99154 ⎘
Polycondensates containing more than one epoxy group per molecule ; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing using pre-adducts of epoxy compounds with curing agents with acids
STRUCTURAL ADHESIVES
#2Toughened Two Component Epoxy Structural Adhesive
#3DUAL CURING COMPOSITION BASED ON METHACRYLATE FUNCTIONAL COMPOUNDS
#4Improved Structural Bonding Adhesive
#5STRUCTURAL ADHESIVES
#6Structural adhesives
#7Structural bonding adhesive
#8Bio-based epoxy resins, compositions, and methods thereof
#9Use of polycarboxylic acid compounds for the treatment of fibrious amino acid based substrates, especially hair
#10Resin composition and cured resin composition
#11Epoxy resin, epoxy resin-containing composition and cured product thereof
#12Bonding Dissimilar Materials with Adhesive Paste
#13Method for preventing hardener compounds to be formed from hardener precursors in an aerosol formulation and a two-component aerosol formulation
#14Resist underlayer film-forming composition comprising epoxy adduct having long-chain alkyl group
#15Polyphenolic condensates and epoxy resins thereof
#16Epoxy resin composition
#17Photosensitive resin composition for optical waveguide and photocurable film for forming optical waveguide core layer, and optical waveguide and opto-electric transmission hybrid flexible printed wiring board using same
#18Relating to structural adhesives
#19Water dispersible, self-crosslinkable prepolymer composition
#20White heat-curable epoxy resin composition, optical semiconductor element case made of the white heat-curable epoxy resin composition and optical semiconductor device comprised of the case
#21Bonding dissimilar materials with adhesive paste
#22Curing agent for epoxy resins
#23Epoxy resins for waterborne dispersions
#24Method for producing cellulose nanofiber, cellulose nanofiber, master batch, and resin composition
#25Water dispersible, self-crosslinkable prepolymer composition
#26Flexible bismaleimide, benzoxazine, epoxy-anhydride adduct hybrid adhesive
#27Photosensitive resin composition, photosensitive film, permanent resist and method for producing permanent resist
#28Adduct
#29STRUCTURAL ADHESIVE COMPOSITIONS
#30Flame retardant resin composition for multilayer wiring board and multilayer wiring board including the same
#31Latent hardener with improved barrier properties and compatibility
#32Latent hardener with improved barrier properties and compatibility
#33Structural adhesives
#34Carboxyl resin, hardening composition containing carboxyl resin, and hardened material thereof
#35Sulfur atom-containing resist underlayer film forming composition and method for forming resist pattern
#36Filling foam composition and foam filling member
#37WATER-BORNE EPOXY RESIN SYSTEMS
#38Sealant composition
#39Adamantyl group-containing epoxy-modified (meth)acrylate and resin composition containing the same
#40EPOXY RESIN COMPOSITION
#41Epoxy resin, epoxy resin composition containing the epoxy resin as an essential component and a cured product containing the epoxy resin as an essential component
#42Electrocoat composition and process replacing phosphate pretreatment
#43Electrocoat composition and process replacing phosphate pretreatment
#44Thermosetting epoxy resin composition and semiconductor device
#45Fluorene-based resin polymer and method for preparing thereof
#46Epoxy compound, alkali-developable resin composition, and alkali-developable photosensitive resin composition
#47Photosensitive resin composition
#48Adamantyl group-containing epoxy-modified (meth)acrylate and resin composition containing the same
#49Water-based dispersions of highly-branched polymers
#50Aqueous dispersions and coatings comprising modified epoxy resins comprising the reaction product of rosin and a dienophile
#51Encapsulant of epoxy group-containing (meth)acrylic polymer, anhydride and (meth)acrylic monomer
#52SOLDER-RESISTANT FLEXIBLE THERMOSETTING EPOXY RESIN SYSTEM
#53Polymeric epoxy resin composition
#54Adhesive compositions for flexible circuit materials, circuits, multi-layer circuits, and methods of manufacture thereof
#55EPOXY/ELASTOMER ADDUCT, METHOD OF FORMING SAME AND MATERIALS AND ARTICLES FORMED THEREWITH