ClassID:

99155

C08G59/188 - CPC Classification

Classification description:

Polycondensates containing more than one epoxy group per molecule ; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing using encapsulated compounds

Recent Application in this class:
#1
20220372207
2022-11-24

CURABLE COMPOSITIONS

#2
20220153923
2022-05-19

THERMOSETTING RESIN COMPOSITION, PREPREG, FIBER-REINFORCED PLASTIC MOLDED BODY AND METHOD FOR PRODUCING SAME

#3
20220152574
2022-05-19

EPOXIDE MICROCAPSULES WITH PICKERING EMULSIFIERS

#4
20210363289
2021-11-25

RESIN COMPOSITIONS AND RESIN INFUSION PROCESS

#5
20210102101
2021-04-08

Low-temperature heat-curable adhesive composition for structure

#6
20200377737
2020-12-03

Silicone-based protective formulations

#7
20200017677
2020-01-16

Epoxy stabilization using acid-coated nitrogen containing catalysts, particles, and methods

#8
20190291357
2019-09-26

Light generating microcapsules for photo-curing

#9
20190185612
2019-06-20

Thermosetting resin composition, prepreg, fiber-reinforced plastic molded body and method for producing same

#10
20190127514
2019-05-02

Resin compositions and resin infusion process

#11
20190040182
2019-02-07

Toughened epoxy resin composition

#12
20180371155
2018-12-27

Process for producing aluminum-chelate-based latent curing agent, and thermosetting epoxy resin composition

#13
20180340032
2018-11-29

Light generating microcapsules for photo-curing

#14
20180230367
2018-08-16

Sugar based epoxy resins with enhanced properties for sand consolidation in subterranean formations

#15
20170369633
2017-12-28

CURABLE AND CURED EPOXY RESIN COMPOSITIONS

#16
20170313919
2017-11-02

Encapsulated catalyst for aerospace grade resin systems

#17
20170253694
2017-09-07

Aluminum chelate-based latent curing agent, method of producing same, and thermosetting epoxy resin

#18
20170166709
2017-06-15

Microencapsulated aminosiloxanes for protective material formulations

#19
20170158886
2017-06-08

Self-healing coating

#20
20170100902
2017-04-13

NANOCOMPOSITE MICROCAPSULES FOR SELF-HEALING OF COMPOSITE ARTICLES

#21
20170066899
2017-03-09

Resin composition and cured product thereof

#22
20170066230
2017-03-09

Method for curing resin composition

#23
20170029674
2017-02-02

Sealant composition and method for curing the same, display device and sealing method, and use thereof

#24
20170029672
2017-02-02

Encapsulated catalyst for aerospace grade resin systems

#25
20160346753
2016-12-01

Process for preparation of self healing microcapsules

#26
20160340467
2016-11-24

Curing compositions

#27
20160208150
2016-07-21

Microcapsule type curable resin composition

#28
20160068726
2016-03-10

Adhesive composition and article including the same

#29
20150307649
2015-10-29

Synthesizing nanocapsules containing reactive amine

#30
20150231588
2015-08-20

MICROCAPSULES

#31
20140272287
2014-09-18

Energy curable sealants

#32
20120153230
2012-06-21

Method for producing latent curing agent

#33
20120119156
2012-05-17

Aluminum chelate latent curing agent

#34
20110213070
2011-09-01

Curing accelerator for epoxy resin composition, and one-pack type thermosetting epoxy resin composition

#35
20100243962
2010-09-30

Microencapsulated silane coupling agent

#36
20100143604
2010-06-10

Latent hardener, process for producing the same, and adhesive containing latent hardener

#37
20090264593
2009-10-22

Curing agents for epoxy resins

#38
20090261298
2009-10-22

High-stability microencapsulated hardened for epoxy resin and epoxy resin composition

#39
20090186962
2009-07-23

Microcapsule-based hardener for epoxy resin, masterbatch-based hardener composition for epoxy resin, one-part epoxy resin composition, and processed good

#40
20080319110
2008-12-25

Latent curing agent

#41
20070055039
2007-03-08

Latent curing agent and composition

#42
20070010636
2007-01-11

Latent hardener

#43
20060217499
2006-09-28

Liquid epoxy resin composition and semiconductor device

#44
20060128835
2006-06-15

Capsule type hardener and composition

#45
20050107494
2005-05-19

Latent hardener, process for producing the same, and adhesive containing latent hardener