-classes:
Recent Application in this class:
#1
20200392340
2020-12-17

SILICONE-MODIFIED EPOXY RESIN COMPOSITION AND SEMICONDUCTOR DEVICE

#2
20190135970
2019-05-09

Preparation method of epoxy compound having alkoxysilyl group, epoxy compound having alkoxysilyl group, composition comprising the same, and use thereof

#3
20190010309
2019-01-10

Reactive compositions containing mercapto-functional silicon compound

#4
20180334567
2018-11-22

Silicone-modified epoxy resin composition and semiconductor device

#5
20170198085
2017-07-13

Polyurethane-modified epoxy resin, method for producing same, epoxy resin composition and cured product

#6
20170174880
2017-06-22

Low dielectric constant and solventless resin composition and substrate structure

#7
20170158926
2017-06-08

LIQUID RESIN COMPOSITION, DIE ATTACHING METHOD USING SAME AND SEMICONDUCTOR DEVICE HAVING CURED PRODUCT OF SAME

#8
20170152369
2017-06-01

Reactive compositions containing mercapto-functional silicon compound

#9
20150203626
2015-07-23

Novolac-based epoxy compound, production method for same, composition and cured article comprising same, and use for same

#10
20150073102
2015-03-12

Aminoanthracene—epoxy nanocomposite containing free anthracene

#11
20140342244
2014-11-20

Electrolyte including silane for use in electrochemical devices

#12
20140275336
2014-09-18

Low-density molding compound

#13
20110143064
2011-06-16

COMPOSITION FOR REINFORCING HOLLOW GLASS AND PROTECTING SAME FROM SCRATCHING, CORRESPONDING TREATMENT METHODS AND RESULTING TREATED HOLLOW GLASS

#14
20100311870
2010-12-09

WATER-BORNE EPOXY RESIN SYSTEMS

#15
20100204360
2010-08-12

Low-density molding compound

#16
20090093611
2009-04-09

Epoxy/modified silicon dioxide corrosion resistant nanocomposite material and preparation method thereof

#17
20080223255
2008-09-18

Film-forming material containing resin with -Si(OR)and crosslinkable groups

#18
20080214734
2008-09-04

Manufacturing method of ladder-like phosphorous-containing polysilsesquioxanes nanocomposite material

#19
20080075871
2008-03-27

LOW TEMPERATURE, MOISTURE CURABLE COATING COMPOSITIONS AND RELATED METHODS

#20
20080003524
2008-01-03

Sulfonate-containing anti-reflective coating forming composition for lithography

#21
20070088147
2007-04-19

Epoxy resin, epoxy resin composition including the epoxy resin and method of preparing the epoxy resin

#22
20060258781
2006-11-16

Low-density molding compound

#23
20050158556
2005-07-21

Nanoporous laminates

#24
20050020735
2005-01-27

Epoxide adducts and their salts as dispersants