C08G59/4207 - CPC Classification Index

ClassID:

99198 ⎘

C08G59/4207 - CPC Classification

Classification description:

Polycondensates containing more than one epoxy group per molecule ; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used; Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof aliphatic

Recent Application in this class:

20260152600

2026-06-04

HEAT-CURABLE COMPOSITION, CURED ARTICLE, ADHESIVE AGENT, AND HEAT-CURABLE COMPOSITION PRODUCTION METHOD

20260132244

2026-05-14

IMPROVEMENT OF VITRIMER BY POLYROTAXANE ADDITION

20250354037

2025-11-20

METHODS, SYSTEMS, DEVICES AND KITS FOR FORMULATING STRUCTURAL ADHESIVES

20250341050

2025-11-06

Bio-Based Artificial Leather and Method

20250199409

2025-06-19

RESIST UNDERLAYER FILM-FORMING COMPOSITION

20250197559

2025-06-19

OLIGOSILOXANE EPOXY COVALENT ADAPTABLE NETWORKS

20250197558

2025-06-19

PROTECTIVE-FILM FORMING COMPOSITION

20250155813

2025-05-15

PROTECTIVE FILM FORMING COMPOSITION

20250011524

2025-01-09

BRANCHED ACRYLATE FUNCTIONAL OLIGOMERS

#10

20240254280

2024-08-01

PLANT-BASED SUPPLE AND DURABLE TOPCOATS

#11

20230331905

2023-10-19

BIOBASED CURING AGENTS FOR EPOXY RESINS

#12

20230103242

2023-03-30

METHOD FOR PRODUCING POLYMER

#13

20230067778

2023-03-02

EPOXY-DERIVED COVALENT ADAPTABLE NETWORKS AND METHODS OF THEIR PRODUCTION

#14

20230029997

2023-02-02

COMPOSITION FOR FORMING RESIST UNDERLAYER FILM

#15

20220356298

2022-11-10

Room temperature ionic liquid curing agent

#16

20220251286

2022-08-11

Curing composition

#17

20220228015

2022-07-21

Conductive paste composition

#18

20220145119

2022-05-12

CHEMICAL SOLUTION-RESISTANT PROTECTIVE FILM FORMING COMPOSITION CONTAINING POLYMERIZATION PRODUCT HAVING DIOL STRUCTURE AT TERMINAL THEREOF

#19

20210311396

2021-10-07

RESIST UNDERLAYER FILM-FORMING COMPOSITION

#20

20210261720

2021-08-26

CURING AGENT FOR CURING A RESIN

#21

20210171703

2021-06-10

Insulation product comprising mineral fibers and a binder

#22

20190390079

2019-12-26

Epoxy Compositions and Methods of Use

#23

20190330412

2019-10-31

ROOM TEMPERATURE IONIC LIQUID CURING AGENT

#24

20190315911

2019-10-17

Fire retardant compositions

#25

20190248952

2019-08-15

Highly functional epoxidized resins and coatings

#26

20180244834

2018-08-30

Bio-based thermosets

#27

20170240811

2017-08-24

Stimuli-responsive liquid crystalline networks

#28

20170037238

2017-02-09

HEAT-CURABLE EPOXY RESIN COMPOSITION

#29

20160289491

2016-10-06

3D printable liquid crystalline elastomers with tunable shape memory behavior and bio-derived renditions

#30

20160215088

2016-07-28

ALDEHYDE FREE THERMOSET BIORESINS AND BIOCOMPOSITES

#31

20160096916

2016-04-07

Highly functional epoxidized resins and coatings

#32

20160017087

2016-01-21

Epoxide-based composition

#33

20150348859

2015-12-03

Underfill material and method for manufacturing semiconductor device using the same

#34

20150322197

2015-11-12

LATENT CATALYTIC CURING AGENT

#35

20140336301

2014-11-13

Highly functional epoxidized resins and coatings

#36

20120193015

2012-08-02

Specular coatings for composite structures

#37

20120156502

2012-06-21

ADHESIVE FILM, MULTILAYER CIRCUIT BOARD, ELECTRONIC COMPONENT AND SEMICONDUCTOR DEVICE

#38

20120041124

2012-02-16

Composite repair resins containing minimal hazardous air pollutants and volatile organic compound

#39

20110319524

2011-12-29

Epoxy acid thermoset resins and composites that can be hot-fashioned and recycled

#40

20110257320

2011-10-20

Composite repair resins containing minimal hazardous air pollutants and volatile organic compound

#41

20100227981

2010-09-09

EPOXIDE-BASED COMPOSITION

#42

20100216965

2010-08-26

THERMOPLASTIC NANOPARTICLES, METHOD FOR PRODUCTION AND USE THEREOF

#43

20090078164

2009-03-26

Use of epoxy derivatives as additives for cementitious building materials

#44

20080268379

2008-10-30

Anti-reflective coating forming composition for lithography containing polymer having ethylenedicarbonyl structure

#45

20080191347

2008-08-14

CONDUCTIVE BALL-OR PIN-MOUNTED SEMICONDUCTOR PACKAGING SUBSTRATE, METHOD FOR MANUFACTURING THE SAME AND CONDUCTIVE BONDING MATERIAL

#46

20080152935

2008-06-26

BARRIER COATINGS

#47

20080139758

2008-06-12

Polymerizable composition

#48

20070287787

2007-12-13

Hybrid Adhesive

#49

20070141507

2007-06-21

Curable polyester having an oxetanyl group at end and process for preparing the same, resist composition, jet printing ink composition, curing methods and uses thereof

#50