High Performance Silicone-Epoxy Composition

TWO COMPONENT (2K) COMPOSITION BASED ON EPOXY (METH)ACRYLATE RESIN

PROTECTIVE FILM-FORMING COMPOSITION

THERMOSETTING MATERIAL FOR USE IN A 3D PRINTING PROCESS

THERMOSETTING MATERIAL FOR USE IN ADDITIVE MANUFACTURING

Additives for winterization of paraffin inhibitors

RESIN COMPOSITION FOR MOLDING AND ELECTRONIC COMPONENT APPARATUS

RECOVERY AND REUSE OF ACID DIGESTED AMINE/EPOXY-BASED COMPOSITE MATRICES

CURABLE RESIN COMPOSITION, DRY FILM AND CURED PRODUCT OF SAME, AND ELECTRONIC COMPONENT CONTAINING SAID CURED PRODUCT

CURABLE COMPOSITION, CURED PRODUCT, FIBER-REINFORCED COMPOSITE MATERIAL, AND MOLDED ARTICLE

SILICONE HYBRID RESIN COMPOSITION AND SEMICONDUCTOR DEVICE

Polymer, oxygen absorber using same, and curable composition

Thermally reworkable adhesives for electronic devices

BORON NITRIDE POWDER AND RESIN COMPOSITION

PREPARATION METHOD FOR EMULSIFIER, EMULSIFIER, AQUEOUS EPOXY RESIN DISPERSION AND FORMULATION METHOD

Additives for winterization of paraffin inhibitors

ROOM TEMPERATURE STABLE ONE-PART VOID FILLER

Mold release agent for metal casting, containing pinene epoxide and/or decene-1 oxide

Epoxy resin, epoxy resin composition, epoxy resin composition for carbon fiber-reinforced composite material, prepreg, and carbon fiber-reinforced composite material

Epoxy resin, epoxy resin composition, epoxy resin cured product and composite material

Image display device sealing material and image display device sealing sheet

Epoxy resin composition, thermally-conductive material precursor, B-stage sheet, prepreg, heat dissipation material, laminate, metal substrate, and printed circuit board

EPOXY RESIN COMPOSITION

POLYORGANOSILSESQUIOXANE, TRANSFER FILM, IN-MOLD MOLDED ARTICLE, AND HARD COAT FILM

Polymerizable composition and molded product

Epoxy resin composition

Epoxy resin, epoxy resin composition, epoxy resin cured product, and composite material

Antistatic material, method for producing same, and antistatic film

Manufacturing control systems and logic for prognosis of defects in composite materials

Sizing agent for carbon fibers, aqueous dispersion of sizing agent for carbon fibers, and sizing agent-adhered carbon fiber bundle

Curable resin composition and adhesive for bonding structural material using composition

Photosensitive composition, colored pattern and method for producing same

Latent curing agent, production method therefor, and thermosetting epoxy resin composition

Epoxy compound, curable composition, cured product, method of producing epoxy compound, and reactive diluent

Single-component thermosetting epoxy resin with improved adhesion

Anti-soiling compositions comprising silica nanoparticles and functional silane compounds and coated articles thereof

Fluxing underfill compositions

Thermally conductive material, resin composition, and device

Epoxy resin composition, epoxy resin cured product, prepreg and fiber-reinforced composite material

Epoxy resin composition, thermally-conductive material precursor, B-stage sheet, prepreg, heat dissipation material, laminate, metal substrate, and printed circuit board

Thermosetting alkoxysilyl compound having two or more alkoxysilyl groups, composition and cured product comprising same, use thereof, and method for preparing alkoxysilyl compound

Hard coating composition and flexible display device including the hard coating composition

Cyanate ester compound, curable resin composition containing the compound, and hardened product thereof

Cationically polymerizable resist underlayer film-forming composition

Composition for optical stereolithography and method for producing stereolithographic object using the same

Epoxy resin composition, prepreg, and carbon fiber-reinforced composite material

Polymerizable compound and optically anisotropic body

Epoxy resin composition for fiber-reinforced composite material, method for producing epoxy resin composition for fiber-reinforced composite material, prepreg, and honey-comb panel

Thermosetting resin composition

Photocurable and thermosetting resin composition, cured product, and laminate

Thermally expandable fire resistant resin composition

Toughening of epoxy thermosets

Polyurethane-modified epoxy resin, method for producing same, epoxy resin composition and cured product

Radiation-sensitive resin composition and electronic device

Curable composition, cured product thereof, and wafer level lens

Epoxy resin composition, and film, prepreg, and fiber-reinforced plastic using same

ALDEHYDE FREE THERMOSET BIORESINS AND BIOCOMPOSITES

Active energy ray-curable composition

Photosensitive epoxy resin composition, curable film for formation of optical waveguide core layer, and optical waveguide and optical/electrical transmission hybrid flexible printed wiring board produced by using the photosensitive epoxy resin composition or the curable film

Photosensitive epoxy resin composition for optical waveguide, curable film for formation of optical waveguide, and optical waveguide and optical/electrical transmission hybrid flexible printed wiring board produced by using the photosensitive epoxy resin composition, and optical waveguide production method

Polarizing plate and image display device including the same

Modified phenolic resin, method for producing modified phenolic resin, modified epoxy resin, method for producing modified epoxy resin, curable resin composition, cured product of same, and printed wiring board

EPOXY RESIN, CURABLE RESIN COMPOSITION, CURED PRODUCT THEREOF, AND PRINTED CIRCUIT BOARD

AMINE CURABLE EPOXY RESIN COMPOSITION

Epoxy elastomer compositions

Environmentally friendly water-based epoxy resin composition and a use therefor

Low coefficient of thermal expansion (CTE) thermosetting resins for integrated circuit applications

Low coefficient of thermal expansion (CTE) thermosetting resins for integrated circuit applications

Sheet molding compounds (SMC), thick molding compounds (TMC), and bulk molding compounds (BMC) comprising thermosetting resins based on renewable resources

INSULATING POLYMER MATERIAL COMPOSITION

INSULATING POLYMER MATERIAL COMPOSITION

Optical disc and ultraviolet-curable composition for optical disc

Epoxy resins with improved elasticity

Oxetane Compound and Curable Composition Containing the Same

Composition of epoxy resin, epoxy adduct, urea derivative thixotropic agent and curing agent

Photosensitive epoxy resin adhesive composition and use thereof

Photosensitive epoxy resin adhesive composition and use thereof

Low coefficient of thermal expansion (CTE) thermosetting resins for integrated circuit applications

Heat-curable eproxy resin composition

Cationic polymerizable composition, actinic ray curable ink-jet ink and stabilization method of the cationic polymerizable composition

Bio-based epoxy, their nanocomposites and methods for making those