ClassID:

99154

C08G59/186 - CPC Classification

Classification description:

Polycondensates containing more than one epoxy group per molecule ; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing using pre-adducts of epoxy compounds with curing agents with acids

Recent Application in this class:
#1
20260071099
2026-03-12

STRUCTURAL ADHESIVES

#2
20250320391
2025-10-16

Toughened Two Component Epoxy Structural Adhesive

#3
20250320329
2025-10-16

DUAL CURING COMPOSITION BASED ON METHACRYLATE FUNCTIONAL COMPOUNDS

#4
20250092185
2025-03-20

Improved Structural Bonding Adhesive

#5
20230257633
2023-08-17

STRUCTURAL ADHESIVES

#6
20220119681
2022-04-21

Structural adhesives

#7
20210380755
2021-12-09

Structural bonding adhesive

#8
20210139640
2021-05-13

Bio-based epoxy resins, compositions, and methods thereof

#9
20200170923
2020-06-04

Use of polycarboxylic acid compounds for the treatment of fibrious amino acid based substrates, especially hair

#10
20200165481
2020-05-28

Resin composition and cured resin composition

#11
20200087442
2020-03-19

Epoxy resin, epoxy resin-containing composition and cured product thereof

#12
20190218435
2019-07-18

Bonding Dissimilar Materials with Adhesive Paste

#13
20180362776
2018-12-20

Method for preventing hardener compounds to be formed from hardener precursors in an aerosol formulation and a two-component aerosol formulation

#14
20180181001
2018-06-28

Resist underlayer film-forming composition comprising epoxy adduct having long-chain alkyl group

#15
20170327629
2017-11-16

Polyphenolic condensates and epoxy resins thereof

#16
20170321094
2017-11-09

Epoxy resin composition

#17
20170291984
2017-10-12

Photosensitive resin composition for optical waveguide and photocurable film for forming optical waveguide core layer, and optical waveguide and opto-electric transmission hybrid flexible printed wiring board using same

#18
20170240774
2017-08-24

Relating to structural adhesives

#19
20170145245
2017-05-25

Water dispersible, self-crosslinkable prepolymer composition

#20
20160244604
2016-08-25

White heat-curable epoxy resin composition, optical semiconductor element case made of the white heat-curable epoxy resin composition and optical semiconductor device comprised of the case

#21
20160108297
2016-04-21

Bonding dissimilar materials with adhesive paste

#22
20160039969
2016-02-11

Curing agent for epoxy resins

#23
20150119499
2015-04-30

Epoxy resins for waterborne dispersions

#24
20150087750
2015-03-26

Method for producing cellulose nanofiber, cellulose nanofiber, master batch, and resin composition

#25
20140378607
2014-12-25

Water dispersible, self-crosslinkable prepolymer composition

#26
20140199549
2014-07-17

Flexible bismaleimide, benzoxazine, epoxy-anhydride adduct hybrid adhesive

#27
20140154628
2014-06-05

Photosensitive resin composition, photosensitive film, permanent resist and method for producing permanent resist

#28
20130225728
2013-08-29

Adduct

#29
20120128499
2012-05-24

STRUCTURAL ADHESIVE COMPOSITIONS

#30
20120111618
2012-05-10

Flame retardant resin composition for multilayer wiring board and multilayer wiring board including the same

#31
20120007259
2012-01-12

Latent hardener with improved barrier properties and compatibility

#32
20110220401
2011-09-15

Latent hardener with improved barrier properties and compatibility

#33
20110098382
2011-04-28

Structural adhesives

#34
20110082229
2011-04-07

Carboxyl resin, hardening composition containing carboxyl resin, and hardened material thereof

#35
20110053091
2011-03-03

Sulfur atom-containing resist underlayer film forming composition and method for forming resist pattern

#36
20110045278
2011-02-24

Filling foam composition and foam filling member

#37
20100311870
2010-12-09

WATER-BORNE EPOXY RESIN SYSTEMS

#38
20100280143
2010-11-04

Sealant composition

#39
20100274043
2010-10-28

Adamantyl group-containing epoxy-modified (meth)acrylate and resin composition containing the same

#40
20100184923
2010-07-22

EPOXY RESIN COMPOSITION

#41
20100168268
2010-07-01

Epoxy resin, epoxy resin composition containing the epoxy resin as an essential component and a cured product containing the epoxy resin as an essential component

#42
20100167072
2010-07-01

Electrocoat composition and process replacing phosphate pretreatment

#43
20100166973
2010-07-01

Electrocoat composition and process replacing phosphate pretreatment

#44
20100148380
2010-06-17

Thermosetting epoxy resin composition and semiconductor device

#45
20100029892
2010-02-04

Fluorene-based resin polymer and method for preparing thereof

#46
20100015551
2010-01-21

Epoxy compound, alkali-developable resin composition, and alkali-developable photosensitive resin composition

#47
20090233231
2009-09-17

Photosensitive resin composition

#48
20090099330
2009-04-16

Adamantyl group-containing epoxy-modified (meth)acrylate and resin composition containing the same

#49
20090036570
2009-02-05

Water-based dispersions of highly-branched polymers

#50
20090020040
2009-01-22

Aqueous dispersions and coatings comprising modified epoxy resins comprising the reaction product of rosin and a dienophile

#51
20080249220
2008-10-09

Encapsulant of epoxy group-containing (meth)acrylic polymer, anhydride and (meth)acrylic monomer

#52
20070299218
2007-12-27

SOLDER-RESISTANT FLEXIBLE THERMOSETTING EPOXY RESIN SYSTEM

#53
20070191556
2007-08-16

Polymeric epoxy resin composition

#54
20070116964
2007-05-24

Adhesive compositions for flexible circuit materials, circuits, multi-layer circuits, and methods of manufacture thereof

#55
20070088138
2007-04-19

EPOXY/ELASTOMER ADDUCT, METHOD OF FORMING SAME AND MATERIALS AND ARTICLES FORMED THEREWITH